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Электронный компонент: HT827A0

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HT827A0
8-Bit Microcontroller with Voice ROM
1
March 15, 2000
Features
8-bit microcontroller
Operating voltage: 2.4V~5.2V
8K16 program ROM
2088 data RAM
36 bidirectional I/O lines
Interrupt input
16-bit programmable timer/event
counter with overflow interrupts
Watchdog timer
On-chip crystal or RC types of oscillator
Halt function and wake-up feature reduces
power consumption
63 powerful instructions
Up to a 1ms instruction cycle with a 4MHz
system clock at V
DD
=5V
All instructions in 1 or 2 machine cycles
16-bit table read instruction
8-level subroutine nesting
Bit manipulation instruction
General Description
The HT827A0 is 8-bit high performance
microcontroller with a voice synthesizer and
tone generator. They are designed for applica-
tions on multiple I/Os with sound effects. The
LSIs provide 26 kinds of voice sampling rates, 4
octaves of tone level as well as a high quality of
current type D/A output. With such a flexible
structure, the HT827A0 is excellent for versa-
tile voice and sound effect product applications.
It also includes a halt function to reduce power
consumption.
Voice and melody synthesizer
128K8 voice ROM
3/4 bit ADPCM coding algorithm
26 kinds of voice sampling rates
Tone level of 4 octaves
14 kinds of melody beats
Current type of D/A switch output
Tone generator counter
Controllable volume
48-pin DIP package
Applications
Intelligent educational toys
High end toy controllers
Talking alarm clocks
Alert and warning systems
Public address systems
Sound effect generators
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Block Diagram
Pin Assignment
HT827A0
2
March 15, 2000
I N T
O S C 1
O S C 2
R E S
8 - b i t H i g h P e r f o r m a n c e
M i c r o c o n t r o l l e r
V o i c e R O M
& C o n t r o l l e r
V o i c e
S y n t h e s i z e r &
T o n e g e n e r a t o r
C u r r e n t T y p e
D / A O u t p u t
3 6 - b i t B i d i r e c t i o n a l
I / O P o r t s
T M R
A U D
P A 0
P A 7
P B 0
P B 7 P C 0
P C 7
P D 0
P D 7 P E 0
P E 3
V D D
V S S
4 8
4 7
4 6
4 5
4 4
4 3
4 2
4 1
4 0
3 9
3 8
3 7
3 6
3 5
3 4
3 3
3 2
3 1
3 0
2 9
2 8
2 7
2 6
2 5
1
2
3
4
5
6
7
8
9
1 0
1 1
1 2
1 3
1 4
1 5
1 6
1 7
1 8
1 9
2 0
2 1
2 2
2 3
2 4
P A 3
P A 2
P A 1
N C
P A 0
P B 3
P B 2
P B 1
P B 0
V S S
P E 0
P E 1
P E 2
P E 3
I N T
T M R
P D 0
P D 1
P D 2
P D 3
P D 4
P D 5
P D 6
P D 7
P B 4
P B 5
P B 6
P B 7
P A 4
P A 5
P A 6
P A 7
N C
N C
N C
O S C 2
O S C 1
V D D
R E S
A U D
P C 7
P C 6
P C 5
P C 4
P C 3
P C 2
P C 1
P C 0
0 6 & % )
" & , 1 2
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Pad Assignment
Chip size: 3555 5015 (mm)
2
* The IC substrate should be connected to VSS in the PCB layout artwork.
* The TMR pad must be bound to VDD or VSS if it is not used.
HT827A0
3
March 15, 2000
1
2
3
4
5
6
7
8
9
1 0
1 1
1 2
1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
2 5
2 6
2 7
2 8
2 9
3 0
3 1
3 2
3 3
3 4
3 5
3 6
3 7
3 8
3 9
4 0
4 1
4 2
4 3
4 4
P B 3
P B 2
P B 1
P B 0
V S S
P E 0
P E 1
P E 2
P E 3
I N T
T M R
PC
7
PC
6
PC
5
PC
4
PC
3
PC
2
PC
1
PC
0
PD
7
PD
6
PD
5
PD
4
PD
3
PD
2
PD
1
PD
0
O S C 2
O S C 1
V D D
R E S
A U D
PA
7
PA
6
PA
5
PA
4
PB
7
PB
6
PB
5
PB
4
PA
3
PA
2
PA
1
PA
0
( 0 , 0 )
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Pad Coordinates
Unit: mm
Pad No.
X
Y
Pad No.
X
Y
1
-1543.05
2242.95
23
69.05
-2211.75
2
-1486.75
1675.25
24
237.85
-2211.75
3
-1486.75
1491.25
25
598.35
-2291.45
4
-1486.75
1308.95
26
890.95
-2291.45
5
-1486.75
1126.15
27
1184.35
-2291.45
6
-1486.75
925.35
28
1476.95
-2291.45
7
-1486.75
727.25
29
1507.85
-2091.35
8
-1486.75
538.35
30
1499.05
-1925.15
9
-1486.75
347.85
31
1539.95
-1757.35
10
-1486.75
157.35
32
1585.75
-1465.55
11
-1486.75
-28.35
33
1574.15
-667.75
12
-1486.75
-219.25
34
1502.55
2242.95
13
-1547.75
-2211.75
35
1227.35
2242.95
14
-1389.55
-2211.75
36
951.35
2242.95
15
-1239.35
-2211.75
37
676.15
2242.95
16
-1072.15
-2211.75
38
396.95
2242.95
17
-913.45
-2211.75
39
119.35
2242.95
18
-744.65
-2211.75
40
-159.85
2242.95
19
-585.95
-2211.75
41
-437.45
2242.95
20
-417.15
-2211.75
42
-716.65
2242.95
21
-258.45
-2211.75
43
-991.85
2242.95
22
-89.65
-2211.75
44
-1267.85
2242.95
Pad Description
Pad No. Pad Name I/O
Mask
Option
Description
1, 44~42,
37~34
PA0~PA7
I/O
Wake-up
Pull-high
or None
Bidirectional 8-bit input/output ports
Each bit can be configured as a wake-up input by mask
option. Software instructions determine the CMOS out-
put or schmitt trigger input with or without a pull-high re-
sistor (mask option).
5~2,
41~38
PB0~PB7
I/O Pull-high
or None
Bidirectional 8-bit input/output ports
Software instructions determine the CMOS output or
schmitt trigger input with or without a pull-high resistor
(mask option).
21~28
PC0~PC7
I/O Pull-high
or None
Bidirectional 8-bit input/output ports
Software instructions determine the CMOS output or
schmitt trigger input with or without a pull-high resistor
(mask option).
HT827A0
4
March 15, 2000
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Pad No. Pad Name I/O
Mask
Option
Description
13~20
PD0~PD7
I/O Pull-high
or None
Bidirectional 8-bit input/output ports
Software instructions determine the CMOS output or
schmitt trigger input with or without a pull-high resistor
(mask option).
6
VSS
Negative power supply, ground
7~10
PE0~PE3
I/O Pull-high
or None
Bidirectional 8-bit input/output ports
Software instructions determine the CMOS output or
schmitt trigger input with or without a pull-high resistor
(mask option).
11
INT
I
External interrupt schmitt trigger input with a
pull-high resistor
Edge triggered is activated on a high to low transition.
12
TMR
I
Schmitt trigger input for a timer/event counter
29
AUD
O
Audio output for driving an external transistor
PMOS open drain output
30
RES
I
Schmitt trigger reset input, active low
31
VDD
Positive power supply
32
33
OSC1
OSC2
I
O
Crystal or
RC
OSC1 and OSC2 connect to an RC network or crystal os-
cillator (determined by mask option) for an internal sys-
tem clock. In the case of RC operation, an oscillation
resistor connects to OSC1. OSC2 is the output terminal
of a 1/4 system clock.
Absolute Maximum Ratings
Supply Voltage..............................-0.3V to 5.5V
Storage Temperature.................-50C to 125C
Input Voltage.................V
SS
-0.3V to V
DD
+0.3V
Operating Temperature ..............-25C to 70C
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maxi-
mum Ratings may cause substantial damage to the device. Functional operation of this de-
vice at other conditions beyond those listed in the specification is not implied and prolonged
exposure to extreme conditions may affect device reliability.
HT827A0
5
March 15, 2000

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