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Электронный компонент: AD8333

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a
LF 50 MHz
Dual I/Q Demodulator and Phase Shifter
P
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AD8333


REV. PrB 4/29/2005
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective companies.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.326.8703
2005 Analog Devices, Inc. All rights reserved.
FEATURES
Dual Integrated I/Q Demodulator
16 Phase Select on each Output (22.5
per step)
Quadrature Demodulation Accuracy
Phase
Accuracy
0.5
Amplitude
Balance
0.1 dB
Bandwidth
4LO: LF 200 MHz; RF: LF - 50 MHz
Baseband: determined by external filtering
Output Dynamic Range 161 dB/Hz
LO Drive > 0 dBm (50
); 4 LO>1MHz
Supply:
5 V
Power Consumption 190 mW/channel (380 mW total)
Power Down
APPLICATIONS
Medical Imaging (CW Ultrasound Beamforming)
Phased Array Systems
Radar
Adaptive
Antennas
Communication Receivers
GENERAL DESCRIPTION
The AD8333 is a dual base-band phase shifter and I/Q
demodulator. It is the worlds first solid state device suitable for
beamformer circuits, such as used in high-performance medical
ultrasound equipment featuring CW Doppler. The RF inputs
have been designed to interface directly with the differential
outputs of dual-channel low-noise pre-amplifiers as in the
AD8332 VGA. A divide-by-four circuit divides the 4
x
local
oscillator (LO) input signal and generates the 0 and 90 phases
of the LO that drive the mixers of a pair of well-matched I/Q
demodulators.
A major application is in medical ultrasound imaging,
particularly continuous wave (CW) analog beamforming. The
AD8333 enables coherent summing and phase alignment of
multiple input channels. A reset pin synchronizes an array of
AD8333s so that they start in the same quadrant. Sixteen
discrete phase rotations in 22.5 increments can be selected
independently for each channel. For example, if CH1 is used as
a reference and CH2 has an I/Q phase lead of 45, then by
choosing the correct code one can phase align CH2 with CH1.
The I and Q mixer outputs are provided as currents to facilitate
summation. The summed current outputs are converted to voltages by
a high dynamic-range current-to-voltage (I-V) converter, such as an
AD8021, configured as a transimpedance amplifier. The resultant
signal is then applied to a high resolution AD converter (ADC) such
as the AD7665 (16b/570 ksps).
FUNCTIONAL BLOCK DIAGRAM
CH1
PHASE
SELECT
I1
4
2
90
0
Q1
90
0
I2
2
Q2
2
2
CH2
PHASE
SELECT
CH1
RF
+
-
CH2
RF
+
-
LOC
OSC
4
2
2
2
2
AD8333
Figure 1.
The two I/Q demodulators can also be used independently in
other non-beamforming applications. In that case a
transimpedance amplifier is needed for each of the I and Q
outputs - four in total for the dual I/Q demodulator.
The dynamic range is 161 dB/Hz at the I and Q outputs, but the
following transimpedance amplifier is an important element in
maintaining the overall dynamic range and attention needs to
be paid to optimal component selection and design.
The AD8333 is available in a 32 pin LFCSP (5x5 mm) package for
the industrial temperature range of -40 C to +85 C.
AD8333 P
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Rev. PrB
Page 2 of 14
TABLE OF CONTENTS
AD8333--Advance Specifications.................................................. 3
Absolute Maximum Ratings............................................................ 5
Pin Configuration and Functional Descriptions.......................... 6
Device Input Equivalent Circuits ................................................... 7
Theory of operation ......................................................................... 8
Overview........................................................................................ 8
Quadrature Generation ............................................................... 8
I/Q Demodulators and Phase Shifters........................................8
Logic Interfaces..............................................................................8
Dynamic Range and Noise...........................................................9
Bypassing Current Mirror and Decreasing Noise.................. 10
Applications..................................................................................... 11
Outline Dimensions ....................................................................... 14

REVISION HISTORY
Rev. PrA:
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AD8333
Rev. PrB
Page 3 of 14
AD8333--ADVANCE SPECIFICATIONS
Table 1. V
S
= 5 V, T
A
= 25C, 4f
LO
= 20 MHz, f
RF
= 5.01 MHz, f
BB
= 10 kHz, P
LO
-10 dBm, per channel performance, dBm (50
)
unless otherwise noted.
Parameter Conditions
Min
Typ
Max
Unit
OPERATING CONDITIONS
LO Frequency Range
4x internal LO at pins 4LOP and 4LON
LF
200
MHz
RF Frequency Range
Mixing
LF
50
MHz
Baseband Bandwidth
Limited by external filtering
LF
50
MHz
LO Input Level
-10
13
dBm
V
SUPPLY
(V
S
)
TBD
5
TBD V
Temperature Range
-40
+85
C
DEMODULATOR PERFORMANCE
Input Impedance
RF - Differential
11||TBD
k
||pF
LO Differential
TBD||TBD
k
||pF
Transconductance
Demodulated I
OUT
/V
IN
, each Ix or Qx output after
low pass filtering measured from RF inputs
All
phases
2.17
mS
Dynamic Range
IP1dB Input Referred Noise (dBm)
161
dB/Hz
Max RF Input Swing
Differential; Inputs biased at 2.5V; Pins RFxP,
RFxN
2.8 Vpp
Peak Output Current (no filtering)
PHx0=PHx1=0 --> 0
Phase Shift
4.7
mA
PHx0=PHx1=1 --> 45
Phase Shift
6.6
mA
Input P1dB
Ref = 50
14.5 dBm
Ref = 1V
RMS
1.5
dBV
Third Order Intermodulation (IM3)
f
RF1
= 5.010 MHz, f
RF2
= 5.015 MHz, f
LO
= 5.023MHz
Equal Input Levels
Baseband Tones = -7dBm @ 8kHz and 13 kHz
-75
dBc
Unequal Input Levels
Baseband Tones: -1dBm @ 8kHz and -31dBm @
13 kHz
TBD dBc
Third Order Output Intercept (OIP3)
Same conditions as equal level IM3
30
dBm
LO Leakage
Measured at RF Inputs, worst phase, measured
into 50
<-100
dBm
Measured at Baseband Outputs, worst phase,
8021 disabled, measured into 50
-60 dBm
Conversion Gain
Measured with Test Circuit 1; all codes
4.7
dB
Input Referred Noise
Output Noise from Test Circuit 1/Conversion
Gain
11 nV/Hz
Noise Figure
With AD8332 LNA, R
S
= 50
, R
FB
=
TBD dB
R
S
= 50
, R
FB
= 275
TBD dB
R
S
= 50
, R
FB
= 1.1k
TBD dB
AD8333 only; R
S
= 50
, no termination on RFxP,
RFxN
TBD dB
Bias Current
Pins 4LOP, 4LON
TBD
A
Pins RFxP, RFxN
TBD
A
LO Voltage Range
Pins 4LOP, 4LON (each pin)
TBD
TBD
V
RF Common Mode Voltage
For maximum differential swing; Pins RFxP, RFxN
2.5
V
Output Compliance Range
Pins IxPO, QxPO
TBD
TBD
V
PHASE ROTATION PERFORMANCE
One CH is reference, other is stepped
Phase Increment
16 Phase Steps per Channel
22.5
Quadrature Phase Error
I1 to I2 and I2 to Q2
0.5
I/Q Amplitude Imbalance
I1 to I2 and I2 to Q2
0.1
dB
Channel-to-Channel Matching
Phase Match I1/I2 and Q1/Q2
1
Phase Match I1/I2 and Q1/Q2; -40
C < T
A
< 85
C
TBD
TBD
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Page 4 of 14
Parameter Conditions
Min
Typ
Max
Unit
Amplitude Match I1/I2 and Q1/Q2
0.5
dB
Amplitude Match I1/I2 and Q1/Q2; -40
C < T
A
<
85
C
TBD
TBD dB
LOGIC INTERFACES
Pins PHxx, RSET and ENBL
Logic Level High
TBD
TBD
V
Logic Level Low
TBD
TBD
V
Bias Current
Logic High
TBD
A
Logic
Low
TBD
A
Input Resistance
Pins PHxx and ENBL
TBD
k
Pin
RSET
TBD
k
Reset Setup Time
Reset is asynchronous
TBD
ns
Reset Response Time
TBD
s
Phase Response Time
TBD
s
Enable Response Time
TBD
s
POWER SUPPLY
Pins VPOS,VNEG
Supply Voltage
5
V
Quiescent Current
VPOS, PHx0=PHx1=0
TBD
44
TBD
mA
VNEG,
PHx0=PHx1=0
TBD
21
TBD
mA
Over Temperature
-40
C < T
A
< 85
C
TBD
TBD mA
Quiescent Power
Per Channel (PHx0=PHx1=0)
170
mW
Per Channel (PHx0=0, PHx1=1)
190
mW
Disable Current
All Channels Disabled
TBD
A
PSRR
VPOS to Ix/Qx outputs (meas. @ AD8021 output)
TBD
dB
VNEG to Ix/Qx outputs (meas. @ AD8021 output)
TBD
dB
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Rev PrB
Page 5 of 14
ABSOLUTE MAXIMUM RATINGS

Table 2. AD8333 Absolute Maximum Ratings
Parameter Rating
Voltage s
Supply Voltage V
S
6V
RF Pin Inputs
TBD V
LO Inputs
TBD V
Code select InputsV
TBDV
Thermal Data (No Airflow)
JA
41.0
C/W
JB
23.6
C/W
JC
4.4
C/W
JT
0.4
C/W
JB
22.4
C/W
Maximum Junction Temperature
TBD
C
Operating Temperature Range
40
C to +85C
Storage Temperature Range
65
C to +150C
Lead Temperature Range (Soldering 60 sec)
300C

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
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Rev PrB
Page 6 of 14
PIN CONFIGURATION AND FUNCTIONAL DESCRIPTIONS
VP
OS
RF2
P
PH2
1
PH2
0
PH1
0
PH1
1
VP
O
S
RF1P
I2NO
ENB
L
RF1N
I1
N
O
RF2N
VP
OS
R
SET
VP
O
S
Figure 2. 32-Lead LFCSP
Table 3. Pin Function Descriptions
Pin No.
Mnemonic
Function
Equiv.
Circ.
1, 2, 7, 8
PH12, PH13
PH22, PH23
Quadrant Select LSB,MSB. Binary Code. These logic inputs select the quadrant: 0-90, 90-180, 180-270,
270-360
. See table in Theory of Operation section. Logic threshold is at about 1.5V and therefore can
be driven by 3V CMOS logic.
A
3, 20
COMM
Ground. These two pins are internally tied together.
4, 5
4LOP, 4LON
LO Inputs. No internal bias, therefore these pins need to be biased by external circuitry. For optimum
performance these inputs should be driven differentially with a signal level that is not less than shown
in figure 25B, minimum LO level vs RF. Bias current is only 3
A. Single ended drive is also possible if
the inputs are biased correctly.
B
6 LODC Decoupling pin for LO. A 0.1
F capacitor should be connected between this pin and ground.
C
9, 10,
31, 32
PH20, PH21
PH10, PH11
Phase Select LSB,MSB. Binary Code. These logic inputs select the phase for a given quadrant: 0, 22.5, 45,
67.5
. See table in Theory of Operation section. Logic threshold is at about 1.5V and therefore can be
driven by 3V CMOS logic.
A
11, 14,
27, 30
VPOS
Positive Supply. These pins should be decoupled with a ferrite bead in series with the supply, plus a 0.1
F and 100 pF capacitor between the VPOS pins and ground. Since the VPOS pins are internally
connected, one set of supply decoupling components for all four pins should be sufficient.
12, 13,
28, 29
RF2P, RF2N
RF1P, RF1N
RF Inputs. These pins are biased internally, however it is recommended that they are biased by dc
coupling to the output pins of the AD8332 LNA. The optimum common mode voltage for maximum
symmetrical input differential swing is 2.5V if
5V.supplies are used.
D
15 RSET
Reset for divide-by-four in LO interface. Logic threshold is at about 1.5V and therefore can be driven by
3V CMOS logic.
A
16, 19,
22, 25
I2NO, Q2NO
I1NO, Q1NO
Negative I/Q outputs. These outputs are not connected for normal usage, but can be used for filtering
if needed. Together with the positive I/Q outputs, they allow bypassing the internal current mirror if a
lower noise output circuit is available; VNEG needs to be tied to GND to disable the current mirror.
E
17, 18,
23, 24
I2PO, Q2PO
I1PO, Q1PO
Positive I/Q Outputs. These are the outputs which provide a bidirectional current that can be
converted back to a voltage via a trans-impedance amplifier. Multiple outputs can be summed
together by simply connecting them together. The bias voltage should be set to 0V or less by the
transimpedance amplifier.
E
21 VNEG
Negative Supply. This pin should be decoupled with a ferrite bead in series with the supply, plus a 0.1
F and 100 pF capacitor between the pin and ground.
26
ENBL
Chip Enable. Logic threshold is at about 1.5V and therefore can be driven by 3V CMOS logic.
A
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Page 7 of 14
Device Input Equivalent Circuits
Figure 3. Logic Inputs
VPOS
COMM
4LOP
4LON
Figure 4. Local Oscillator Inputs
Figure 5. Circuit C
VPOS
COMM
RFxP
RFxN
Figure 6. RF Inputs
VNEG
COMM
IxNO
QxNO
IxPO
QxPO
Figure 7. Output Drivers
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Rev PrB
Page 8 of 14
THEORY OF OPERATION
OVERVIEW
The AD8333 is a dual I/Q demodulator with programmable
phase shifter for each channel. The primary applications are:
phased array beamforming in medical ultrasound; phased array
radar; smart antennas for mobile communications. The part
could also be used in applications that require two well matched
I/Q demodulators.
Figure 8 shows the basic block diagram and the pinout of the
AD8333. The device requires only 3 inputs: a Local Oscillator
(LO) signal common to both channels and RF sources for
channels 1 and 2. Each channel features independent phase
delay circuitry; there are 16 states/360 degrees (or 22.5/step).
selectable with the PHx0-PHx3 logic inputs.
PH2
1
PH2
0
RF2N
VP
OS
VP
OS
I2NO
R
SET
RF2
P
VPOS
VPOS
RF
I
N
RF
I
P
PH
10
EN
BL
PH
11
I1NO
Figure 8 Block diagram and pinout
The outputs are in current form to allow for easy summation in
beamforming applications. Multiple channels can be summed
and then need to be converted to a voltage using a
transimpedance amplifier. Of course, the channels can also be
used individually.
QUADRATURE GENERATION
The internal 0 and 90 LO phases are digitally generated by a
divide-by-4 logic circuit. The divider is dc coupled and
inherently broadband, its maximum LO frequency limited only
by its switching speed. The duty cycle of the quadrature LO
signals is always 50% and is not affected by asymmetry of the
externally connected 4xLO input. Furthermore, the divider is
implemented such that the 4xLO signal re-clocks the final flip-
flops that generate the internal LO signals and thereby
minimizes noise introduced by the divide circuitry. For
optimum performance, the LO input is driven differentially, but
can be driven single-ended if desired; a good choice for drive is
LVDS. The common-mode range on each pin is approximately
0.5 to 3.3 V with nominal 5 V supplies.
The minimum LO level is frequency dependent (refer to Figure
25B). For the best noise performance it is of great importance to
insure that the LO source has very low phase noise (jitter) and
adequate input level to assure stable mixer-core switching.
Because in a beamforming application many channels are
coherently summed and the coherence depends on an accurate
phase relationship between channels, a reset pin (RSET) is
provided to help synchronize the divide-by-4s in different
AD8333s. The RSET pin resets the counters to a known state,
without it, when multiple AD8333s are powered up, the LO
dividers might come up in different quadrants which can cause
a 90, 180, or 270 degree phase error relative to another part. It
is therefore important to reset the dividers when using more
than one AD8333.
I/Q DEMODULATORS AND PHASE SHIFTERS
The I/Q demodulators consist of double-balanced Gilbert cell
mixers. The RF input signals are converted into currents by
transconductance stages that have a maximum differential input
signal capability of 2.8 Vpp. These currents are then presented
to the mixers which convert them to baseband: RF-LO and
RF+LO. Following down-conversion the signals are phase
shifted according to the code applied to the PHx0-PHx3 pins
(see Table 4). After the phase shifters, the differential current
signal is converted from differential to single-ended via a
current mirror. The single-ended outputs (I1PO, I2PO, Q1PO,
Q2PO) can then be converted back to a voltage via a
transimpedance amplifier as done on the evaluation board.
PHx3 PHx2 PHx1 PHx0
-Shift
0 0 0 0 0
0 0 0 1 22.5
0 0 1 0 45
0 0 1 1 67.5
0 1 0 0 90
0 1 0 1 112.5
0 1 1 0 135
0 1 1 1 157.5
1 0 0 0 180
1 0 0 1 202.5
1 0 1 0 225
1 0 1 1 247.5
1 1 0 0 270
1 1 0 1 292.5
1 1 1 0 315
1 1 1 1 337.5
Table 4 .Phase Shift of Channel-to-Channel with one Channel as Reference
LOGIC INTERFACES
The logic interfaces, PHxx, ENBL and RSET all have a threshold
of VPOS*0.3. This means that in the case of a 5V supply, the
threshold will be at about 1.5V; there is some built in hysteresis
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Rev PrB
Page 9 of 14
around this value.
DYNAMIC RANGE AND NOISE
Figure 9 is a block diagram showing external connections to the
AD8333. Typically the RF inputs are driven from a very low
noise amplifier like the LNA in the AD8332 family or the
preamplifier in the AD8335. Note also that in this diagram the
outputs for the two channels are shown connected (summed),
this improves the dynamic range by 3 dB assuming that the
noise sources of the two channels are uncorrelated. In general
the dynamic range improvement is 10*log10(N) where N is the
number of channels that are summed together.
To ensure that the dynamic range is reduced as little as possible,
it is important that the amplifier that drives the AD8333 is
carefully selected. The input referred noise per channel of the
AD8333 is about 9 nV/Hz; if the noise of the AD8333 should
only degrade the overall noise figure (NF) by about 1 dB then
the noise of the source and the LNA should be about twice that
value at 18 nV/Hz. If the noise of the circuitry before the
AD8333 is lower than that then the NF degrades more than 1
dB, for example, if the noise is equal at 9 nV/Hz then there will
be a 3 dB degradation; if it is 1.3 times as big (about 11.7
nV/Hz) then there will be a 2 dB degradation; at 1.45 times as
large (13.1 nV/Hz) it would be a 1.5 dB degradation.
To determine the input referred noise it is important to know
the active LPF (low pass filter) values, shown in Figure 47 as
R
FILT
and C
FILT
. On the AD8333 evaluation board they are 787
and 2.2 nF respectively, implementing a 90 kHz single pole LPF.
If the RF and LO are offset by 10 kHz, then the demodulated
signal will be 10 kHz; the mixing gain after low pass filtering,
from one of the RF inputs to the AD8021 output when
measuring a single output only (i.e. I1, Q1, etc.) is
approximately 1.7
x
(4.7dB). This together with the 9 nV/Hz
AD8333 noise results in about 15.3 nV/Hz at the AD8021
output. Since the AD8021, including the 787 feedback
resistor, contributes another 4.4 nV/Hz, the total output
referred noise will be about 16 nV/Hz. This value can be
adjusted by increasing the filter resistor, thereby increasing the
gain
CH1
PHASE
SELECT
I1
4
2
90
0
Q1
90
0
I2
2
Q2
2
2
CH2
PHASE
SELECT
CH1
RF
+
-
4
TRANSMITTER
4
2
2
2
2
CLOCK
GENERATOR
2
T/R
SW
R
FB
AD8332 OR
AD8335 LNA
CH2
RF
+
-
TRANSMITTER
T/R
SW
R
FB
+
-
+
-
AD8021
Q DATA
I DATA
AD7665 OR
AD7686
ADC 16B/
570KSPS
ADC 16B/
570KSPS
C
FILT
R
FILT
AD8333
AD8332 OR
AD8335 LNA
Figure 9. Connection Block Diagram







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Page 10 of 14
BYPASSING CURRENT MIRROR AND DECREASING
NOISE
The noise contribution of the AD8333 can be reduced if the
current mirrors that convert the internal differential signals to
single-ended are bypassed (see Figure 10). Current mirrors
interface to the AD8021 current-to-voltage (I-V) converters
shown in Figure 9, and provide low-pass filtering. The
AD8021s force the AD8333 output voltage to 0V, and process
the bipolar output current, however the mirrors introduce a
significant amount of noise. This noise may be reduced if they
are bypassed and externally biased.
The mirrors are disabled by connecting VNEG to ground, and
providing external bias networks as shown in Figure 10. The
larger the drop across the resistors, the less noise they will
contribute to the output, however the voltage on the IxxO and
QxxO nodes cannot exceed +0.5 V. Voltages exceeding
approximately 0.7 V will turn on the PNP devices, and forward
bias the ESD protection diodes. Inductors provide an alternative
to resistors, enabling reduced static power by eliminating the
power dissipation in the bias resistors. With inductors the main
limitation might be low frequency operation, as is the case in
CW Doppler in ultrasound where the frequency range of
interest goes from a few hundred Hertz to about 30 kHz. In
addition it is still important to provide enough gain through the
I-V circuitry to ensure that the bias resistor and I-V converter
noise does not contribute significantly to the noise from the
AD8333 outputs.
As should be obvious from Figure 10, the main disadvantage of
the external bias approach is that now two I-V amplifiers are
needed because of the differential output. For beamforming
applications the outputs would still be summed as before but
now there are twice the number of lines. Only two bias resistors
are needed for all outputs that are connected together. The
resistors would be scaled by dividing the value of a single output
bias resistor through N the number of channels connected in
parallel. The bias current depends on the phase selected: for
phase 0 this is about 2.5 mA per side, while in the case of 45
this is about 3.5 mA per side. The bias resistors should therefore
be chosen based on the larger bias current value of 3.5 mA and
the chosen VNEG. VNEG should be at least -5 V, and may be
larger for additional noise reduction.
Figure 10 Bypassing the Internal Current Mirrors
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Page 11 of 14
APPLICATIONS
The AD8333 is the key component of a phase-shifter system
used to align time-skewed information contained in RF signals.
It is important to consider the many I/O options necessary to
perform it's intended function.
Figure 11 shows the basic connections. For maximum input
swing, the RF inputs (pins 12,13,28 and 29) are dc coupled to
the differential output of the LNA section of the AD8331/2
series of Variable Gain Amplifiers.
Figure 12 and Figure 13 show the Evaluation Board schematic;
it includes the AD8332 to allow tests either directly as one
would use it in an actual application or by applying signals via
connectors directly to the RF inputs. For best performance it is
recommended that the RF inputs are driven differentially.
Although the 4
x
LO input can be driven single-ended,
differential is recommended. The 4
x
LO inputs require very low
bias currents and can be supplied by a multi-drop LVDS driver,
or LV-PECL, or any other high speed differential signal that
stays within the common-mode range of the inputs (0.5 to 3.3
V).

PH
21
PH
20
RF2
N
VPO
S
VPO
S
I2NO
R
SET
RF2
P
VP
OS
VP
OS
RFIN
RFIP
PH
10
EN
BL
PH
11
I1
NIO
Figure 11. AD8333 Basic Connections


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Page 12 of 14
U1
AD8332
C9
0.1 F
C11
0.1 F
C7
0.1 F
C16
0.1 F
C4
0.1 F
C8
0.1 F
C42
0.1 F
+5V
SW4
W6
IN2
W8
W5
C12
0.1 F
C43
1 nF
C13
0.1 F
W2
C3
22 pF
L2
120 nH FB
C40
.018 F
R10
274
R9
274
R6
100
R7
100
R5
100
R8
100
R3
20
R4
20
C6
0.1 F
L5 120
nH FB
29
30
31
32
28
25
26
27
COM1
LOP1
VIP
1
VI
N1
E
NBL
VC
M
1
ENBV
HILO
LMD2
LON2
VPS2
INH2
LMD1
LON1
VPS1
INH1
8
7
6
5
1
4
3
2
COMM
VOL2
VOH2
VOH1
VOL1
NC
VPSV
COMM
20
17
18
19
21
22
23
24
14
13
9
12
11
10
15
16
VI
P
2
VI
N2
LOP2
CO
M
2
RCLMP
VCM
2
MO
DE
GA
I
N
C19
.018 F
C1
0.1 F
C5
0.1 F
IN1
L1
120 nH FB
C2
22 pF
VPS
R1
20
W7
R2
20
VPS
VPS
R12
40.2k
R11
10k
SW2
SW3
RFP2
RFN2
RFP1
RFN1
W1
C14
0.1 F






Figure 12. AD8333 Eval Board Schematic- LNA

P
RELIMINARY
T
ECHNICAL
D
ATA
AD8333
Rev PrB
Page 13 of 14
PH
20
RF2
N
VP
O
S
VP
O
S
RS
ET
RF2
P
VPOS
VPOS
RFIN
RFIP
PH
10
E
NBL
Figure 13. Eval Board Schematic - AD8333
AD8333 P
RELIMINARY
T
ECHNICAL
D
ATA
Rev. PrB
Page 14 of 14
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12 MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
BOTTOM
VIEW
0.50
0.40
0.30
3.50 REF
0.50
BSC
3.25
3.10 SQ
2.95
0.60 MAX
0.60 MAX
0.25 MIN
TOP
VIEW
PIN 1
INDICATOR
PIN 1
INDICATOR
5.00
BSC SQ
4.75
BSC SQ
Figure. 32-32-Lead Frame Chip Scale Package [LFCSP] (CP-32)--Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD8333ACPZ-REEL
-40C to +85C
32-Lead Chip Scale
AD8333ACPZ-REEL7
-40C to +85C
32-Lead Chip Scale
AD8333-WP
-40C to +85C
32-Lead Chip Scale
AD8333-EVAL
PR05543-0-4/05(PrB)