1999 Sep 27

Philips Semiconductors

Preliminary specification

High speed CAN transceiver

TJA1050

FEATURES

Fully compatible with the

"ISO 11898" standard

High speed (up to 1 Mbaud)

Transmit Data (TXD) dominant time-out function

Bus lines protected against transients in an automotive
environment

Silent mode in which the transmitter is disabled

Differential receiver with wide common-mode range for
high ElectroMagnetic Immunity (EMI)

Input levels compatible with 3.3 V devices

Thermally protected

Short-circuit proof to battery and ground

An unpowered node does not disturb the bus lines

At least 110 nodes can be connected.

GENERAL DESCRIPTION

The TJA1050 is the interface between the CAN protocol
controller and the physical bus. The device provides
differential transmit capability to the bus and differential
receive capability to the CAN controller.

The TJA1050 is the successor to the PCA82C250 high
speed CAN transceiver. The most important
improvements are:

Much lower ElectroMagnetic Emission (EME) due to
optimal matching of the CANH and CANL output signals

Improved behaviour in case of an unpowered node.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage

4.75

5.25

CANH

DC voltage at CANH

0 < V

< 5.25 V; no time limit

+40

CANL

DC voltage at CANL

i(dif)(bus)

differential bus input voltage

dominant

1.5

PD(TXD-RXD)

propagation delay TXD to RXD;
see Fig.4

= 0 V

250

amb

operating ambient temperature

+125

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TJA1050T

SO8

plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

TJA1050U

bare die

1999 Sep 27

Philips Semiconductors

Preliminary specification

High speed CAN transceiver

TJA1050

FUNCTIONAL DESCRIPTION

The TJA1050 is the interface between the CAN protocol
controller and the physical bus. It is primarily intended for
high speed automotive applications using baud rates from
40 kbaud up to 1 Mbaud. It provides differential transmit
capability to the bus and differential receiver capability to
the CAN protocol controller. It is fully compatible to the
"ISO 11898" standard.

A current-limiting circuit protects the transmitter output
stage from damage caused by accidental short-circuit to
either positive or negative battery voltage, although power
dissipation increases during this fault condition.

A thermal protection circuit protects the IC from damage by
switching off the transmitter if the junction temperature
exceeds a value of approximately 165

C. Because the

transmitter dissipates most of the power, the power
dissipation and temperature of the IC is reduced. All other
IC functions continue to operate. The transmitter off-state
resets when TXD goes HIGH. The thermal protection
circuit is particularly needed when a bus line short-circuits.

The CANH and CANL lines are protected from automotive
electrical transients (according to

"ISO 7637"; see Fig.6)

and are also protected from Electro-Static-Discharge
(ESD) of up to 4 kV from the human body.

Control line S (pin 8) allows two operating modes to be
selected; high speed mode or silent mode.

High speed mode is the normal operating mode and is
selected by connecting pin S to ground. It is the default
mode if pin S is unconnected.

In the silent mode, the transmitter is disabled. All other IC
functions continue to operate. The silent mode is selected
by connecting pin S to V

A `TXD Dominant Time-out' timer circuit prevents the bus
lines being driven to a permanent dominant state (blocking
all network communication) if TXD is forced permanently
LOW by a hardware and/or software application failure.
The timer is triggered by a negative edge on TXD. If the
duration of the LOW-level on TXD exceeds the internal
timer value, the transmitter is disabled, driving the bus into
a recessive state. The timer is reset by a positive edge on
TXD.

Table 1

Function table of the CAN transceiver

(X = don't care)

TXD

CANH

CANL

BUS STATE RXD

4.75 to 5.25 V

0 (or floating)

HIGH

LOW

dominant

4.75 to 5.25 V

0.5

recessive

4.75 to 5.25 V

1 (or floating)

0.5

recessive

<2 V (not powered)

0 V <CANH< V

0 V <CANL< V

recessive

2 V < V

< 4.75 V

>2 V

0 V <CANH< V

0 V <CANL< V

recessive

1999 Sep 27

Philips Semiconductors

Preliminary specification

High speed CAN transceiver

TJA1050

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134). All voltages are referenced to GND (pin 2).
Positive currents flow into the IC.

Notes

1. The waveforms of the applied transients shall be in accordance with

"ISO 7637 part 1", test pulses 1, 2, 3a and 3b,

(see Fig.6).

2. In accordance with

"IEC 747-1". An alternative definition of T

is: T

= T

amb

+ P

th(j-a)

, where R

th(j-a)

is a fixed value

to be used for the calculation of T

. The rating for T

limits the allowable combinations of power dissipation (P) and

ambient temperature (T

amb

3. Human body model; C = 100 pF R = 1.5 k

4. Machine model; C = 200 pF R = 25

THERMAL CHARACTERISTICS
According to IEC 747-1.

QUALITY SPECIFICATION

Quality specification

"SNW-FQ-611 part D" is applicable.

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage

0.3

+5.25

CANL

, V

CANH

DC voltage at CANL and CANH

0 < V

< 5.25 V;

no time limit

+40

TXD

, V

RXD

ref

and V

DC voltage at TXD, RXD, V

ref

and S

0.3

+ 0.3

trt(CANH)

trt(CANL)

transient voltage at CANH and CANL

time limit is 1

+55

note 1

200

+200

esd

electrostatic discharge at CANH; CANL

note 3

electrostatic discharge at TXD; V

;

RXD; V

ref

and S

note 3

electrostatic discharge at all pins

note 4

200

+200

stg

storage temperature

+150

amb

operating ambient temperature

+125

junction temperature

note 2

+150

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-a)

thermal resistance from junction to
ambient; TJA1050T(SO8)

in free air

160

K/W

1999 Sep 27

Philips Semiconductors

Preliminary specification

High speed CAN transceiver

TJA1050

CHARACTERISTICS
V

= 4.75 to 5.25 V; T

amb

40 to +125

C; R

= 60

unless specified otherwise; all voltages are referenced to GND

(pin 2); positive currents flow into the IC; all parameters are guaranteed over the ambient temperature range by design,
but only 100% tested at T

amb

= 25

C unless specified otherwise.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply (V

)

supply current

dominant; V

TXD

= 0 V

tbf

recessive; V

TXD

= V

tbf

Transmitter data input (TXD)

HIGH-level input voltage

output recessive

2.0

+ 0.3

LOW-level input voltage

output dominant

0.3

+0.8

HIGH-level input current

TXD

= V

+30

LOW-level input current

TXD

= 0 V

100

200

300

i(TXD)

TXD input capacitance

not tested

tbf

Mode select input (S)

HIGH-level input voltage

silent mode

2.0

+ 0.3

LOW-level input voltage

high speed mode

0.3

+0.8

HIGH-level input current

= V

100

LOW-level input current

= 0 V

+30

Receiver data output (RXD)

HIGH-level output current

RXD

= 0.7 V

tbf

LOW-level output current

RXD

= 0.45 V

8.5

ref

ref

reference output voltage

A < I

Vref

< 50

0.45V

0.5V

0.55V

Bus lines (CANH; CANL)

CANH(reces)

;

CANL(reces)

recessive bus voltage

TXD

= V

; no load

2.0

3.0

o(CANH)(reces)

;

o(CANL)(reces)

recessive output current

27 V < V

CANH

CANL

< 32 V;

0 V < V

< 5.25 V

2.5

+2.5

o(CANH)

CANH dominant output
voltage

TXD

= 0 V

2.8

4.5

o(CANL)

CANL dominant output
voltage

0.5

2.0

i(dif)(bus)

differential bus input voltage
(V

CANH

CANL

)

TXD

= 0 V;

42.5 < R

< 60

(dominant)

1.5

3.0

TXD

= V

; no load

(recessive)

500

+50

o(sc)(CANH)

CANH short-circuit output
current

CANH

= 0 V;

TXD

= 0 V

o(sc)(CANL)

CANL short-circuit output
current

CANL

= 36 V;

TXD

= 0 V

150

1999 Sep 27

Philips Semiconductors

Preliminary specification

High speed CAN transceiver

TJA1050

dif(th)

differential receiver threshold
voltage

12 V < V

CANH,

CANL

< 12 V; see Fig.5

0.5

0.7

0.9

i(dif)(hys)

differential receiver input
voltage hysteresis

see Fig.5

100

200

i(cm)(CANH)

;

i(cm)(CANL)

CANH; CANL common
mode input resistance

i(cm)(m)

matching between CANH
and CANL common mode
input resistance

CANH

= V

CANL

i(dif)

differential input resistance

100

i(CANH)

;

i(CANL)

CANH; CANL input
capacitance

TXD

= V

; not tested

i(dif)

differential input capacitance

LI(CANH)

;

LI(CANL)

CANH; CANL input leakage
current

= 0 V;

CANH

= V

CANL

= 5 V

500

Thermal shutdown

j(sd)

shutdown junction
temperature

155

165

180

Timing characteristics (see Figs 3 and 4)

d(TXD-BUSon)

delay TXD to bus active

= 0 V

tbf

150

d(TXD-BUSoff)

delay TXD to bus inactive

d(BUSon-RXD)

delay bus active to RXD

tbf

100

d(BUSoff-RXD)

delay bus inactive to RXD

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1999 Sep 27

Philips Semiconductors

Preliminary specification

High speed CAN transceiver

TJA1050

PACKAGE OUTLINE

UNIT

max.

(1)

(2)

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

1.75

0.25
0.10

1.45
1.25

0.25

0.49
0.36

0.25
0.19

5.0
4.8

4.0
3.8

1.27

6.2
5.8

1.05

0.7
0.6

0.7
0.3

8
0

0.25

0.1

0.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1.0
0.4

SOT96-1

detail X

(A )

pin 1 index

076E03S

MS-012AA

0.069

0.010
0.004

0.057
0.049

0.01

0.019
0.014

0.0100
0.0075

0.20
0.19

0.16
0.15

0.050

0.244
0.228

0.028
0.024

0.028
0.012

0.01

0.041

0.004

0.039
0.016

2.5

5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

95-02-04
97-05-22

1999 Sep 27

Philips Semiconductors

Preliminary specification

High speed CAN transceiver

TJA1050

SOLDERING

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferable be kept below 230

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

1999 Sep 27

Philips Semiconductors

Preliminary specification

High speed CAN transceiver

TJA1050

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

PACKAGE

SOLDERING METHOD

WAVE

REFLOW

(1)

BGA, SQFP

not suitable

suitable

HLQFP, HSQFP, HSOP, HTSSOP, SMS

not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO

not recommended

(5)

suitable

1999 Sep 27

Philips Semiconductors

Preliminary specification

High speed CAN transceiver

TJA1050

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

BARE DIE DISCLAIMER

All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately
indicated in the data sheet. There is no post waffle pack testing performed on individual die. Although the most modern
processes are utilized for wafer sawing and die pick and place into waffle pack carriers, Philips Semiconductors has no
control of third party procedures in the handling, packing or assembly of the die. Accordingly, Philips Semiconductors
assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of
the die. It is the responsibility of the customer to test and qualify their application in which the die is used.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999

Philips Semiconductors a worldwide company

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

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Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
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Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,
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Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399

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Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,
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Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,
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Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

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Portugal: see Spain

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Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398

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04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
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Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777

Printed in The Netherlands

285002/01/pp

Date of release:

1999 Sep 27

Document order number:

9397 750 05732

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