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Электронный компонент: ADP3153

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REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
a
ADP3153
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
World Wide Web Site: http://www.analog.com
Fax: 781/326-8703
Analog Devices, Inc., 1998
5-Bit Programmable Dual
Power Supply Controller
for Pentium
II Processor
FEATURES
5-Bit Digitally Programmable 1.8 V to 3.5 V Output
Voltage
Dual N-Channel Synchronous Driver
Total Output Accuracy 1% (0 C to +70 C)
High Efficiency
Current-Mode Operation
Short Circuit Protection
Power Good Output
Overvoltage Protection Crowbar
On-Board Linear Regulator Controller
VRM 8.2 Compatible
Narrow Body TSSOP 20-Lead Package
APPLICATIONS
Desktop PC Power Supply for:
Pentium II Processor
Deschutes Processor
Pentium Pro Processor
Pentium Processor
AMDK6 Processor
VRM Modules
GENERAL DESCRIPTION
The ADP3153 is a highly efficient synchronous switching regu-
lator controller and a linear regulator controller. The switching
regulator controller is optimized for Pentium II and Deschutes
Processor applications where 5 V is stepped down to a digitally
controlled output voltage between 1.8 V and 3.5 V. Using a 5-bit
DAC to read a voltage identification (VID) code directly from
the processor, the ADP3153 uses a current mode constant off-
time architecture to generate its precise output voltage.
The ADP3153 drives two N-channel MOSFETS in a synchro-
nous rectified buck converter, at a maximum switching fre-
quency of 250 kHz. Using the recommended loop compensation
and guidelines, the ADP3153 provides a dc/dc converter that
meets Intel's stringent transient specifications with a minimum
number of output capacitors and smallest footprint. Addition-
ally, the current mode architecture also provides guaranteed
short circuit protection and adjustable current limiting.
The ADP3153's linear regulator controller drives an external
N-channel device. The output voltage is set by the ratio of the
external feedback resistors. The controller has been designed for
excellent load transient response.
V
CC
+12V
1 F
22 F
R1
R2
150pF
5-BIT CODE
IRL3103
V
IN
+5V
+
C
IN
10BQ015
L
2.5 H
IRL3103
+
C
O
V
O
1.8V3.5V
14A
R
SENSE
7m
1nF
C
COMP
V
CC
SD
DRIVE1
SENSE+
SENSE
DRIVE2
PGND
VID0VID4
AGND
C
T
CMP
ADP3153
35k
FB
20k
VLDO
V
IN
+5V
1000 F
V
O2
+3.3V
1A
IRL2703
Figure 1. Typical Application
Pentium is a registered trademark of Intel Corporation.
All other trademarks are the property of their respective holders.
2
REV. 0
ADP3153SPECIFICATIONS
(0 C
T
A
+70 C, V
CC
= 12 V, V
IN
= 5 V, unless otherwise noted)
Parameter
Symbol
Conditions
Min
Typ
Max
Units
OUTPUT ACCURACY
1.8 V Output Voltage
V
O
With Respect to Nominal
1.0
1.0
%
2.8 V Output Voltage
Output Voltage (Figure 1)
1.0
1.0
%
3.5 V Output Voltage
1.0
1.0
%
OUTPUT VOLTAGE LINE
V
O
I
LOAD
= 10 A (Figure 2)
REGULATION
V
IN
= 4.75 V to 5.25 V
0.05
%
OUTPUT VOLTAGE LOAD
V
O
(Figure 2)
REGULATION
200 mA < I
LOAD
< 14 A
0.1
%
INPUT DC SUPPLY CURRENT
1
Normal Mode
I
Q
V
SD
= 0.8 V
4.1
5.5
mA
Shutdown
T
A
= +25
C, VSD = 2.0 V
140
250
A
CURRENT SENSE THRESHOLD
VOLTAGE
V
11
V
10
V
10
Forced to V
OUT
3%
125
145
165
mV
VID PINS THRESHOLD
V
20
, V
1
V
4
Low
0.6
V
High
2.0
V
VID PINS INPUT CURRENT
I
20
,
I
1
I
4
VID
= 0 V
110
220
A
VID0VID4 PULL-UP RESISTANCE
R
VID
20
30
k
C
T
PIN DISCHARGE CURRENT
I
12
T
A
= +25
C
V
OUT
in Regulation
65
A
V
OUT
= 0 V
2
10
A
OFFTIME
t
OFF
C
T
= 150 pF
1.8
2.45
3.2
s
DRIVER OUTPUT TRANSITION
t
R
, t
F
C
L
= 7000 pF (Pins 16, 17)
TIMES
T
A
= +25
C
120
200
ns
POSITIVE POWER GOOD TRIP POINT
V
PWRGD
% Above Output Voltage
5
8
%
NEGATIVE POWER GOOD TRIP POINT
V
PWRGD
% Below Output Voltage
8
5
%
POWER GOOD RESPONSE TIME
t
PWRGD
500
s
CROWBAR TRIP POINT
V
CROWBAR
% Above Output Voltage
9
15
24
%
ERROR AMPLIFIER OUTPUT
IMPEDANCE
RO
ERR
145
k
ERROR AMPLIFIER
TRANSCONDUCTANCE
GM
ERR
2.2
mmho
ERROR AMPLIFIER MINIMUM
OUTPUT VOLTAGE
V
CMPMIN
V
10
Forced to V
OUT
+ 3%
0.8
V
ERROR AMPLIFIER MAXIMUM
OUTPUT VOLTAGE
V
CMPMAX
V
10
Forced to V
OUT
3%
2.4
V
ERROR AMPLIFIER BANDWIDTH 3 dB
BW
ERR
CMP = Open
500
kHz
LINEAR REGULATOR FEEDBACK
CURRENT
I
FB
0.35
1
A
LINEAR REGULATOR OUTPUT
Figure 2
VOLTAGE
2
V
O2
R
PROG
= 35K, R3 = 20K, I
O2
= 1 A
3.24
3.30
3.38
V
SHUTDOWN (SD) PIN
Low Threshold
SD
L
Part Active
0.6
V
High Threshold
SD
H
Part in Shutdown
2.0
V
Input Current
SD
IB
10
A
NOTES
1
Dynamic supply current is higher due to the gate charge being delivered to the external MOSFETS.
2
The LDO is tested in a V
OUT
= 3.3 V configuration with the circuit shown in Figure 2. By selecting a different R
PROG
value, any output voltage above 1.20 V can
be set.
All limits at temperature extremes are guaranteed via correlation using standard quality control methods.
Specifications are subject to change without notice.
ADP3153
3
REV. 0
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADP3153 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
PIN FUNCTION DESCRIPTIONS
Pin
Mnemonic
Function
14, 20
VID1VID4,
Voltage Identification DAC Input Pins. These pins are internally pulled up to V
REG
providing a
VID0
logic high if left open. The DAC output range is 600 mV to 1.167 V. Leaving all five DAC
inputs open results in placing the ADP3153 into shutdown.
5
AGND
Analog Ground Pin. This pin must be routed separately to the () terminal of C
OUT
.
6
SD
Shutdown Pin. A logic high will place the ADP3153 in shutdown and disable both outputs. This
pin is internally pulled down.
7
FB
This pin is the feedback connection for the linear controller. Connect this pin to the resistor
divider network to set the output voltage of the linear regulator.
8, 18
NC
No Connect.
9
VLDO
Gate Drive for the Linear Regulator N-channel MOSFET.
10
SENSE
Connects to the internal resistor divider which along with the VID code, sets the output voltage.
Pin 10 is also the () input for the current comparator.
11
SENSE+
The (+) input for the current comparator. A threshold between Pins 10 and 11 set by the error
amplifier in conjunction with R
SENSE
, sets the current trip point.
12
C
T
External Capacitor C
T
from Pin 12 to ground sets the off time of the device.
13
CMP
Error Amplifier Compensation Point. The current comparator threshold increases with the Pin
13 voltage.
14
PWRGD
Power Good Pin. An open drain signal to indicate that the output voltage is within a
5% regu-
lation band.
15
V
CC
Input Voltage Pin.
16
DRIVE2
Gate Drive for the Synchronous Rectifier N-channel MOSFET. The voltage at Pin 16 swings
from ground to V
CC
.
17
DRIVE1
Gate Drive for the buck switch N-channel MOSFET. The voltage at Pin 17 swings from ground
to V
CC
.
19
PGND
Driver Power Ground. Connects to the source of the bottom N-channel MOSFET onto the ()
terminal of C
IN
.
PIN CONFIGURATION
20-Lead Thin Shrink Small Outline (TSSOP)
(RU-20)
TOP VIEW
(Not to Scale)
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
ADP3153
NC = NO CONNECT
SENSE
VLDO
NC
VID2
VID3
VID4
FB
SD
AGND
SENSE+
C
T
CMP
PGND
NC
DRIVE 1
PWRGD
V
CC
DRIVE 2
VID1
VID0
ABSOLUTE MAXIMUM RATINGS*
Input Supply Voltage (Pin 15) . . . . . . . . . . . . 0.3 V to +16 V
Shutdown Input Voltage . . . . . . . . . . . . . . . . 0.3 V to +16 V
Power Dissipation . . . . . . . . . . . . . . . . . . . . Internally Limited
Operating Temperature Range . . . . . . . . . . . . . 0
C to +70
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
C
JA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
C/W
Storage Temperature Range . . . . . . . . . . . . 65
C to +150
C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300
C
*This is a stress rating only; operation beyond these limits can cause the device to
be permanently damaged.
ORDERING GUIDE
Temperature
Package
Package
Model
Range
Description
Option
ADP3153ARU
0
C to +70
C
Thin Shrink Small RU-20
Outline (TSSOP)
ADP3153
4
REV. 0
P
SYSTEM
R1
150k
R2
39k
C
T
150pF
22 F
1 F
22
IRL3103
IRL3103
10BQ015
1 F
2700 F 3
(10V)
L2
1.7 H
L1
2.5 H
R
SENSE
6.7m
2700 F
6
(10V)
V
O
1.8V3.5V
0-14A
RTN
220
100k
V
CC
+5V
+5V RTN
+12V RTN
2nF
C
COMP
ADP3153
NC = NO CONNECT
SENSE
VLDO
NC
VID2
VID3
VID4
FB
SD
AGND
SENSE+
C
T
CMP
PGND
NC
DRIVE1
PWRGD
V
CC
DRIVE2
VID1
VID0
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
R3
20k
1000 F
V
O2
+3.3V
1A
IRL2703
1nF
R
PROG
35k
1
2
RTN
220
V
IN
+12V
Figure 2. Typical VRM8.2 Compliant Core DC/DC Converter Circuit
g
m
NONOVERLAP
DRIVE
IN
CROWBAR
14
15
SD
V
CC
DRIVE1 DRIVE2 PGND
V
REF
+15%
5
AGND
PWRGD
SENSE+
DELAY
V
REF
+5%
V
REF
5%
SENSE
2R
ADP3153
CMPI
DAC
CMP
1.20V
VID0
1
VID1
2
VID2
3
VID3
4
VID4
V
REF
V
T1
CMPT
V
T2
C
T
SENSE
6
REFERENCE
R
10
11
S
R
Q
OFF-TIME
CONTROL
V
IN
13
12
9
VLDO
FB
OFF
Figure 3. Functional Block Diagram
OUTPUT CURRENT Amps
EFFICIENCY %
100
65
1.4
2.8
14.0
4.2
5.6
7.0
9.8 11.2 12.6
8.4
95
85
80
75
70
90
V
OUT
= +2.0V
V
OUT
= +2.8V
V
OUT
= +3.5V
SEE FIGURE 2
Figure 4. Efficiency vs. Output Current
V
OUT
= +3.5V, I
OUT
= 10A
2
500ns/DIV
1
PRIMARY
N-DRIVE
DRIVER OUTPUT
SECONDARY
N-DRIVE
DRIVER OUTPUT
DRIVE 1 AND 2 = 5V/DIV
SEE FIGURE 2
Figure 7. Gate Switching Waveforms
OUTPUT CURRENT
1A TO 14A
OUTPUT VOLTAGE
20mV/DIV
10 s/DIV
Figure 10. Transient Response,
1A14 A of Figure 2 Circuit
Typical Performance CharacteristicsADP3153
5
REV. 0
TIMING CAPACITOR pF
50
100
800
200
300
400
500
600
700
FREQUENCY kHz
450
400
0
200
150
100
50
350
250
300
Figure 5. Frequency vs. Timing
Capacitor
100ns/DIV
SEE FIGURE 2
V
CC
= +12V
V
IN
= +5V
V
OUT
= +3.5V
I
OUT
= 10A
Figure 8. Driver Transition Waveforms
3
4
10ms/DIV
REGULATOR
OUTPUT VOLTAGE
1V/DIV
V
CC
VOLTAGE
5V/DIV
Figure 11. Power-On Start-Up
Waveforms
OPERATING FREQUENCY kHz
45
397
58
83
134
GATE CHARGE CURRENT mA
45
40
0
20
15
10
5
35
25
30
Qn + Qn = 100nC
Figure 6. Gate Charge vs. Supply
Current
10 s/DIV
OUTPUT CURRENT
14A TO 1A
OUTPUT VOLTAGE
20mV/DIV
Figure 9. Transient Response,
14 A1A of Figure 2 Circuit
OUTPUT ACCURACY %
NUMBER OF PARTS
15
0
0.55
0.5
0.45
25
20
10
5
0.4
0.35
0.3
0.25
0.2
0.15
0.1
0.05
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
T
A
= +25 C
SEE FIGURE 13
Figure 12. Output Accuracy Distribution
ADP3153
6
REV. 0
V
CC
SD
DRIVE1
SENSE+
SENSE
DRIVE2
PGND
VID0
VID4
AGND
C
T
CMP
12V
1k
5-BIT
CODE
1 F
4700pF
0.1 F
V
OUT
1.2V
100k
0.1 F
ADP3153
OP27
Figure 13. Closed-Loop Test Circuit for Accuracy
APPLICATION INFORMATION
The ADP3153 uses a current-mode, constant-off-time control
technique to switch a pair of external N-channel MOSFETs in
a synchronous rectified buck converter application. Due to the
constant-off-time operation, no slope compensation is needed.
A unique feature of the constant-off-time control technique is
that the converter's frequency becomes a function of the ratio of
input voltage to output voltage. The off time is determined by
the value of the external capacitor connected to the C
T
pin.
The on time varies in such a way that a regulated output volt-
age is maintained.
The output voltage is sensed by an internal voltage divider that
is connected to the SENSE pin. A voltage-error amplifier g
m
compares the values of the divided output voltage with a refer-
ence voltage. The reference voltage is set by an on-board 5-bit
DAC, which reads the code present at the voltage identification
(VID) pins and converts it to a precise value between 600 mV
and 1.167 V. Refer to Table I for the output voltage vs. VID pin
code information.
During continuous-inductor-current mode of operation, the
voltage-error amplifier g
m
and the current comparator CMPI
are the main control elements. During the on time of the high
side MOSFET, the current comparator CMPI monitors the
voltage between the SENSE+ and SENSE pins. When the
voltage level between the two pins reaches the threshold level
V
T1
, the high side drive output is switched to zero, which turns
off the high side MOSFET. The timing capacitor C
T
is now
discharged at a rate determined by the off time controller. In
order to maintain a ripple current in the inductor, which is
independent of the output voltage, the discharge current is
made proportional to the value of the output voltage (mea-
sured at the SENSE pin). While the timing capacitor is dis-
charging, the low side drive output goes high, turning on the
low side MOSFET. When the voltage level on the timing ca-
pacitor has discharged to the threshold voltage level V
T2
,
comparator CMPT resets the SR flip-flop. The output of the
flip-flop forces the low side drive output to go low and the high
side drive output to go high. As a result, the low side switch is
turned off and the high side switch is turned on. The sequence is
then repeated. As the load current increases, the output voltage
starts to decrease. This causes an increase in the output of the
voltage-error amplifier, which, in turn, leads to an increase in
the current comparator threshold V
T1,
thus tracking the load
current.
Table I. Output Voltage vs. VID Code
VID4
VID3
VID2
VID1
VID0
VOUT
0
1
1
1
1
1.80
0
1
1
1
0
1.80
0
1
1
0
1
1.80
0
1
1
0
0
1.80
0
1
0
1
1
1.80
0
1
0
1
0
1.80
0
1
0
0
1
1.80
0
1
0
0
0
1.80
0
0
1
1
1
1.80
0
0
1
1
0
1.80
0
0
1
0
1
1.80
0
0
1
0
0
1.85
0
0
0
1
1
1.90
0
0
0
1
0
1.95
0
0
0
0
1
2.00
0
0
0
0
0
2.05
1
1
1
1
1
Shutdown
1
1
1
1
0
2.10
1
1
1
0
1
2.20
1
1
1
0
0
2.30
1
1
0
1
1
2.40
1
1
0
1
0
2.50
1
1
0
0
1
2.60
1
1
0
0
0
2.70
1
0
1
1
1
2.80
1
0
1
1
0
2.90
1
0
1
0
1
3.00
1
0
1
0
0
3.10
1
0
0
1
1
3.20
1
0
0
1
0
3.30
1
0
0
0
1
3.40
1
0
0
0
0
3.50
To prevent cross conduction of the external MOSFETs, feed-
back is incorporated to sense the state of the driver output pins.
Before the low side drive output can go high, the high side drive
output must be low. Likewise, the high side drive output is
unable to go high while the low side drive output is high.
Power Good
The ADP3153 has an internal monitor which monitors the
output voltage and drives the PWRGD pin of the device. This
pin is an open drain output whose high level (when connected
to a pull-up resistor) indicates that the output voltage has been
within a
5% regulation band of the targeted value for more
than 500
s. The PWRGD pin will go low if the output is out-
side the regulation band for more than 500
s.
Output Crowbar
An added feature of using an N-channel MOSFET as the syn-
chronous switch is the ability to crowbar the output with the
same MOSFET. If the output voltage is 15% greater than the
desired regulated value, the ADP3153 will turn on the lower
MOSFET, which will current-limit the source power supply or
blow its fuse, pull down the output voltage, and thus save the
expensive microprocessor from destruction. The crowbar func-
tion releases at approximately 50% of the nominal output volt-
age. For example, if the output is programmed to 2.0 V, but is
pulled up to 2.3 V or above, the crowbar will turn on the lower
MOSFET. If in this case the output is pulled down to less than
ADP3153
7
REV. 0
1.0 V, the crowbar will release, allowing the output voltage to
recover to 2.0 V.
Shutdown
The ADP3153 has a shutdown pin which is pulled logic low by
an internal resistor. In this condition the device functions nor-
mally. This pin should be pulled high externally to disable the
output drives.
Calculation of Component Values
The design parameters for a typical 300 MHz Pentium
II appli-
cation (Figure 2) are as follows:
Input voltage: V
IN
= 5 V
Auxiliary input: V
CC
= 12 V
Output voltage: V
O
= 2.8 V
Maximum output current:
I
OMAX
= 14.2 Adc
Minimum output current:
I
OMIN
= 0.8 Adc
Static tolerance of the supply voltage for the processor core:
V
OST+
= 100 mV
V
OST
= 60 mV
Transient tolerance (for less than 2
s) of the supply voltage for
the processor core when the load changes between the minimum
and maximum values with a di/dt of 30 A/
s:
V
OTR+
= 130 mV
V
OTR
= 130 mV
Input current di/dt when the load changes between the mini-
mum and maximum values: less than 0.1 A/
s
The above requirements correspond to Intel's published power
supply requirements based on VRM 8.2 guidelines.
C
T
Selection for Operating Frequency
The ADP3153 uses a constant-off-time architecture with t
OFF
determined by an external timing capacitor C
T
. Each time the
high side N-channel MOSFET switch turns on, the voltage
across C
T
is reset to approximately 3.3 V. During the off time,
C
T
is discharged by a constant current of 65
A to 2.3 V, that is
by 1 V. The value of the off time is calculated from the pre-
ferred continuous-mode operating frequency. Assuming a nomi-
nal operating frequency of f
NOM
= 200 kHz at an output voltage
of V
O
= 2.8 V, the corresponding off time is:
t
OFF
=
1
V
O
V
IN




1
f
NOM
=
2.2
s
The timing capacitor can be calculated from the equation:
C
T
=
t
OFF
65
A
1V
=
143 pF
The converter operates at the nominal operating frequency only
at the above specified V
O
and at light load. At higher V
O
, and
heavy load, the operating frequency decreases due to the para-
sitic voltage drops across the power devices. The actual mini-
mum frequency at V
O
= 2.8 V is calculated to be 160 kHz (see
Equation 1 below), where:
I
IN
is the input dc current (assuming an efficiency
of 90%, I
IN
= 9 A)
R
IN
is the resistance of the input filter (estimated
value: 7 m
)
R
DS(ON)HSF
is the resistance of the high side MOSFET
(estimated value: 10 m
)
R
DS(ON)LSF
is the resistance of the low side MOSFET
(estimated value: 10 m
)
R
SENSE
is the resistance of the sense resistor
(estimated value: 7 m
)
R
L
is the resistance of the inductor (estimated
value: 6 m
)
C
O
Selection--Determining the ESR
The selection of the output capacitor is driven by the required
ESR and capacitance C
O
. The ESR must be small enough that
both the resistive voltage deviation due to a step change in the
load current and the output ripple voltage stay below the values
defined in the specification of the supplied microprocessor. The
capacitance, C
O
, must be large enough that the output is held
up while the inductor current ramps up or down to the value
corresponding to the new load current.
The total static tolerance of the Pentium II processor is 160 mV.
Taking into account the
1% setpoint accuracy of the ADP3153,
and assuming a 0.5% (or 14 mV) peak-to-peak ripple, the al-
lowed static voltage deviation of the output voltage when the
load changes between the minimum and maximum values is
0.08 V. Assuming a step change of
I = I
OMAX
I
OMIN
= 13.4 A,
and allocating all of the total allowed static deviation to the
contribution of the ESR sets the following limit:
R
E MAX
(
)
=
ESR
MAX 1
=
0.08
13. 4
=
5.9 m
The output filter capacitor must have an ESR of less than
5.9 m
. One can use, for example, six FA type capacitors from
Panasonic, with 2700
F capacitance, 10 V voltage rating, and
34 m
ESR. The six capacitors have a total typical ESR of
~ 5 m
when connected in parallel.
Inductor Selection
The minimum inductor value can be calculated from ESR, off
time, dc output voltage and allowed peak-to-peak ripple voltage.
L
MIN1
=
V
O
t
OFF
R
E( MAX )
V
RIPPLE , p
-
p
=
2.8
2.2
5.9 m
14 m
=
2.6
H
The minimum inductance gives a peak-to-peak ripple current of
2.15 A, or 15% of the maximum dc output current I
OMAX
.
f
MIN
=
1
t
OFF
V
IN
I
IN
R
IN
I
OMAX
(R
DS(ON )HSF
+
R
SENSE
+
R
L
) V
O
V
IN
I
IN
R
IN
I
OMAX
(R
DS(ON )HSF
+
R
SENSE
+
R
L
R
DS(ON )LSF
)
=
160 kHz
(1)
ADP3153
8
REV. 0
The inductor peak current in normal operation is:
I
LPEAK
= I
OMAX
+ I
RPP
/2 = 15.3 A
The inductor valley current is:
I
LVALLEY
= I
LPEAK
I
RPP
= 13 A
The inductor for this application should have an inductance
of 2.6
H at full load current and should not saturate at the
worst-case overload or short circuit current at the maximum
specified ambient temperature. A suitable inductor is the
CTX12-13855 from Coiltronics, which is 4.4
H at 1 A and
about 2.5
H at 14.2 A.
Tips for Selecting Inductor Core
Ferrite designs have very low core loss, so the design should
focus on copper loss and on preventing saturation. Molypermalloy,
or MPP, is a low loss core material for toroids, and it yields the
smallest size inductor, but MPP cores are more expensive than
cores or the Kool M
cores from Magnetics, Inc. The lowest
cost core is made of powdered iron, for example the #52 material
from Micrometals, Inc., but yields the largest size inductor.
C
O
Selection--Determining the Capacitance
The minimum capacitance of the output capacitor is determined
from the requirement that the output be held up while the in-
ductor current ramps up (or down) to the new value. The mini-
mum capacitance should produce an initial dv/dt which is equal
(but opposite in sign) to the dv/dt obtained by multiplying the
dt in the inductor and the ESR of the capacitor.
C
MIN
=
I
OMAX
I
OMIN
R
E
(di /dt )
=
14.2 0.8
5.9 m (2.2 / 4. 4
H )
=
4.5 mF
In the above equation the value of di/dt is calculated as the
smaller voltage across the inductor (i.e., V
IN
V
O
rather than V
O
)
divided by the maximum inductance (4.4
H) of the CTX12-
13855 inductor from Coiltronics. The parallel-connected six
2700
F/10 V FA series capacitors from Panasonic have a total
capacitance of 16,200
F, so the minimum capacitance is met
with ample margin.
R
SENSE
The value of R
SENSE
is based on the required output current.
The current comparator of the ADP3153 has a threshold range
that extends from 0 mV to 125 mV (minimum). Note that the
full 125 mV range cannot be used for the maximum specified
nominal current, as headroom is needed for current ripple, tran-
sients and inductor core saturation.
The current comparator threshold sets the peak of the inductor
current yielding a maximum output current I
OMAX,
which equals
the peak value less half of the peak-to-peak ripple current. Solv-
ing for R
SENSE
and allowing a margin for tolerances inside the
ADP3153 and in the external component values yields:
R
SENSE
= (125 mV )/[1.2(I
OMAX
+ I
RPP
/2)] = 6.8 m
A practical solution is to use three 20 m
resistors in parallel,
with an effective resistance of about 6.7 m
.
Once R
SENSE
has been chosen, the peak short-circuit current
I
SC(PK)
can be predicted from the following equation:
I
SC(PK)
= (145 mV)/R
SENSE
= (145 mV)/(6.7 m
) = 21.5 A
The actual short-circuit current is less than the above calculated
I
SC(PK)
value because the off time rapidly increases when the
output voltage drops below 1 V. The relationship between the
off time and the output voltage is:
t
OFF
C
T
1V
V
O
360 k
+
2
A
With a short across the output, the off time will be about
70
s. During that off time the inductor current gradually de-
cays. The amount of decay depends on the L/R time constant in
the output circuit. With an inductance of 2.5
H and total resis-
tance of 23 m
, the time constant will be 108
s, which yields a
valley current of 11.3 A and an average short-circuit current of
about 16.3 A. To safely carry the short-circuit current, the sense
resistor must have a power rating of at least 16.3 A
2
6
.8 m
=
1.8 W.
Current Transformer Option
An alternative to using low value and high power current sense
resistor is to reduce the sensed current by using a low cost cur-
rent transformer and a diode. The current can then be sensed
with a small-size, low cost SMT resistor. If we use a transformer
with one primary and 50 secondary turns, the worst-case resistor
dissipation is reduced to a fraction of a mW. Another advantage
of using this option is the separation of the current and voltage
sensing, which makes the voltage sensing more accurate.
Power MOSFET
Two external N-channel power MOSFETs must be selected for
use with the ADP3153, one for the main switch, and an identi-
cal one for the synchronous switch. The main selection param-
eters for the power MOSFETs are the threshold voltage V
GS(TH)
and the on resistance R
DS(ON)
.
The minimum input voltage dictates whether standard threshold
or logic-level threshold MOSFETs must be used. For V
IN
> 8 V,
standard threshold MOSFETs (V
GS(TH)
< 4 V) may be used. If
V
IN
is expected to drop below 8 V, logic-level threshold MOSFETs
(V
GS(TH)
< 2.5 V) are strongly recommended. Only logic-level
MOSFETs with V
GS
ratings higher than the absolute maximum
of V
CC
should be used.
The maximum output current I
OMAX
determines the R
DS(ON)
requirement for the two power MOSFETs. When the ADP3153
is operating in continuous mode, the simplifying assumption can
be made that one of the two MOSFETs is always conducting
the average load current.
For V
IN
= 5 V and V
O
= 2.8 V, the maximum duty ratio of the
high side FET is:
D
MAXHF
= (1 f
MIN
t
OFF
) =(1 160 kHz
2.2
s) = 65%
The maximum duty ratio of the low side (synchronous rectifier)
FET is:
D
MAXLF
= 1 D
MAXHF
= 35%
The maximum rms current of the high side FET is:
I
RMSLS
= [D
MAXHF
(I
LVALLEY
2
+ I
LPEAK
2
+ I
LVALLEY
I
LPEAK
)/3]
0.5
= 11.5 Arms
ADP3153
9
REV. 0
The maximum rms current of the low side FET is:
I
RMSLS
= [D
MAXLF
(I
LVALLEY
2
+ I
LPEAK
2
+ I
LVALLEY
I
LPEAK
)/3]
0.5
= 8.41 Arms
The R
DS(ON)
for each FET can be derived from the allowable
dissipation. If we allow 5% of the maximum output power for
FET dissipation, the total dissipation will be:
P
FETALL
= 0.05 V
O
I
OMAX
= 2 W
Allocating two-thirds of the total dissipation for the high side
FET and one-third for the low side FET, the required minimum
FET resistances will be:
R
DS(ON)HSF(MIN)
= 1.33/11.5
2
= 10 m
R
DS(ON)LSF(MIN)
= 0.67/8.41
2
= 9.5 m
Note that there is a tradeoff between converter efficiency and
cost. Larger FETs reduce the conduction losses and allow higher
efficiency but lead to increased cost. If efficiency is not a major
concern the Fairchild MOSFET NDP6030L or International
Rectifier IRL3103 is an economical choice for both the high side
and low side positions. Those devices have an R
DS(ON)
of 14 m
at V
GS
= 10 V and at 25
C. The low side FET is turned on with
at least 10 V. The high side FET, however, is turned on with
only 12 V 5 V = 7 V. If we check the typical output character-
istics of the device in the data sheet, we find that for an output
current of 10 A, and at a V
GS
of 7 V, the V
DS
is 0.15 V, which
gives a R
DS(ON)
= V
DS
/I
D
= 15 m
. This value is only slightly
above the one specified at a V
GS
of 10 V, so the resistance in-
crease due to the reduced gate drive can be neglected. We have
to modify, however, the specified R
DS(ON)
at the expected high-
est FET junction temperature of 140
C by a R
DS(ON)
multiplier,
using the graph in the data sheet. In our case:
R
DS(ON)MULT
= 1.7
Using this multiplier, the expected R
DS(ON)
at 140
C is 1.7
14
= 24 m
.
The high side FET dissipation is:
P
DFETHS
= I
RMSHS
2
R
DS(ON)
+ 0.5 V
IN
I
LPEAK
Q
G
f
MAX
/I
G
= 3.72 W
where the second term represents the turn-off loss of the FET.
(In the second term, Q
G
is the gate charge to be removed from
the gate for turn-off and I
G
is the gate current. From the data
sheet, Q
G
is about 50 nC 70 nC and the gate drive current
provided by the ADP3153 is about 1 A.)
The low side FET dissipation is:
P
DFETLS
= I
RMSLS
2
R
DS(ON)
= 1.7 W
(Note that there are no switching losses in the low side FET.)
To remove the dissipation of the chosen FETs, proper heatsinks
should be used. The Thermalloy 6030 heatsink has a thermal
impedance of 13
C/W with convection cooling. With this heat-
sink, the junction-to-ambient thermal impedance of the chosen
high side FET
JAHS
will be 13 (heatsink-to-ambient) + 2 (junction-
to-case) + 0.5 (case-to-heatsink) = 15.5
C/W.
At full load and at 50
C ambient temperature, the junction
temperature of the high side FET is:
T
JHSMAX
= T
A
+
JAHS
P
DFETHS
= 105
C
A smaller heatsink may be used for the low side FET, e.g., the
Thermalloy type 7141 (
= 20.3
C/W). With this heatsink, the
T
JLSMAX
= T
A
+
JALS
P
DFETLS
= 106
C
All of the above calculated junction temperatures are safely
below the 175
C maximum specified junction temperature of
the selected FET.
The maximum operating junction temperature of the ADP3153
is calculated as follows:
T
JICMAX
= T
A
+
JA
(I
IC
V
CC
+ P
DR
)
where
JA
is the junction to ambient thermal impedance of the
ADP3153 and P
DR
is the drive power. From the data sheet,
JA
is equal to 110
C/W and I
IC
= 2.7 mA. P
DR
can be calculated as
follows:
P
DR
= (C
RSS
+ C
ISS
)V
CC
2
f
MAX
= 307 mW
The result is:
T
JICMAX
= 86
C
C
IN
Selection and Input Current di/dt Reduction
In continuous-inductor-current mode, the source current of the
high side MOSFET is a square wave with a duty ratio of V
O
/
V
IN
. To keep the input ripple voltage at a low value, one or
more capacitors with low equivalent series resistance (ESR) and
adequate ripple-current rating must be connected across the
input terminals. The maximum rms current of the input bypass
capacitors is:
I
CINRMS
[V
O
(V
IN
V
O
)]
0.5
I
OMAX
/V
IN
= 7 Arms
Let us select the FA-type capacitor with 2700
F capacitance
and 10 V voltage rating. The ESR of that capacitor is 34 m
and the allowed ripple current at 100 kHz is 1.94 A. At 105
C
we would need to connect at least four such capacitors in paral-
lel to handle the calculated ripple current. At 50
C ambient,
however, the ripple current can be increased, so three capacitors
in parallel are adequate.
The ripple voltage across the three paralleled capacitors is:
V
CINRPL
= I
OMAX
[ESR
IN
/3 + D
MAXHF
/(3C
IN
f
MIN
)] 140 mV p-p
To further reduce the effect of the ripple voltage on the system
supply voltage bus and to reduce the input-current di/dt to
below the recommended maximum of 0.1 A/
s, an additional
small inductor (L > 1.7
H @ 10 A) should be inserted between
the converter and the supply bus (see Figure 2).
Feedback Loop Compensation Design
To keep the peak-to-peak output voltage deviation as small as
possible, the low frequency output impedance (i.e., the output
resistance) of the converter should be made equal to the ESR of
the output capacitor. That can be achieved by having a single-pole
roll-off of the voltage gain of the g
m
error amplifier, where the pole
frequency coincides with the ESR zero of the output capacitor. A
gain with single-pole roll-off requires that the g
m
amplifier is termi-
nated by the parallel combination of a resistor and capacitor. The
required resistor value can be calculated from the equation:
36
R
SENSE
g
m
145 k
R
COMP
(
)
=
R
E
where g
m
= 2.2 ms and the quantities 36 and 145 k
are charac-
teristic of the ADP3153. The calculated compensating resis-
tance is:
R1 R2 = R
COMP
= 31 k
ADP3153
10
REV. 0
The compensating capacitance is determined from the equality
of the pole frequency of the error amplifier gain and the zero
frequency of the impedance of the output capacitor.
C
R C
R
m
mF
k
nF
COMP
E
OUT
COMP
=
=
=
5
16 2
31
2 6
.
.
In the application circuit we tested, we found that the compen-
sation scheme shown in Figure 2 gave the optimal response to
meet the Pentium II dc/dc static and transient specifications
with sufficient margins including the ADP3153's initial error
tolerance, the PCB layout trace resistances, and the external
component parasitics. If we increase the load resistance to the
COMP pin, the static regulation will improve. The load transient
response, however, will get worse. In Figure 2, if we decrease the
R1 = 150 k
resistor vs. the R2 = 39 k
resistor, the regulation
band will shift positive in relation to the 2.8 V. If we increase
the R1 resistor, the regulation band will shift negative. It may be
necessary to adjust these resistor values to obtain the best static
and dynamic regulation compliance depending on the output
capacitor ESR and the parasitic trace resistances of the PCB
layout. A detailed design procedure and published conference
papers on the optimal compensation are available on ADI's
website (http://www.analog.com).
ADP3153 Linear Regulator
The ADP3153 linear regulator provides a low cost, convenient,
and versatile solution for generating an additional power supply
rail that can be programmed between 1.2 V5 V. The maximum
output load current is determined by the size and thermal imped-
ance of an external N-channel power MOSFET that is placed in
series with the 5 V supply and controlled by the ADP3153. The
output voltage, V
O2
in Figure 14, is sensed at the FB pin of the
ADP3153 and compared to an internal 1.2 V reference in a
negative feedback loop which keeps the output voltage in regula-
tion. Thus, if the load is being reduced or increased, the FET
drive will also be reduced or increased by the ADP3153 to pro-
vide a well regulated
1% accurate output voltage. This accu-
racy is maintained even if the load changes at the very high rate
typical of CPU-type loads. The output voltage is programmed
by adjusting the value of the external resistor R
PROG
shown in
Figure 14.
Features
Typical Efficiency: 66% at 3.3 V Output Voltage
Tight DC Regulation Due to 1% Reference and High Gain
Output Voltage Stays Within Specified Limits at Load Cur-
rent Step with 30 A/
s Slope
Fast Response to Input Voltage or Load Current Transients
The design in Figure 14 is for an output voltage, V
O2
of 3.3 V
with a maximum load current of 0.5 A. Additionally, overcurrent
protection is provided by the addition of an external NPN tran-
sistor and an external resistor R
S2
. The design specifications and
procedure is given below.
Linear Regulator Design Specifications
Maximum Ambient Temperature . . . . . . . . . . . T
AMB
= 50
C
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
IN
= 5 V
Output Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . V
O2
= 3.3 V
Maximum Output Current . . . . . . . . . . . . . . . I
O2MAX
= 0.5 A
Maximum Output Load Transient Allowed . . V
TR2
= 0.036 V
Chosen FET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IRX3803
Junction-to-Ambient Thermal Impedance (FET)*
JA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
C/W
*Uses 1 inch square PCB cu-foil as heatsink
The output voltage may be programmed by the resistor R
PROG
as follows:
R
V
k
k
k
PROG
O
=




=




=
2
1 2
1
20
3 3
1 2
1
20
35
.
.
.
The current sense resistor may be calculated as follows:
R
I
S
O MAX
2
2
0 6
0 6
0 5
1 2
=
=
=
.
.
.
.
The power rating is:
P
R
I
W
S
S
O MAX
2
2
2
2
1 1
0 36
=
(
)
=
.
.
Use a 0.5
resistor.
The maximum FET junction temperature at shorted output is:
T
T
V
I
C
FETMAX
AMB
A
IN
O MAX
=
+
=
+
=
J
2
1 1
50 40 5 0 5 1 1 160
.
.
.
which is within the maximum allowed by the FET's data sheet.
The maximum FET junction temperature at nominal output is:
T
T
V
V
I
C
FETMAX
AMB
A
IN
O
O MAX
=
+
(
)
=
+
(
)
=
J
.
.
2
2
50 40
5 3 3
0 5 84
The output filter capacitor maximum allowed ESR is:
ESR ~ V
TR2
/I
OMAX
= 0.036/0.5 = 0.072
.
This requirement is met using a 1000
F/10 V LXV series ca-
pacitor from United Chemicon. For applications requiring
higher output current, a heatsink and/or a larger MOSFET
should be used to reduce the MOSFET's junction to ambient
thermal impedance.
R
S2
1.1
470pF
2N2222
V
IN
= +5V
IRX3803
2k
1000 F/10V
V
O2
= 3.3V
I
O2
= 0.5A
VLDO
ADP3153
FB
20k
R
PROG
35k
Figure 14. Linear Regulator with Overcurrent Protection
ADP3153
11
REV. 0
BOARD LAYOUT
A multilayer PCB is recommended with a minimum of two
copper layers. One layer on top should be used for traces inter-
connecting low power SMT components. The ground terminals
of those components should be connected with vias to the bot-
tom traces connecting directly to the ADP3153 ground pins.
One layer should be a power ground plane. If four layers are
possible, one additional layer should be an internal system
ground plane, and one additional layer can be used for other
system interconnections.
When laying out the printed circuit board, the following check-
list should be used to ensure proper operation of the ADP3153.
Board Layout Guidelines
1. The power loop should be routed on the PCB to encompass
small areas to minimize radiated switching noise energy to
the control circuit and thus to avoid circuit problems caused
by noise. This technique also helps to reduce radiated EMI.
The power loop includes the input capacitors, the two
MOSFETs, the sense resistor, the inductor and the output
capacitors. The ground terminals of the input capacitors,
the low side FET, the ADP3153 and the output capacitors
should be connected together with short and wide traces. It is
best to use an internal ground plane.
2. The PGND (power ground) pin of the ADP3153 must re-
turn to the grounded terminals of the input and output ca-
pacitors and to the source of the low side MOSFET with the
shortest and widest traces possible. The AGND (analog
ground) pin has to be connected to the ground terminals of
the timing capacitor and the compensating capacitor, again
with the shortest leads possible, and before it is connected to
the PGND pin.
3. The positive terminal of the input capacitors must be con-
nected to the drain of the high side MOSFET. The source
terminal of this FET is connected to the drain of the low side
FET, (whose source is connected to the ground plane direct)
with the widest and shortest traces possible. To kill parasitic
ringing at the input of the buck inductor due to parasitic
capacitances and inductances, a small (L > 3 mm) ferrite
bead is recommended to be placed in the drain lead of the
low side FET. Also, to minimize dissipation of the high side
FET, a low voltage 1 A Schottky diode can be connected
between the input of the buck inductor and the source of the
low side FET.
4. The positive terminal of the bypass capacitors of the +12 V
supply must be connected to the V
IN
pin of the ADP3153
with the shortest leads possible. The negative terminals must
be connected to the PGND pin of the ADP3153.
5. The sense pins of the ADP3153 must be connected to the
sense resistor with as short traces as possible. Make sure that
the two sense traces are routed together with minimum sepa-
ration (<1 mm). The output side of the sense resistor should
be connected to the V
CC
pin(s) of the CPU with as short and
wide PCB traces as possible to reduce the V
CC
voltage drop.
(Each square unit of 1 ounce Cu-trace has a resistance of
~0.53 m
. At 14 A, each m
of PCB trace resistance be-
tween current sense resistor output and V
CC
terminal(s) of
the CPU will reduce the regulated output voltage by 14 mV.
The filter capacitors to ground at the sense terminals of the
IC should be as close as possible (<8 mm) to the ADP3153.
The common ground of the optional filter capacitors should
be connected to the AGND pin of the ADP3153 with the
shortest traces possible (<10 mm).
6. The microprocessor load should be connected to the output
terminals of the converter with the widest and shortest traces
possible. Use overlapping traces in different layers to mini-
mize interconnection inductance.
ADP3153
12
REV. 0
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
C334637/98
PRINTED IN U.S.A.
20-Lead Thin Shrink Small Outline (TSSOP)
(RU-20)
0.260 (6.60)
0.252 (6.40)
20
11
10
1
0.256 (6.50)
0.246 (6.25)
0.177 (4.50)
0.169 (4.30)
PIN 1
SEATING
PLANE
0.006 (0.15)
0.002 (0.05)
0.0118 (0.30)
0.0075 (0.19)
0.0256 (0.65)
BSC
0.0433 (1.10)
MAX
0.0079 (0.20)
0.0035 (0.090)
0.028 (0.70)
0.020 (0.50)
8
0