Document Outline
- FEATURES
- GENERAL DESCRIPTION
- QUICK REFERENCE DATA
- ORDERING INFORMATION
- BLOCK DIAGRAM
- PINNING
- FUNCTIONAL DESCRIPTION
- LIMITING VALUES
- THERMAL CHARACTERISTICS
- QUALITY SPECIFICATION
- CHARACTERISTICS
- APPLICATION AND TEST INFORMATION
- BONDING PAD LOCATIONS
- PACKAGE OUTLINE
- SOLDERING
- REVISION HISTORY
- DATA SHEET STATUS
- DEFINITIONS
- DISCLAIMERS
DATA SHEET
Product specification
Supersedes data of 2003 Feb 19
2003 Oct 14
INTEGRATED CIRCUITS
TJA1040
High speed CAN transceiver
2003 Oct 14
2
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
FEATURES
Fully compatible with the ISO 11898 standard
High speed (up to 1 MBaud)
Very low-current standby mode with remote wake-up
capability via the bus
Very low ElectroMagnetic Emission (EME)
Differential receiver with high common-mode range for
ElectroMagnetic Immunity (EMI)
Transceiver in unpowered state disengages from the
bus (zero load)
Input levels compatible with 3.3 V and 5 V devices
Voltage source for stabilizing the recessive bus level if
split termination is used (further improvement of EME)
At least 110 nodes can be connected
Transmit Data (TXD) dominant time-out function
Bus pins protected against transients in automotive
environments
Bus pins and pin SPLIT short-circuit proof to battery and
ground
Thermally protected.
GENERAL DESCRIPTION
The TJA1040 is the interface between the Controller Area
Network (CAN) protocol controller and the physical bus.
It is primarily intended for high speed applications, up to
1 MBaud, in passenger cars. The device provides
differential transmit capability to the bus and differential
receive capability to the CAN controller.
The TJA1040 is the next step up from the TJA1050 high
speed CAN transceiver. Being pin compatible and offering
the same excellent EMC performance, the TJA1040 also
features:
An ideal passive behaviour when supply voltage is off
A very low-current standby mode with remote wake-up
capability via the bus.
This makes the TJA1040 an excellent choice in nodes
which can be in power-down or standby mode in partially
powered networks.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CC
supply voltage
operating range
4.75
5.25
V
I
CC
supply current
standby mode
5
15
A
V
CANH
DC voltage on pin CANH
0 < V
CC
< 5.25 V; no time limit
-
27
+40
V
V
CANL
DC voltage on pin CANL
0 < V
CC
< 5.25 V; no time limit
-
27
+40
V
V
SPLIT
DC voltage on pin SPLIT
0 < V
CC
< 5.25 V; no time limit
-
27
+40
V
V
esd
electrostatic discharge voltage
Human Body Model (HBM)
pins CANH, CANL and SPLIT
-
6
+6
kV
all other pins
-
4
+4
kV
t
PD(TXD-RXD)
propagation delay TXD to RXD
V
STB
= 0 V
40
255
ns
T
vj
virtual junction temperature
-
40
+150
C
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TJA1040T
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
TJA1040U
-
bare die; die dimensions 1840
1440
380
m
-
2003 Oct 14
3
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
BLOCK DIAGRAM
handbook, full pagewidth
WAKE-UP
MODE CONTROL
DRIVER
TEMPERATURE
PROTECTION
V SPLIT
CANH
CANL
SPLIT
VCC
5
TXD
VCC
1
STB
8
RXD
4
3
7
6
WAKE-UP
FILTER
TIME-OUT &
SLOPE
MUX
GND
MGU161
2
TJA1040
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
TXD
1
transmit data input
GND
2
ground supply
V
CC
3
supply voltage
RXD
4
receive data output; reads out data
from the bus lines
SPLIT
5
common-mode stabilization output
CANL
6
LOW-level CAN bus line
CANH
7
HIGH-level CAN bus line
STB
8
standby mode control input
handbook, halfpage
MGU160
TJA1040T
1
2
3
4
8
7
6
5
STB
CANH
CANL
SPLIT
TXD
GND
VCC
RXD
Fig.2 Pin configuration.
2003 Oct 14
4
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
FUNCTIONAL DESCRIPTION
Operating modes
The TJA1040 provides two modes of operation which are
selectable via pin STB. See Table 1 for a description of the
modes of operation.
Table 1
Operating modes
N
ORMAL MODE
In this mode the transceiver is able to transmit and receive
data via the bus lines CANH and CANL. See Fig.1 for the
block diagram. The differential receiver converts the
analog data on the bus lines into digital data which is
output to pin RXD via the multiplexer (MUX). The slope of
the output signals on the bus lines is fixed and optimized
in a way that lowest ElectroMagnetic Emission (EME) is
guaranteed.
S
TANDBY MODE
In this mode the transmitter and receiver are switched off,
and the low-power differential receiver will monitor the bus
lines. A HIGH level on pin STB activates this low-power
receiver and the wake-up filter, and after t
BUS
the state of
the CAN bus is reflected on pin RXD.
The supply current on V
CC
is reduced to a minimum in
such a way that ElectroMagnetic Immunity (EMI) is
guaranteed and a wake-up event on the bus lines will be
recognized.
In this mode the bus lines are terminated to ground to
reduce the supply current (I
CC
) to a minimum. A diode is
added in series with the high-side driver of RXD to prevent
a reverse current from RXD to V
CC
in the unpowered state.
In normal mode this diode is bypassed. This diode is not
bypassed in standby mode to reduce current consumption.
Split circuit
Pin SPLIT provides a DC stabilized voltage of 0.5V
CC
. It is
turned on only in normal mode. In standby mode pin SPLIT
is floating. The V
SPLIT
circuit can be used to stabilize the
recessive common-mode voltage by connecting pin SPLIT
to the centre tap of the split termination (see Fig.4). In case
of a recessive bus voltage <0.5V
CC
due to the presence of
an unsupplied transceiver in the network with a significant
leakage current from the bus lines to ground, the split
circuit will stabilize this recessive voltage to 0.5V
CC
. So a
start of transmission does not cause a step in the
common-mode signal which would lead to poor
ElectroMagnetic Emission (EME) behaviour.
Wake-up
In the standby mode the bus lines are monitored via a
low-power differential comparator. Once the low-power
differential comparator has detected a dominant bus level
for more than t
BUS
, pin RXD will become LOW.
Over-temperature detection
The output drivers are protected against over-temperature
conditions. If the virtual junction temperature exceeds the
shutdown junction temperature T
j(sd)
, the output drivers will
be disabled until the virtual junction temperature becomes
lower than T
j(sd)
and TXD becomes recessive again.
By including the TXD condition, the occurrence of output
driver oscillation due to temperature drifts is avoided.
TXD dominant time-out function
A `TXD dominant time-out' timer circuit prevents the bus
lines from being driven to a permanent dominant state
(blocking all network communication) if pin TXD is forced
permanently LOW by a hardware and/or software
application failure. The timer is triggered by a negative
edge on pin TXD.
If the duration of the LOW level on pin TXD exceeds the
internal timer value (t
dom
), the transmitter is disabled,
driving the bus lines into a recessive state. The timer is
reset by a positive edge on pin TXD. The TXD dominant
time-out time t
dom
defines the minimum possible bit rate of
40 kBaud.
Fail-safe features
Pin TXD provides a pull-up towards V
CC
in order to force a
recessive level in case pin TXD is unsupplied.
Pin STB provides a pull-up towards V
CC
in order to force
the transceiver into standby mode in case pin STB is
unsupplied.
In the event that the V
CC
is lost, pins TXD, STB and RXD
will become floating to prevent reverse supplying
conditions via these pins.
MODE
PIN
STB
PIN RXD
LOW
HIGH
normal
LOW
bus dominant
bus recessive
standby
HIGH
wake-up request
detected
no wake-up
request detected
2003 Oct 14
5
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Equivalent to discharging a 100 pF capacitor via a 1.5 k
series resistor.
2. Equivalent to discharging a 200 pF capacitor via a 0.75
H series inductor and a 10
series resistor.
3. Junction temperature in accordance with IEC 60747-1. An alternative definition of T
vj
is: T
vj
= T
amb
+ P
R
th(vj-amb)
,
where R
th(vj-amb)
is a fixed value to be used for the calculating of T
vj
. The rating for T
vj
limits the allowable
combinations of power dissipation (P) and ambient temperature (T
amb
).
THERMAL CHARACTERISTICS
In accordance with IEC 60747-1.
QUALITY SPECIFICATION
Quality specification in accordance with
"AEC-Q100".
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CC
supply voltage
no time limit
-
0.3
+6
V
operating range
4.75
5.25
V
V
TXD
DC voltage on pin TXD
-
0.3
V
CC
+ 0.3 V
V
RXD
DC voltage on pin RXD
-
0.3
V
CC
+ 0.3 V
V
STB
DC voltage on pins STB
-
0.3
V
CC
+ 0.3 V
V
CANH
DC voltage on pin CANH
0 < V
CC
< 5.25 V; no time limit
-
27
+40
V
V
CANL
DC voltage on pin CANL
0 < V
CC
< 5.25 V; no time limit
-
27
+40
V
V
SPLIT
DC voltage on pin SPLIT
0 < V
CC
< 5.25 V; no time limit
-
27
+40
V
V
trt
transient voltages on pins CANH,
CANL and SPLIT
according to ISO 7637; see Fig.5
-
200
+200
V
V
esd
electrostatic discharge voltage
Human Body Model (HBM); note 1
pins CANH and CANL
and SPLIT
-
6
+6
kV
all other pins
-
4
+4
kV
Machine Model (MM); note 2
-
200
+200
V
T
vj
virtual junction temperature
note 3
-
40
+150
C
T
stg
storage temperature
-
55
+150
C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(vj-a)
thermal resistance from virtual junction
to ambient in SO8 package
in free air
145
K/W
R
th(vj-s)
thermal resistance from virtual junction
to substrate of bare die
in free air
50
K/W
2003 Oct 14
6
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
CHARACTERISTICS
V
CC
= 4.75 to 5.25 V, T
vj
=
-
40 to +150
C and R
L
= 60
unless specified otherwise; all voltages are defined with
respect to ground; positive currents flow into the IC; note 1.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply (pin V
CC
)
I
CC
supply current
standby mode
5
10
15
A
normal mode
recessive; V
TXD
= V
CC
2.5
5
10
mA
dominant; V
TXD
= 0 V
30
50
70
mA
Transmit data input (pin TXD)
V
IH
HIGH-level input voltage
2
-
V
CC
+ 0.3 V
V
IL
LOW-level input voltage
-
0.3
-
+0.8
V
I
IH
HIGH-level input current
V
TXD
= V
CC
-
5
0
+5
A
I
IL
LOW-level input current
normal mode; V
TXD
= 0 V
-
100
-
200
-
300
A
C
i
input capacitance
not tested
-
5
10
pF
Standby mode control input (pin STB)
V
IH
HIGH-level input voltage
2
-
V
CC
+ 0.3 V
V
IL
LOW-level input voltage
-
0.3
-
+0.8
V
I
IH
HIGH-level input current
V
STB
= V
CC
-
0
-
A
I
IL
LOW-level input current
V
STB
= 0 V
-
1
-
4
-
10
A
Receive data output (pin RXD)
V
OH
HIGH-level output voltage
standby mode;
I
RXD
=
-
100
A
V
CC
-
1.1 V
CC
-
0.7 V
CC
-
0.4 V
I
OH
HIGH-level output current
normal mode;
V
RXD
= V
CC
-
0.4 V
-
0.1
-
0.4
-
1
mA
I
OL
LOW-level output current
V
RXD
= 0.4 V
2
6
12
mA
Common-mode stabilization output (pin SPLIT)
V
O
output voltage
normal mode;
-
500
A < I
O
< +500
A
0.3V
CC
0.5V
CC
0.7V
CC
V
I
L
leakage current
standby mode;
-
22 V < V
SPLIT
< +35 V
-
0
5
A
Bus lines (pins CANH and CANL)
V
O(dom)
dominant output voltage
V
TXD
= 0 V
pin CANH
3
3.6
4.25
V
pin CANL
0.5
1.4
1.75
V
V
O(dom)(m)
matching of dominant output
voltage (V
CC
- V
CANH
- V
CANL
)
-
100
0
+150
mV
V
O(dif)(bus)
differential bus output voltage
(V
CANH
-
V
CANL
)
V
TXD
= 0 V; dominant;
45
< R
L
< 65
1.5
-
3.0
V
V
TXD
= V
CC
; recessive;
no load
-
50
-
+50
mV
2003 Oct 14
7
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
Note
1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at 125
C
ambient temperature for dies on wafer level, and in addition to this 100% tested at 25
C ambient temperature for
cased products; unless specified otherwise. For bare dies, all parameters are only guaranteed with the backside of
the die connected to ground.
V
O(reces)
recessive output voltage
normal mode; V
TXD
= V
CC
;
no load
2
0.5V
CC
3
V
standby mode; no load
-
0.1
0
+0.1
V
I
O(sc)
short-circuit output current
V
TXD
= 0 V
pin CANH; V
CANH
= 0 V
-
40
-
70
-
95
mA
pin CANL; V
CANL
= 40 V 40
70
100
mA
I
O(reces)
recessive output current
-
27 V < V
CAN
< +32 V
-
2.5
-
+2.5
mA
V
dif(th)
differential receiver threshold
voltage
-
12 V < V
CANL
< +12 V;
-
12 V < V
CANH
< +12 V
normal mode (see Fig.6) 0.5
0.7
0.9
V
standby mode
0.4
0.7
1.15
V
V
hys(dif)
differential receiver hysteresis
voltage
normal mode;
-
12 V < V
CANL
< +12 V;
-
12 V < V
CANH
< +12 V
50
70
100
mV
I
LI
input leakage current
V
CC
= 0 V;
V
CANH
= V
CANL
= 5 V
-
5
0
+5
A
R
i(cm)
common-mode input
resistance
standby or normal mode
15
25
35
k
R
i(cm)(m)
common-mode input
resistance matching
V
CANH
= V
CANL
-
3
0
+3
%
R
i(dif)
differential input resistance
standby or normal mode
25
50
75
k
C
i(cm)
common-mode input
capacitance
V
TXD
= V
CC
; not tested
-
-
20
pF
C
i(dif)
differential input capacitance
V
TXD
= V
CC
; not tested
-
-
10
pF
Timing characteristics; see Fig.8
t
d(TXD-BUSon)
delay TXD to bus active
normal mode
25
70
110
ns
t
d(TXD-BUSoff)
delay TXD to bus inactive
10
50
95
ns
t
d(BUSon-RXD)
delay bus active to RXD
15
65
115
ns
t
d(BUSoff-RXD)
delay bus inactive to RXD
35
100
160
ns
t
PD(TXD-RXD)
propagation delay TXD to RXD V
STB
= 0 V
40
-
255
ns
t
dom(TXD)
TXD dominant time-out
V
TXD
= 0 V
300
600
1000
s
t
BUS
dominant time for wake-up via
bus
standby mode
0.75
1.75
5
s
t
d(stb-norm)
delay standby mode to normal
mode
normal mode
5
7.5
10
s
Thermal shutdown
T
j(sd)
shutdown junction temperature
155
165
180
C
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2003 Oct 14
8
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
APPLICATION AND TEST INFORMATION
handbook, full pagewidth
SPLIT
TJA1040
5
CANH
VCC
VCC
7
3
8
Port x
RXD
MICROCONTROLLER
TXD
STB
CANL
6
MGU164
1
2
TXD
4
RXD
5 V
BAT
Fig.3 Typical application for 5 V microcontroller.
More application information is available in a separate application note.
handbook, full pagewidth
GND
VCC
TJA1040
SPLIT
CANH
60
60
R
VSPLIT = 0.5VCC
in normal mode;
otherwise floating
R
CANL
MGU162
Fig.4 Stabilization circuitry and application.
2003 Oct 14
9
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
handbook, full pagewidth
500 kHz
100 nF
47
F
+
5 V
1 nF
1 nF
TRANSIENT
GENERATOR
CANL
CANH
MGW336
VCC
SPLIT
RXD
TJA1040
8
2
GND
STB
15 pF
4
TXD
1
3
7
6
5
Fig.5 Test circuit for automotive transients.
The waveforms of the applied transients will be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, 3b, 5, 6 and 7.
handbook, full pagewidth
MGS378
VRXD
HIGH
LOW
hysteresis
0.5
0.9
Vi(dif)(bus) (V)
Fig.6 Hysteresis of the receiver.
2003 Oct 14
10
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
handbook, full pagewidth
100 nF
47
F
+
5 V
MGW335
VCC
SPLIT
RXD
TJA1040
8
2
GND
STB
15 pF
4
5
TXD
1
3
CL
100 pF
RL
60
7
6
CANL
CANH
Fig.7 Test circuit for timing characteristics.
handbook, full pagewidth
MGS377
td(TXD-BUSon)
tPD(TXD-RXD)
tPD(TXD-RXD)
0.3VCC
0.7VCC
0.9 V
0.5 V
HIGH
LOW
CANH
TXD
RXD
CANL
Vi(dif)(bus)
(1)
HIGH
recessive
(BUS off)
dominant
(BUS on)
LOW
td(TXD-BUSoff)
td(BUSon-RXD)
td(BUSoff-RXD)
Fig.8 Timing diagram.
(1) V
i(dif)(bus)
= V
CANH
-
V
CANL
.
2003 Oct 14
11
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
BONDING PAD LOCATIONS
Note
1. All x/y coordinates represent the position of the centre
of each pad (in
m) with respect to the left hand
bottom corner of the top aluminium layer (see Fig.9).
SYMBOL
PAD
COORDINATES
(1)
x
y
TXD
1
119.5
114.5
GND
2
648.5
85
V
CC
3
1214.25
114.5
RXD
4
1635.25
114.5
SPLIT
5
1516.5
1275
CANL
6
990.5
1273.75
CANH
7
530.25
1273.75
STB
8
113.75
1246
handbook, halfpage
MBL584
8
TJA1040U
7
6
5
1
2
3
4
y
x
0
0
test pad 1
test pad 2
Fig.9 Bonding pad locations.
The backside of the bare die must be connected to ground.
2003 Oct 14
12
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
PACKAGE OUTLINE
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.0
0.4
SOT96-1
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03
MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15
0.05
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.01
0.041
0.004
0.039
0.016
0
2.5
5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
99-12-27
03-02-18
2003 Oct 14
13
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 270
C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
below 220
C (SnPb process) or below 245
C (Pb-free
process)
for all BGA and SSOP-T packages
for packages with a thickness
2.5 mm
for packages with a thickness < 2.5 mm and a
volume
350 mm
3
so called thick/large packages.
below 235
C (SnPb process) or below 260
C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250
C or 265
C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
C.
2003 Oct 14
14
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
"(LF)BGA Application Note" (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217
C
10
C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Hot bar or manual soldering is suitable for PMFP packages.
REVISION HISTORY
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, SSOP-T
(3)
, TFBGA, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
not suitable
(4)
suitable
PLCC
(5)
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
(5)(6)
suitable
SSOP, TSSOP, VSO, VSSOP
not recommended
(7)
suitable
PMFP
(8)
not suitable
not suitable
REV
DATE
CPCN
DESCRIPTION
6
20031014
200307014
Product specification (9397 750 11837)
Modification:
Change `V
th(dif)
= 0.5 V' in standby mode into `V
dif(th)
= 0.4 V'
Add Chapter REVISION HISTORY
5
20030219
-
Product specification (9397 750 10887)
2003 Oct 14
15
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
LEVEL
DATA SHEET
STATUS
(1)
PRODUCT
STATUS
(2)(3)
DEFINITION
I
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status `Production'), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2003 Oct 14
16
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
Bare die
All die are tested and are guaranteed to
comply with all data sheet limits up to the point of wafer
sawing for a period of ninety (90) days from the date of
Philips' delivery. If there are data sheet limits not
guaranteed, these will be separately indicated in the data
sheet. There are no post packing tests performed on
individual die or wafer. Philips Semiconductors has no
control of third party procedures in the sawing, handling,
packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device
functionality or performance of the die or systems after
third party sawing, handling, packing or assembly of the
die. It is the responsibility of the customer to test and
qualify their application in which the die is used.
Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Philips Semiconductors a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Printed in The Netherlands
R16/06/pp
17
Date of release:
2003 Oct 14
Document order number:
9397 750 11837
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