Agilent ACPF-7003
High Rx and Image Rejection Tx
Filter for US PCS Band
Data Sheet
Features
High rejection from a single filter
with no switches required
True split band replacement
Passband: 1850-1910 MHz
35 dB min Attenuation, 1930-1990
MHz
2.5 dB Typical Insertion Loss
25dB image rejection at 1830 MHz
Space saving solution
Small footprint:
1.6 x 2.0-mm solution
Low profile package:
0.9 mm high (Typ)
1.0mm (Max)
Applications
US PCS band handsets
Wireless Data terminals
General Description
The ACPF-7003 is a high
rejection full band transmit
filter designed for US PCS
handsets. Its performance
rivals splitband surface
acoustic wave (SAW) transmit
filters. Since a single filter
provides the rejection, no
switches are required, saving
board space and external
components, eliminating switch
loss, and reducing
programming complexity.
Furthermore, with 25dB
rejection at 1830 MHz, it is a
true split band replacement.
The ACPF-7003 FBAR transmit
filter utilizes Agilent's
Microcap bonded-wafer chip
scale packaging technology.
This process allows the ultra
small filters to be assembled
into a Molded Chip on Board
(MCOB) Module.
In typical cellular phone
architectures, the transmit
filter fits between the driver
amplifier and the power
amplifier. This filter reduces
the noise in the Rx band being
amplified by the transmit
chain, enhancing receiver
sensitivity. High rejection
keeps unwanted signals out of
the receive path.
Agilent's thin-Film Bulk
Acoustic Resonator (FBAR)
technology makes possible
high-Q filters at a fraction
their usual size.
2
Absolute Maximum Ratings
[2]
Notes:
1. Temperature is defined at case T
C
, the temperature of the underside of the filter where it makes contact with the circuit board.
2. Specifications are guaranteed over the given temperature range. Operation in excess of any one of these conditions may result in permanent damage
to the device.
Parameter
Unit
Value
Operating temperature
[1]
C
-30 to +85
Storage temperature
[1]
C
-40 to +125
Electrical Specifications, Zo=50
Symbol
Parameters
Units
+25 C
-30 to +85 C
Min
Typ
Max
Min
Typ
Max
f
Passband [1850.6 - 1909.4]
MHz
IL
Insertion Loss 1850.6-1855 MHz dB
2.0
3.5
3.5
IL
Insertion Loss 1855-1905 MHz
dB
1.5
2.5
2.5
IL
Insertion Loss 1905-1909.4 MHz dB
2.5
3.0
3.0
S21
Ripple, 1850-1910 MHz
dB
2.5
S21
Min Rejection, 1930.6-1990 MHz
dB
35
45
35
45
S21
Min Rejection 10 -1715 MHz
dB
25
25
S21
Min Rejection 1715 - 1785 MHz
dB
25
25
S21
Min Rejection 1785 - 1830 MHz
dB
25
25
S21
Min Rejection 1990 - 2500 MHz
dB
30
30
S21
Min Rejection 2500 - 3820 MHz
dB
22
22
S21
Min Rejection 3820 - 5730 MHz
dB
15
15
S11, S22 In-band return loss
dB
10
13
10
13
Pin max
Safe Input Power Level
dBm
20
20
3
Typical Performance (25 C, Zo = 50 Ohms)
Figure 2. Insertion Loss (dB) vs. frequency
Figure 1. Attenuation (dB) vs. frequency
Figure 3. Attenuation (dB) vs. frequency (broadband)
Figure 4. Return Loss (dB) vs. frequency
Figure 5. S(1,1)
Figure 6. S(2,2)
4
PCB Interface & Mounting
instructions
Mounting Consideration and
board description
The ACPF-7003 FBAR filter
has one input (Pin 1), one
output (Pin 3) and two
grounds (Pins 2 and 4.)
Demo board uses 3 mil
Getek Microstrip.
The demo board uses CPWG
transmission lines for high
isolation between the two
ports. It uses via holes to
connect the CPWG line from
the underside of the board to
the filter mounting pads on
top.
Note: For best performance, try to reproduce
this board stack up closely. If Ground-
Signal-Ground (GSG) type board is used,
better return loss can be achieved since it
eliminates connector mismatch.
Demo boards
Demo boards are available for
sampling. (See board drawing
in Figures 7, 8, and 9.)
Figure 7. Board stack up description
Figure 9. Closer look at the recommended board footprint and soldermask
Figure 8. PCB Footprint pad
Output connection
Input connection
BACK
TOP
3 mils
Layer 2
(ground)
Layer 3
(signal)
Getek ML200D
(
T =3.9)
28 mils
0.7 mils
Getek ML200D
(
T =4.2)
Layer1
(signal)
Getek
material ML200D and RG200D
Getek
ML200D (
=3.9)
Getek
ML200D (
=4.2)
0.7 mils
5
Figure 11. Suggested PCB layers
Figure 10. Detailed Bottom, Side and Top view of Package (dimensions in mm)
2.0
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3
1.25 MAX
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Shaded Region Grounded
A
0.60
0.15
D
C
B
Pin 1
Marking
1.6
1
SIDE VIEW
0.35
0.15 8X
0.60
0.15
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LAYER 1
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Via to layer 2
This region is Soldermask covering ground
Region (4) & (2) is exposed ground for soldering filter pads
2
4
Dimension in mm
IN
1
OUT
3
1.5
1.92
0.61
0.70
0.61
0.30
0.3
LAYER 2 (GROUND layer)
0.3
Metal voided
To decrease
Capacitance at
Input Port
Metal voided
To decrease
Capacitance at
output Port
0.3
0.55
0.31
0.55
0.05
0.30
0.05
0.33
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