1.
General description
The TJA1080 is a FlexRay transceiver, which is compatible with the FlexRay electrical
physical layer specification V2.1 Rev. A (see
Ref. 1
). It is primarily intended for
communication systems from 1 Mbit/s to 10 Mbit/s, and provides an advanced interface
between the protocol controller and the physical bus in a FlexRay network.
The TJA1080 can be configured to be used as an active star transceiver or as a node
transceiver.
The TJA1080 provides differential transmit capability to the network and differential
receive capability to the FlexRay controller. It offers excellent EMC performance as well as
high ESD protection.
The TJA1080 actively monitors the system performance using dedicated error and status
information (readable by any microcontroller), as well as internal voltage and temperature
monitoring.
The TJA1080 supports the mode control as used in Philips TJA1054 (see
Ref. 2
) and
TJA1041 (see
Ref. 3
) CAN transceivers.
2.
Features
2.1 Optimized for time triggered communication systems
I
Data transfer up to 10 Mbit/s
I
Usable for 14 V and 42 V powered systems
I
Very low ElectroMagnetic Emission (EME) to support unshielded cable
I
Differential receiver with high common-mode range for ElectroMagnetic Immunity
(EMI)
I
Transceiver can be used for small linear passive bus topologies as well as active star
topologies
I
Auto I/O level adaptation to host controller supply voltage V
IO
I
Bus guardian interface included
I
Automotive product qualification in accordance with AEC-Q100
TJA1080
FlexRay transceiver
Rev. 01 -- 20 July 2006
Preliminary data sheet
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
2 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
2.2 Low power management
I
Low power management including two inhibit switches
I
Very low current in Sleep and Standby mode
I
Wake-up via wake-up symbol on the bus lines (remote), negative edge on pin WAKE
(local), and a positive edge on pin STBN if V
IO
is present
I
Wake-up source recognition
I
Automatic power-down (in star Sleep mode) in star configuration
2.3 Diagnosis (detection and signalling)
I
Overtemperature detection
I
Short-circuit on bus lines
I
V
BAT
power-on flag (first battery connection and cold start)
I
Pin TXEN and pin BGE clamping
I
Undervoltage detection on pins V
BAT
, V
CC
and V
IO
I
Wake source indication
2.4 Protections
I
Bus pins protected against 8 kV HBM ESD pulses
I
Bus pins protected against transients in automotive environment (ISO 7637 class C
compliant)
I
Bus pins short-circuit proof to battery voltage (14 V and 42 V) and ground
I
Fail-safe mode in case of an undervoltage on pins V
BAT
, V
CC
or V
IO
I
Passive behavior of bus lines in the event that transceiver is not powered up
3.
Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
BAT
supply voltage on pin V
BAT
no time limit
-
0.3
-
+60
V
operating range
6.5
-
60
V
V
CC
supply voltage
no time limit
-
0.3
-
+5.5
V
operating range
4.75
-
5.25
V
V
BUF
supply voltage on pin V
BUF
no time limit
-
0.3
-
+5.5
V
operating range
4.75
-
5.25
V
V
IO
supply voltage on pin V
IO
no time limit
-
0.3
-
+5.5
V
operating range
2.2
-
5.25
V
V
TRXD0
voltage on pin TRXD0
-
0.3
+5.5
V
V
TRXD1
voltage on pin TRXD1
-
0.3
+5.5
V
V
BP
voltage on pin BP
-
60
-
+60
V
V
BM
voltage on pin BM
-
60
-
+60
V
I
BAT
supply current on pin V
BAT
low power modes in
node configuration
-
35
50
A
normal power modes
-
0.075
1
mA
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
3 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
[1]
Current flows from V
CC
to V
BUF
. This means that the maximum sum current I
CC
+ I
BUF
is 35 mA.
[2]
In accordance with IEC 60747-1. An alternative definition of virtual junction temperature T
vj
is: T
vj
= T
amb
+ TD x R
th(j-a)
, where R
th(j-a)
is
a fixed value to be used for the calculation of T
vj
. The rating for T
vj
limits the allowable combinations of power dissipation (P) and
ambient temperature (T
amb
).
4.
Ordering information
I
CC
supply current
low power modes
-
1
0
+5
A
Normal mode; V
BGE
=
0 V; V
TXEN
= V
IO
;
Receive only mode; star
Idle mode
-
10
15
mA
Normal mode; V
BGE
=
V
IO
; V
TXEN
= 0 V; V
BUF
open
[1]
-
28.5
35
mA
Normal mode;
V
BGE
= V
IO
; V
TXEN
= 0 V;
R
bus
=
-
10
15
mA
star Transmit mode
-
50
62
mA
star Receive mode
-
38
42
mA
I
IO
supply current on pin V
IO
low power modes
-
1
+1
+5
A
Normal and Receive
only mode; V
TXD
= V
IO
-
30
1000
A
V
OH(dif)
differential HIGH-level output voltage
on pins BP and BM;
40
< R
bus
< 55
;
V
CC
= V
BUF
= 5 V
600
800
1200
mV
V
OL(dif)
differential LOW-level output voltage
on pins BP and BM;
40
< R
bus
< 55
;
V
CC
= V
BUF
= 5 V
-
1200
-
800
-
600
mV
V
IH(dif)
differential HIGH-level input voltage
on pins BP and BM;
normal power modes;
-
10 V < V
BP
< +15 V;
-
10 V < V
BM
< +15 V
150
225
300
mV
V
IL(dif)
differential LOW-level input voltage
on pins BP and BM;
normal power modes;
-
10 V < V
BP
< +15 V;
-
10 V < V
BM
< +15 V
-
300
-
225
-
150
mV
T
vj
virtual junction temperature
[2]
-
40
-
+150
C
Table 1.
Quick reference data
...continued
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Table 2.
Ordering information
Type number
Package
Name
Description
Version
TJA1080TS/N
SSOP20
plastic shrink small outline package; 20 leads; body with 5.3 mm
SOT339-1
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
4 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
5.
Block diagram
Fig 1.
Block diagram
TRXD0
V
IO
V
BUF
V
BAT
INH2
INH1
SIGNAL
ROUTER
TRANS-
MITTER
BUS
FAILURE
DETECTION
NORMAL
RECEIVER
INPUT
VOLTAGE
ADAPTATION
OUTPUT
VOLTAGE
ADAPTATION
STATE
MACHINE
001aae436
TJA1080
V
CC
V
IO
BP
BM
TRXD1
TXD
RXD
RXDINT
RXDINT
V
BAT
ERRN
RXEN
WAKE-UP
DETECTION
OSCILLATOR
UNDERVOLTAGE
DETECTION
WAKE
OVER-
TEMPERATURE
DETECTION
LOW-
POWER
RECEIVER
TXEN
BGE
STBN
EN
11
10
4
19
20
14
5
7
13
18
1
2
17
12
15
16
GND
6
8
9
3
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
5 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
6.
Pinning information
6.1 Pinning
6.2 Pin description
Fig 2.
Pin configuration
TJA1080TS
INH2
V
BUF
INH1
V
CC
EN
BP
V
IO
BM
TXD
GND
TXEN
WAKE
RXD
V
BAT
BGE
ERRN
STBN
RXEN
TRXD1
TRXD0
001aae437
1
2
3
4
5
6
7
8
9
10
12
11
14
13
16
15
18
17
20
19
Table 3.
Pin description
Symbol Pin
Type
Description
INH2
1
O
inhibit 2 output for switching external voltage regulator
INH1
2
O
inhibit 1 output for switching external voltage regulator
EN
3
I
enable input; when HIGH enabled; internal pull-down
V
IO
4
P
supply voltage for V
IO
voltage level adaptation
TXD
5
I
transmit data input; internal pull-down
TXEN
6
I
transmitter enable input; when HIGH transmitter disabled; internal
pull-up
RXD
7
O
receive data output
BGE
8
I
bus guardian enable input; when LOW transmitter disabled; internal
pull-down
STBN
9
I
standby input; when LOW low power mode; internal pull-down
TRXD1
10
I/O
data bus line 1 for inner star connection
TRXD0
11
I/O
data bus line 0 for inner star connection
RXEN
12
O
receive data enable output; when LOW bus activity detected
ERRN
13
O
error diagnoses output; when LOW error detected
V
BAT
14
P
battery supply voltage
WAKE
15
I
local wake-up input; internal pull-up or pull-down (depends on
voltage at pin WAKE)
GND
16
P
ground
BM
17
I/O
bus line minus
BP
18
I/O
bus line plus
V
CC
19
P
supply voltage (+5 V)
V
BUF
20
P
buffer supply voltage
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
6 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
7.
Functional description
The block diagram of the total transceiver is illustrated in
Figure 1
.
7.1 Operating configurations
7.1.1 Node configuration
In node configuration the transceiver operates as a stand-alone transceiver.
The transceiver can be configured as node by connecting pins TRXD0 and TRXD1 to
ground during a power-on situation (PWON flag is set). The configuration will be latched
when the PWON flag is reset.
The following operating modes are selectable:
Normal: normal power mode
Receive: normal power mode
Standby: low power mode
Go-to-sleep: low power mode
Sleep: low power mode
7.1.2 Star configuration
In star configuration the transceiver operates as a branch of a FlexRay active star.
The transceiver can be configured as star by connecting pin TRXD0 or TRXD1 to V
BUF
during a PWON situation (PWON flag is set). The configuration will be latched when the
PWON flag is reset.
It is possible to redirect data from one branch to other branches via the inner bus. It is also
possible to send data to all branches via pin TXD, if pins TXEN and BGE have the correct
polarity.
The following operating modes are available:
Star idle: normal power mode
Star transmit: normal power mode
Star receive: normal power mode
Star sleep: low power mode
Star standby: low power mode
Star locked: normal power mode
In the star configuration all modes are autonomously controlled by the transceiver, except
in the case of a wake-up.
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
7 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
7.1.3 Bus activity and idle detection
The following mechanisms for activity and idle detection are valid for node and star
configurations in normal power modes:
If the absolute differential voltage on the bus lines is higher than
V
i(dif)det(act)
for
t
det(act)(bus)
, then activity is detected on the bus lines and pin RXEN is switched to LOW
which results in pin RXD being released
If, after bus activity detection, the differential voltage on the bus lines is higher than
V
IH(dif)
, pin RXD will go HIGH
If, after bus activity detection, the differential voltage on the bus lines is lower than
V
IL(dif)
, pin RXD will go LOW
If the absolute differential voltage on the bus lines is lower than
V
i(dif)det(act)
for
t
det(idle)(bus)
, then idle is detected on the bus lines and pin RXEN is switched to HIGH.
This results in pin RXD being blocked (pin RXD is switched to HIGH or stays HIGH)
Additionally, in star configuration, activity and idle can be detected:
If pin TXEN is LOW for longer than t
det(act)(TXEN)
, activity is detected on pin TXEN
If pin TXEN is HIGH for longer than t
det(idle)(TXEN)
, idle is detected on pin TXEN
If pin TRXD0 or TRXD1 is LOW for longer than t
det(act)(TRXD)
, activity is detected on
pins TRXD0 and TRXD1
If pin TRXD0 or TRXD1 is HIGH for longer than t
det(idle)(TRXD)
, idle is detected on pins
TRXD0 and TRXD1
7.2 Operating modes in node configuration
The TJA1080 provides two control pins STBN and EN in order to select one of the modes
of operation in node configuration. See
Table 4
for a detailed description of the pin
signalling in node configuration, and
Figure 3
for the timing diagram.
All modes are directly controlled via pins EN and STBN unless an undervoltage situation
is present.
If V
IO
and (V
BUF
or V
BAT
) are within their operating range, pin ERRN indicates the error
flag.
Table 4.
Pin signalling in node configuration
Pin
Mode
Normal
Receive only
Go-to-sleep
Standby
Sleep
STBN
HIGH
HIGH
LOW
LOW
LOW
EN
HIGH
LOW
HIGH
LOW
X
ERRN
LOW: error flag set
[3]
LOW: wake flag set
[4]
HIGH: error flag set
[3] [4]
HIGH: wake flag reset
[4]
RXEN
LOW: bus activity
LOW: wake flag set
[4]
HIGH: bus idle
HIGH: wake flag reset
[4]
RXD
LOW: bus DATA_0
LOW: wake flag set
[4]
HIGH: bus DATA_1 or idle
HIGH: wake flag reset
[4]
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
8 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
[3]
Pin ERRN provides a serial interface for retrieving diagnostic information.
[4]
Valid if V
IO
and V
BUF
or V
BAT
are present.
[5]
If wake flag is not set.
The state diagram in node configuration is illustrated in
Figure 4
.
INH1
HIGH
HIGH
HIGH
float
[4]
INH2
HIGH
float
[5]
float
[5]
float
[4]
Transmitter
enabled
disabled
[4]
disabled
[4]
Table 4.
Pin signalling in node configuration
...continued
Pin
Mode
Normal
Receive only
Go-to-sleep
Standby
Sleep
Fig 3.
Timing diagram in normal mode node configuration
001aae439
TXD
BGE
RXD
BM
BP
RXEN
TXEN
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
9 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
The state transitions are represented with numbers, which correspond with the numbers
in the last column of
Table 5
to
Table 8
.
(1) At the first battery connection the transceiver will enter the Standby mode.
Fig 4.
State diagram in node configuration
001aae438
NORMAL
STBN = 1
EN = 1
STANDBY
(1)
STBN = 0
EN = 0
SLEEP
STBN = 0
EN = X
GO-TO-SLEEP
STBN = 0
EN = 1
RECEIVE ONLY
STBN = 1
EN = 0
1
4
12, 22, 36
9, 18
11, 21
31, 32
7, 16, 39
3, 30
6, 33
10, 20
2
8, 17, 40
15, 25, 43, 44
5
19
23
26, 45, 46
27, 47, 48
37, 38
13, 34, 35
14, 24, 41, 42
28, 29
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
TJ
A1080_1
K
oninklijk
e Philips Electronics N.V
. 2006. All r
ights reser
v
ed.
Preliminar
y data sheet
Re
v
.
01 -- 20 J
u
l
y
2006
10 of 44
Philips Semiconductor
s
TJ
A1080
Fle
xRa
y transceiver
[1]
STBN must be set to LOW 60
s after EN.
[2]
Positive edge on pin STBN sets the wake flag.
[3]
Setting the wake flag clears the UV
VIO
, UV
VBAT
and UV
VCC
flag.
[4]
Hold time of go-to-sleep is less than the minimum hold time.
[5]
Hold time of go-to-sleep becomes greater than the minimum hold time.
Table 5.
State transitions forced by EN and STBN (node configuration)
indicates the action that initiates a transaction;
1 and
2 are the consequences of a transaction.
Transition
from mode
Direction to
mode
Transition
number
Pin
Flag
Note
STBN
EN
UV
VIO
UV
VBAT
UV
VCC
PWON
Wake
Normal
receive only
1
H
L
cleared
cleared
cleared
cleared
cleared
go-to-sleep
2
L
H
cleared
cleared
cleared
cleared
cleared
standby
3
L
L
cleared
cleared
cleared
cleared
cleared
[1]
Receive only
normal
4
H
H
cleared
cleared
cleared
X
X
go-to-sleep
5
L
H
cleared
cleared
cleared
X
X
standby
6
L
L
cleared
cleared
cleared
X
X
Standby
normal
7
H
H
cleared
cleared
2
cleared
X
1
set
[2][3]
receive only
8
H
L
cleared
cleared
2
cleared
X
1
set
[2][3]
go-to-sleep
9
L
H
cleared
cleared
X
X
X
Go-to-sleep
normal
10
H
H
cleared
cleared
cleared
X
1
set
[2][4]
receive only
11
H
L
cleared
cleared
cleared
X
1
set
[2][4]
standby
12
L
L
cleared
cleared
X
X
X
[4]
sleep
13
L
H
cleared
cleared
X
X
cleared
[5]
Sleep
normal
14
H
H
2
cleared
2
cleared
2
cleared
X
1
set
[2][3]
receive only
15
H
L
2
cleared
2
cleared
2
cleared
X
1
set
[2][3]
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
TJ
A1080_1
K
oninklijk
e Philips Electronics N.V
. 2006. All r
ights reser
v
ed.
Preliminar
y data sheet
Re
v
.
01 -- 20 J
u
l
y
2006
11 of 44
Philips Semiconductor
s
TJ
A1080
Fle
xRa
y transceiver
[1]
Setting the wake flag clears the UV
VIO
, UV
VBAT
and UV
VCC
flag.
Table 6.
State transitions forced by a wake-up (node configuration)
indicates the action that initiates a transaction;
1 and
2 are the consequences of a transaction.
Transition
from mode
Direction to
mode
Transition
number
Pin
Flag
Note
STBN
EN
Wake
UV
VIO
UV
VBAT
UV
VCC
PWON
Standby
normal
16
H
H
set
cleared
cleared
1
cleared
X
[1]
receive only
17
H
L
set
cleared
cleared
1
cleared
X
[1]
go-to-sleep
18
L
H
set
cleared
cleared
1
cleared
X
[1]
standby
19
L
L
set
cleared
cleared
1
cleared
X
[1]
Go-to-sleep
normal
20
H
H
set
cleared
cleared
cleared
X
receive only
21
H
L
set
cleared
cleared
cleared
X
standby
22
L
L
set
cleared
cleared
cleared
X
go-to-sleep
23
L
H
set
cleared
cleared
cleared
X
Sleep
normal
24
H
H
set
1
cleared
1
cleared
1
cleared
X
[1]
receive only
25
H
L
set
1
cleared
1
cleared
1
cleared
X
[1]
standby
26
L
L
set
1
cleared
1
cleared
1
cleared
X
[1]
go-to-sleep
27
L
H
set
1
cleared
1
cleared
1
cleared
X
[1]
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
TJ
A1080_1
K
oninklijk
e Philips Electronics N.V
. 2006. All r
ights reser
v
ed.
Preliminar
y data sheet
Re
v
.
01 -- 20 J
u
l
y
2006
12 of 44
Philips Semiconductor
s
TJ
A1080
Fle
xRa
y transceiver
[1]
UV
VIO
, UV
VBAT
or UV
VCC
detected clears the wake flag.
[2]
UV
VIO
overrules UV
VCC
.
[3]
UV
VBAT
overrules UV
VCC
.
Table 7.
State transitions forced by an undervoltage condition (node configuration)
indicates the action that initiates a transaction;
1 and
2 are the consequences of a transaction.
Transition from
mode
Direction to
mode
Transition
number
Flag
Note
UV
VIO
UV
VBAT
UV
VCC
PWON
Wake
Normal
sleep
28
set
cleared
cleared
cleared
1
cleared
[1]
sleep
29
cleared
set
cleared
cleared
1
cleared
[1]
standby
30
cleared
cleared
set
cleared
1
cleared
[1]
Receive only
sleep
31
set
cleared
cleared
X
1
cleared
[1]
sleep
32
cleared
set
cleared
X
1
cleared
[1]
standby
33
cleared
cleared
set
X
1
cleared
[1]
Go-to-sleep
sleep
34
set
cleared
cleared
X
1
cleared
[1]
sleep
35
cleared
set
cleared
X
1
cleared
[1]
standby
36
cleared
cleared
set
X
1
cleared
[1]
Standby
sleep
37
set
cleared
X
X
1
cleared
[1][2]
sleep
38
cleared
set
X
X
1
cleared
[1][3]
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
TJ
A1080_1
K
oninklijk
e Philips Electronics N.V
. 2006. All r
ights reser
v
ed.
Preliminar
y data sheet
Re
v
.
01 -- 20 J
u
l
y
2006
13 of 44
Philips Semiconductor
s
TJ
A1080
Fle
xRa
y transceiver
[1]
Recovery of UV
VCC
flag.
[2]
Recovery of UV
VBAT
flag.
[3]
Clearing the UV
VBAT
flag sets the wake flag.
[4]
Recovery of UV
VIO
flag.
Table 8.
State transitions forced by an undervoltage recovery (node configuration)
indicates the action that initiates a transaction;
1 and
2 are the consequences of a transaction.
Transition
from mode
Direction to
mode
Transition
number
Pin
Flag
Note
STBN
EN
UV
VIO
UV
VBAT
UV
VCC
PWON
Wake
Standby
normal
39
H
H
cleared
cleared
cleared
X
X
[1]
receive only
40
H
L
cleared
cleared
cleared
X
X
[1]
Sleep
normal
41
H
H
cleared
cleared
cleared
X
1
set
[2][3]
normal
42
H
H
cleared
cleared
cleared
X
X
[4]
receive only
43
H
L
cleared
cleared
cleared
X
1
set
[2][3]
receive only
44
H
L
cleared
cleared
cleared
X
X
[4]
standby
45
L
L
cleared
cleared
cleared
X
1
set
[2][3]
standby
46
L
L
cleared
cleared
cleared
X
X
[4]
go-to-sleep
47
L
H
cleared
cleared
cleared
X
1
set
[2][3]
go-to-sleep
48
L
H
cleared
cleared
cleared
X
X
[4]
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
14 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
7.2.1 Normal mode
In Normal mode the transceiver is able to transmit and receive data via the bus lines BP
and BM. The output of the normal receiver is directly connected to pin RXD.
The transmitter behavior in normal mode of operation, with no time-out present on pins
TXEN and BGE and the temperature flag not set is given in
Table 9
.
In this mode pins INH1 and INH2 are set HIGH.
7.2.2 Receive only mode
In receive only mode the transceiver can only receive data. The transmitter is disabled,
regardless of the voltages on pins BGE and TXEN.
In this mode pins INH1 and INH2 are set HIGH.
7.2.3 Standby mode
In Standby mode the transceiver enters a low power mode which means very low current
consumption. In the Standby mode the device is not able to transmit or receive data and
the low power receiver is activated to monitor bus activity.
Standby mode can be entered if the correct polarity is applied to pins EN and STBN (see
Figure 4
and
Table 5
) or an undervoltage is present on pin V
CC
; see
Figure 4
.
If an undervoltage is present on pin V
CC
, direct switching to a normal power mode is not
possible. By applying a positive edge on pin STBN and thus setting the wake flag, all
undervoltage flags are reset and therefore switching to a normal power mode is possible.
The transceiver will then enter the mode indicated on pins EN and STBN
In this mode the transceiver can be switched to any other mode if no undervoltage is
present on pins V
IO
and V
BAT
.
Pin INH1 is set to HIGH. If the wake flag is set, pin INH2 is set to HIGH and pins RXEN
and RXD are set to LOW, otherwise pin INH2 is floating and pins RXEN and RXD are set
to HIGH; see
Section 7.5
.
7.2.4 Go-to-sleep mode
In this mode the transceiver behaves as in Standby mode. If this mode is selected for a
longer time than the go-to-sleep command hold time (minimum hold time) and the wake
flag has been previously cleared, the transceiver will enter Sleep mode, regardless of the
voltage on pin EN.
If the voltage regulator that supplies the host is switched via pin INH1, pin EN becomes
LOW if pin INH1 is switched off.
Table 9.
Transmitter function table
BGE
TXEN
TXD
Transmitter
L
X
X
transmitter is disabled
X
H
X
transmitter is disabled
H
L
H
transmitter is enabled; the bus lines are actively driven; BP is driven
HIGH and BM is driven LOW
H
L
L
transmitter is enabled; the bus lines are actively driven; BP is driven
LOW and BM is driven HIGH
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
15 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
7.2.5 Sleep mode
In Sleep mode the transceiver has entered a low power mode. The only difference with
Standby mode is that pin INH1 is also set floating. Sleep mode is directly entered if the
UV
VIO
or UV
VBAT
flag is set.
In this mode the transceiver can be switched to any other mode if no undervoltage is
present on pins V
IO
, V
CC
and V
BAT
. In case of an undervoltage on pin V
CC
or V
BAT
while
V
IO
is present, the wake flag is set by a positive edge on pin STBN.
The undervoltage flags will be reset by setting the wake flag, and therefore the transceiver
will enter the mode indicated on pins EN and STBN if V
IO
is present.
A detailed description of the wake-up mechanism is given in
Section 7.5
.
7.3 Operating modes in star configuration
In star configuration mode control via pins EN and STBN is not possible. The transceiver
autonomously controls the operating modes except in the case of wake-up.
The timing diagram of a transceiver configured in star configuration is illustrated in
Figure 6
. The state diagram in star configuration is illustrated in
Figure 5
. A detailed
description of the pin signalling in star configuration is given in
Table 10
.
If V
IO
and (V
BUF
or V
BAT
) are within their operating range, pin ERRN will indicate the error
flag.
[1]
Valid if V
IO
and (V
BUF
or V
BAT
) are present.
[2]
TRXD lines are switched as input if TRXD activity is the initiator for star Transmit mode.
[3]
Pin ERRN provides a serial interface for retrieving diagnostic information.
[4]
TRXD lines switched as output if TXEN activity is the initiator for star Transmit mode.
Pin BGE has to be connected to pin V
IO
in order to enable the transmitter via pin TXEN. If
pin BGE is connected to ground, it is not possible to activate the transmitter via pin TXEN.
If pin TXEN is not used (no controller connected to the transceiver), it has to be connected
to pin V
IO
in order to prevent TXEN activity detection.
In all modes pin RXD is connected to the output of the normal mode receiver and
therefore represents the data on the bus lines.
Table 10.
Pin signalling in star configuration
Mode
TRXD0 /
TRXD1
ERRN
RXEN
RXD
Transmitter INH1
INH2
LOW
HIGH
LOW
HIGH
LOW
HIGH
Star Transmit output
[1]
input
[2]
error flag
set
[3]
error flag
reset
[3]
bus
activity
bus idle
bus
DATA_0
bus
DATA_1
enabled
HIGH
HIGH
Star Receive
output
disabled
[1]
Star Idle
input
Star Locked
input
Star Standby input
error flag
set
[1][3]
Error flag
reset
[1][3]
wake flag
set
[1]
wake flag
reset
[1]
wake flag
set
[1]
wake flag
reset
[1]
Star Sleep
input
float
[1]
float
[1]
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
16 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
Fig 5.
State diagram in star configuration
001aae441
STAR TRANSMIT
INH1 = HIGH
INH2 = HIGH
STAR IDLE
INH1 = HIGH
INH2 = HIGH
STAR LOCKED
INH1 = HIGH
INH2 = HIGH
STAR SLEEP
INH1 = floating
INH2 = floating
idle detected on
TRXD0, TRXD1,
TXEN and the
bus lines
TRXD0, TRXD1,
TXEN activity detected
STAR RECEIVE
INH1 = HIGH
INH2 = HIGH
STAR STANDBY
INH1 = HIGH
INH2 = HIGH
idle detected on
TRXD0, TRXD1,
TXEN and the
bus lines
idle detected on
the bus lines
and TXEN for longer
than t
to(locked-idle)
TXEN activity detected for
longer than t
to(tx-locked)
bus activity detected for
longer than t
to(rx-locked)
bus activity
detected
wake
flag 1
wake flag 1 or
UV
VCC
signal 0
no acivity on TRXD0,
TRXD1, TXEN and the
bus lines for longer
than t
to(idle-sleep)
from any mode if UV
VCC
flag is set regardless PWON flag
power-on
V
BAT
> V
BAT(PWON)
from star idle, star
transmit or star receive if
wake flag set and under
voltage present on V
CC
for longer than
t > t
to(uv)(VCC)
time in star
locked longer
than t
to(locked-sleep)
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
17 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
7.3.1 Star Idle mode
This mode is entered if one of the following events occurs:
From star Receive mode and star Transmit mode if idle is detected on the bus lines,
on pin TXEN and on pins TRXD0 and TRXD1.
If the transceiver is in star Locked mode and idle is detected on the bus lines and pin
TXEN for longer than t
to(locked-idle)
.
If the transceiver is in star Standby mode and the wake flag is set or no undervoltage
is present.
If the transceiver is in star Sleep mode and the wake flag is set, the transceiver enters
star Idle mode in order to obtain a stable starting point (no glitches on the bus lines
etc).
In star Idle mode the transceiver monitors pins TXEN, TRXD0 and TRXD1 and the
bus lines for activity. In this mode the transmitter is disabled.
TRXDOUT is a virtual signal that indicates the state of the TRXD lines. TRXDOUT HIGH means TRXD lines switched as
output. TRXDOUT LOW means TRXD lines switched as input.
Fig 6.
Timing diagram in star configuration
001aae440
TXEN
TXD
RXD
BM
BP
TRXD1
TRXD0
star transmit
star idle
star idle
star idle
star receive
star transmit
RXEN
TRXDOUT
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
18 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
7.3.2 Star Transmit mode
This mode is entered if one of the following events occur:
If the transceiver is in star Idle mode and activity is detected on pin TXEN.
If the transceiver is in star Idle mode and activity is detected on pins TRXD0 and
TRXD1.
In star Transmit mode the transmitter is enabled and the transceiver can transmit data on
the bus lines. It transmits the data received on pins TXD or TRXD0 and TRXD1 on the bus
lines.
7.3.3 Star Receive mode
This mode is entered if the transceiver is in star Idle mode and activity has been detected
on the bus lines.
In star Receive mode the transceiver transmit data via the TRXD0 and TRXD1 lines to
other transceivers connected to the bus lines. The transmitter is always disabled.
7.3.4 Star Standby mode
This mode is entered if one of the following events occur:
From star Idle, star Transmit or star Receive modes if the wake flag is set and an
undervoltage on pin V
CC
is present for longer than t
to(uv)(VCC)
.
If the PWON flag is set.
In star Standby mode the transceiver enters a low power mode. In this mode the current
consumption is as low as possible to prevent discharging the capacitor at pin V
BUF
.
If pins V
IO
and V
BUF
are within their temperature range, pins RXD and RXEN will indicate
the wake flag.
7.3.5 Star Sleep mode
This mode is entered if one of the following events occur:
From any mode if an undervoltage on pin V
CC
is present for longer than t
det(uv)(VCC)
.
If the transceiver is in star Idle mode and no activity is detected on the bus lines and
pins TXEN, TRXD0 and TRXD1 for longer than t
to(idle-sleep)
.
If star Locked mode is active for longer than t
to(locked-sleep)
.
In star Sleep mode the transceiver will enter a low power mode. In this mode the current
consumption is as low as possible to prevent the car battery from discharging. The inhibit
switches are switched off.
In this mode the wake flag wakes the transceiver. A detailed description of the wake-up
mechanism is given in
Section 7.5
.
If pins V
IO
and V
BUF
are within their temperature range, pins RXD and RXEN will indicate
the wake flag.
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
19 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
7.3.6 Star Locked mode
This mode is entered if one of the following events occur:
If the transceiver is in star Transmit mode and activity on pin TXEN is detected for
longer than t
to(tx-locked)
.
If the transceiver is in star Receive mode and activity is detected on the bus lines for
longer than t
to(rx-locked)
.
This mode is a fail-silent mode and in this mode the transmitter is disabled.
7.4 Start-up
7.4.1 Node configuration
Node configuration can be selected by applying a voltage lower than 0.3V
BUF
to pins
TRXD0 and TRXD1 during power-on. Node configuration is latched by resetting the
PWON flag while the voltage on pins TRXD0 and TRXD1 is lower than 0.3V
BUF
; see
Section 7.7.4
for (re)setting the PWON flag.
7.4.2 Star configuration
Star configuration can be selected by applying a voltage higher than 0.7V
BUF
to pins
TRXD0 or TRXD1 during power-on. Star configuration is latched by resetting the PWON
flag while one of the voltages on pins TRXD0 or TRXD1 is higher than 0.7V
BUF
. See
Section 7.7.4
for (re)setting the PWON flag. In this case the transceiver goes from node
Standby mode to star Idle mode.
7.5 Wake-up mechanism
7.5.1 Node configuration
If a node configured transceiver is in Sleep mode (pins INH1 and INH2 are switched off), it
will enter Standby mode or go-to-sleep mode (depending on the level at pin EN). In both
modes pin INH1 is switched on, pin INH2 is switched on or off depending on whether the
wake flag is set.
If no undervoltage is present on pins V
IO
and V
BAT
, the transceiver switches immediately
to the mode indicated on pins EN and STBN.
In Standby, go-to-sleep and Sleep mode pins RXD and RXEN are driven LOW if the wake
flag is set.
7.5.2 Star configuration
If a star configured transceiver is in Sleep mode (pins INH1 and INH2 are switched off) it
will enter star Idle mode (pins INH1 and INH2 are switched on) if the wake flag is set. In
star Idle mode, the transceiver enters the appropriate mode directly, depending on which
event has set the wake flag:
If the wake-up source was pin WAKE or a positive edge on pin STBN, the transceiver
will remain in star Idle mode.
If the wake-up source was activity detected on pins TRXD0 and TRXD1, the
transceiver will change from star Idle mode to star Transmit mode.
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
20 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
If the wake-up source was a wake-up symbol, the transceiver will change from star
Idle mode to star Receive mode.
7.5.3 Bus wake-up
Bus wake-up is detected if two consecutive DATA_0 of at least t
det(wake)DATA_0
separated by
an idle or DATA_1 of at least t
det(wake)idle
, followed by an idle or DATA_1 of at least
t
det(wake)idle
are present on the bus lines within t
det(wake)tot
.
7.5.4 Local wake-up via pin WAKE
If the voltage on pin WAKE is lower than V
th(det)(WAKE)
for longer than t
wake(WAKE)
(falling
edge on pin WAKE) a local wake-up event on pin WAKE is detected. At the same time, the
biasing of this pin is switched to pull-down.
If the voltage on pin WAKE is higher than V
th(det)(WAKE)
for longer than t
wake
, the biasing of
this pin is switched to pull-up, and no local wake-up will be detected.
7.6 Fail silent behavior
In order to be fail silent, undervoltage detection is implemented. An undervoltage will be
detected on pins V
CC
, V
IO
and V
BAT
.
Fig 7.
Bus wake-up timing
001aae442
0 V
-
425 mV
V
dif
t
det(wake)tot
t
det(wake)Data_0
t
det(wake)idle
t
det(wake)Data_0
t
det(wake)idle
Sleep mode: V
IO
and (V
BAT
or V
CC
) still provided.
Fig 8.
Local wake-up timing via pin WAKE
001aae443
V
BAT
V
BAT
RXD and
RXEN
INH1 and
INH2
0 V
0 V
WAKE
t
wake(WAKE)
pull-up
pull-up
t
wake(WAKE)
pull-down
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
21 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
7.6.1 V
BAT
undervoltage
Node configuration: If the UV
VBAT
flag is set the transceiver will enter Sleep mode
(pins INH1 and INH2 are switched off) regardless of the voltage present on pins EN
and STBN. If the undervoltage recovers the wake flag will be set and the transceiver
will enter the mode determined by the voltages on pins EN and STBN.
Star configuration: The TJA1080 in star configuration is able to transmit and receive
data as long as V
CC
and V
IO
are within their operating range, regardless of the
undervoltage on V
BAT
.
7.6.2 V
CC
undervoltage
Node configuration: If the UV
VCC
flag is set the transceiver will enter the Standby
mode (pin INH2 is switched off) regardless of the voltage present on pins EN and
STBN. If the undervoltage recovers or the wake flag is set mode switching via pins EN
and STBN is possible.
Star configuration: If the UV
VCC
flag is set the transceiver will enter the star Sleep
mode.
7.6.3 V
IO
undervoltage
Node configuration: If the voltage on pin V
IO
is lower than V
uvd(VIO)
(even if the UV
VIO
flag is reset) pins EN, STBN, TXD and BGE are set LOW (internally) and pin TXEN is
set HIGH (internally). If the UV
VIO
flag is set the transceiver will enter Sleep mode
(pins INH1 and INH2 are switched off).
Star configuration: If an undervoltage is present on pin V
IO
(even if the UV
VIO
flag is
reset) pins EN, STBN, TXD and BGE are set LOW (internally) and pin TXEN is set
HIGH (internally). If the V
IO
undervoltage flag is set, pin INH1 is switched off. If an
undervoltage is present on pin V
IO
and V
CC
is within the operating range, the TJA1080
will forward the received data to all other branches.
7.7 Flags
7.7.1 Local wake-up source flag
The local wake-up source flag can only be set in a low power mode. When a wake-up
event on pin WAKE is detected (see
Section 7.5.4
) it sets the local wake-up source flag.
The local wake-up source flag is reset by entering a low power mode.
7.7.2 Remote wake-up source flag
The remote wake-up source flag can only be set in a low power mode. When a bus
wake-up event is detected on the bus lines (see
Section 7.5.3
) it sets the remote wake-up
source flag. The remote wake-up source flag is reset by entering a low power mode.
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
22 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
7.7.3 Wake flag
The wake flag is set if one of the following events occurs:
The local or remote wake-up source flag is set (edge sensitive)
A positive edge is detected on pin STBN if V
IO
is present
Recovery of the UV
VBAT
flag (only in node configuration)
By recognizing activity on pins TRXD0 and TRXD1 (only in star configuration)
In node configuration the wake flag is reset by entering Normal mode, a low power mode
or setting one of the undervoltage flags. In star configuration the wake flag is reset by
entering a low power mode or by recovery of the UV
VCC
signal (without t
rec(uv)(VCC)
).
7.7.4 Power-on flag
The PWON flag is set if the internal supply voltage for the digital part becomes higher than
the lowest value it needs to operate. In node configuration, entering Normal mode resets
the PWON flag. In star configuration the PWON flag is reset when the UV
VCC
signal goes
LOW (no undervoltage detected).
7.7.5 Node or star configuration flag
Configuration flag set means node configuration.
7.7.6 Temperature medium flag
The temperature medium flag is set if the junction temperature exceeds T
j(warn)(medium)
in a
normal power mode. The temperature medium flag is reset when the junction temperature
becomes lower than T
j(warn)(medium)
in a normal power mode. No action will be taken if this
flag is set.
7.7.7 Temperature high flag
The temperature high flag is set if the junction temperature exceeds T
j(dis)(high)
in a normal
power mode.
In node configuration the temperature high flag is reset if a negative edge is applied to pin
TXEN while the junction temperature is lower than T
j(dis)(high)
in a normal power mode. In
star configuration mode the temperature high flag is reset by any activity detection (edge)
while the junction temperature is lower than T
j(dis)(high)
in a normal power mode.
If the temperature high flag is set the transmitter is disabled and pins TRXD0 and TRXD1
are switched off.
7.7.8 TXEN_BGE clamped flag
The TXEN_BGE clamped flag is set if pin TXEN is LOW and pin BGE is HIGH for longer
than t
detCL(TXEN_BGE)
. The TXEN_BGE clamped flag is reset if pin TXEN is HIGH or pin
BGE is LOW. If the TXEN_BGE flag is set, the transmitter is disabled.
7.7.9 Bus error flag
The bus error flag is set if pin TXEN is LOW and pin BGE is HIGH and the data received
from the bus lines (pins BP and BM) is different to that received on pin TXD. The TJA1080
also expects that a data frame begins with a bit value other than the last bit of the previous
data frame.
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
23 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
This is the case for a valid data frame which begins with the DATA_0 period of the
Transmission Start Sequence (TSS) and ends with the DATA_1 bit of the Frame End
Sequence (FES). Any violation of this frame format will be detected by the TJA1080.
Consequently, when transmitting a wake-up pattern, a bus error will be signalled. This
error indication should be ignored and the status register should be cleared by reading the
vector.
No action will be taken if the bus error flag is set.
7.7.10 UV
VBAT
flag
The UV
VBAT
flag is set if the voltage on pin V
BAT
is lower than V
uvd(VBAT)
. The UV
VBAT
flag
is reset if the voltage is higher than V
uvd(VBAT)
or by setting the wake flag; see
Section 7.6.1
.
7.7.11 UV
VCC
flag
The UV
VCC
flag is set if the voltage on pin V
CC
is lower than V
uvd(VCC)
for longer than
t
det(uv)(VCC)
. The flag is reset if the voltage on pin V
CC
is higher than V
uvd(VCC)
for longer
than t
rec(uv)(VCC)
or the wake flag is set; see
Section 7.6.2
.
7.7.12 UV
VIO
flag
The UV
VIO
flag is set if the voltage on pin V
IO
is lower than V
uvd(VIO)
for longer than
t
det(uv)(VIO)
. The flag is reset if the voltage on pin V
IO
is higher than V
uvd(VIO)
or the wake
flag is set; see
Section 7.6.3
.
7.7.13 Error flag
The error flag is set if one of the status bits S4 to S12 is set. The error flag is reset if none
of the S4 to S12 status bits are set; see
Table 11
.
7.8 TRXD collision
A TRXD collision is detected when two or more TJA1080s in star configuration enter star
Receive mode.
7.9 Status register
The status register can be read out on pin ERRN by using pin EN as clock; the status bits
are given in
Table 11
. The timing diagram is illustrated in
Figure 9
.
The status register is accessible if the UV
VIO
flag is not set in node or star configuration. A
negative edge on pin EN starts the read out. Within the period t
d(EN-ERRN)
after the first
edge on pin EN, pin ERRN will go HIGH if it was previously LOW. On the second negative
edge on pin EN the first status bit (S0) will be shifted out. The status bits are valid after
t
d(EN-ERRN)
. If no edge is detected on pin EN for longer than t
det(EN)
, the transceiver will
enter the state selected on pins EN and STBN (node configuration) and status bit S4 to
S12 will be reset if the corresponding flag has been reset.
Pin ERRN is LOW if the corresponding status bit is set.
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
24 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
Table 11.
Status bits
Bit number
Status bit
Description
S0
LOCAL WAKEUP
local wake-up source flag is redirected to this bit
S1
REMOTE WAKEUP
remote wake-up source flag is redirected to this bit
S2
NODE CONFIG
node configuration flag is redirected to this bit
S3
PWON
status bit set means PWON flag has been set previously
S4
BUS ERROR
status bit set means bus error flag has been set previously
S5
TEMP HIGH
status bit set means temperature high flag has been set previously
S6
TEMP MEDIUM
status bit set means temperature medium flag has been set previously
S7
TXEN_BGE CLAMPED
status bit set means TXEN_BGE clamped flag has been set previously
S8
UVVBAT
status bit set means UV
VBAT
flag has been set previously
S9
UVVCC
status bit set means UV
VCC
flag has been set previously
S10
UVVIO
status bit set means UV
VIO
flag has been set previously
S11
STAR LOCKED
status bit is set if star Locked mode has been entered previously
S12
TRXD COLLISION
status bit is set if a TRXD collision has been detected previously
Fig 9.
Timing diagram for status bits
001aae444
S0
S1
S2
T
EN
t
det(EN)
t
det(EN)
t
d(stb)
t
d(stb)
t
d(EN-ERRN)
normal
receive
only
standby
receive
only
normal
STBN
EN
ERRN
0.7V
IO
0.3V
IO
0.7V
IO
0.3V
IO
0.7V
IO
0.3V
IO
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
25 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
8.
Limiting values
[1]
According to ISO 7637, part 3 test pulses a and b; Class C; see
Figure 13
; R
L
= 45
; C
L
= 100 pF.
[2]
According to ISO 7637, part 2 test pulses 1, 2, 3a and 3b; Class C; see
Figure 13
; R
L
= 45
; C
L
= 100 pF.
[3]
According to ISO 7637, part 2 test pulse 4; Class C; see
Figure 13
; R
L
= 45
; C
L
= 100 pF.
[4]
According to ISO 7637, part 2 test pulse 5b; Class C; see
Figure 13
; R
L
= 45
; C
L
= 100 pF.
Table 12.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.
Symbol
Parameter
Conditions
Min
Max
Unit
V
BAT
supply voltage on pin V
BAT
no time limit
-
0.3
+60
V
operating range
6.5
60
V
V
CC
supply voltage
no time limit
-
0.3
+5.5
V
operating range
4.75
5.25
V
V
BUF
supply voltage on pin V
BUF
no time limit
-
0.3
+5.5
V
operating range
4.75
5.25
V
V
IO
supply voltage on pin V
IO
no time limit
-
0.3
+5.5
V
operating range
2.2
5.25
V
V
INH1
voltage on pin INH1
-
0.3
V
BAT
+ 0.3
V
V
INH2
voltage on pin INH2
-
0.3
V
BAT
+ 0.3
V
V
WAKE
voltage on pin WAKE
-
0.3
V
BAT
+ 0.3
V
I
o(WAKE)
output current on pin WAKE
pin GND not connected
-
15
-
mA
V
BGE
voltage on pin BGE
no time limit
-
0.3
V
IO
+ 0.3
V
V
TXEN
voltage on pin TXEN
no time limit
-
0.3
V
IO
+ 0.3
V
V
TXD
voltage on pin TXD
no time limit
-
0.3
V
IO
+ 0.3
V
V
ERRN
voltage on pin ERRN
no time limit
-
0.3
V
IO
+ 0.3
V
V
RXD
voltage on pin RXD
no time limit
-
0.3
V
IO
+ 0.3
V
V
RXEN
voltage on pin RXEN
no time limit
-
0.3
V
IO
+ 0.3
V
V
EN
voltage on pin EN
no time limit
-
0.3
+5.5
V
V
STBN
voltage on pin STBN
no time limit
-
0.3
+5.5
V
V
TRXD0
voltage on pin TRXD0
no time limit
-
0.3
+5.5
V
V
TRXD1
voltage on pin TRXD1
no time limit
-
0.3
+5.5
V
V
BP
voltage on pin BP
-
60
+60
V
V
BM
voltage on pin BM
-
60
+60
V
V
trt
transient voltage
on pins BP and BM
[1]
-
200
+200
V
on pin V
BAT
[2]
-
200
+200
V
on pin V
BAT
[3]
6.5
60
V
on pin V
BAT
[4]
-
60
V
T
stg
storage temperature
-
55
+150
C
T
vj
virtual junction temperature
[5]
-
40
+150
C
V
ESD
electrostatic discharge voltage
HBM on pins BP and BM to ground
[6]
-
8.0
+8.0
kV
HBM at any other pin
[7]
-
4.0
+4.0
kV
MM on all pins
[8]
-
200
+200
V
CDM on all pins
[9]
-
1000
+1000
V
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
26 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
[5]
In accordance with IEC 60747-1. An alternative definition of virtual junction temperature T
vj
is: T
vj
= T
amb
+ TD x R
th(j-a)
, where R
th(j-a)
is
a fixed value to be used for the calculation of T
vj
. The rating for T
vj
limits the allowable combinations of power dissipation (P) and
ambient temperature (T
amb
).
[6]
HBM: C = 100 pF; R = 1.5 k
.
[7]
HBM: C = 100 pF; R = 1.5 k
.
[8]
MM: C = 200 pF; L = 0.75
H; R = 10
.
[9]
CDM: C = 330 pF; R = 150
.
9.
Thermal characteristics
Table 13.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
R
th(j-a)
thermal resistance from junction to ambient
in free air
126
K/W
R
th(j-s)
thermal resistance from junction to substrate
in free air
-
K/W
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
27 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
10. Static characteristics
Table 14.
Static characteristics
All parameters are guaranteed for V
BAT
= 6.5 V to 60 V; V
CC
= 4.75 V to 5.25 V; V
BUF
= 4.75 V to 5.25 V; V
IO
= 2.2 V to 5.25 V;
T
vj
=
-
40
C to + 150
C; R
bus
= 45
; R
TRXD
= 200
unless otherwise specified. All voltages are defined with respect to
ground; positive currents flow into the IC.
[1][2]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Pin V
BAT
I
BAT
supply current on pin V
BAT
low power modes in node
configuration
-
35
50
A
star Sleep mode
-
40
50
A
star Standby mode
-
75
150
A
normal power modes
-
0.075
1
mA
V
uvd(VBAT)
undervoltage detection
voltage on pin V
BAT
2.75
3.8
4,5
V
Pin V
CC
I
CC
supply current
low power modes
-
1
0
+5
A
Normal mode; V
BGE
= 0 V;
V
TXEN
= V
IO
; Receive only
mode; star Idle mode
-
10
15
mA
Normal mode; V
BGE
= V
IO
;
V
TXEN
= 0 V; V
BUF
open
[3]
-
28.5
35
mA
Normal mode; V
BGE
= V
IO
;
V
TXEN
= 0 V; R
bus
=
-
10
15
mA
star Transmit mode
-
50
62
mA
star Receive mode
-
38
42
mA
V
uvd(VCC)
undervoltage detection
voltage on pin V
CC
2.75
3.8
4.5
V
Pin V
IO
I
IO
supply current on pin V
IO
low power modes
-
1
+1
+5
A
Normal and Receive only
mode; V
TXD
= V
IO
-
30
1000
A
V
uvd(VIO)
undervoltage detection
voltage on pin V
IO
1
1.5
2
V
V
uvr(VIO)
undervoltage recovery
voltage on pin V
IO
1
1.6
2.2
V
V
uvhys(VIO)
undervoltage hysteresis
voltage on pin V
IO
25
<tbd>
<tbd>
mV
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
28 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
Pin V
BUF
I
BUF
supply current on pin
V
BUF
low power modes in node
configuration
-
1
0
+5
A
low power modes in star
configuration
V
BUF
= 0 V; V
CC
= 0 V
-
40
-
20
+1
A
V
BUF
= 5.25 V
-
1
0
+5
A
Normal mode; V
BGE
= V
IO
;
V
TXEN
= 0 V; V
BUF
= V
CC
[3]
-
26.5
35
mA
star Transmit mode
-
47
62
mA
star Receive mode
-
35
42
mA
Normal mode; V
BGE
= 0 V;
V
TXEN
= V
IO
; Receive only
mode; star Idle mode
-
10
15
mA
V
BUF(on)
on-state voltage on pin
V
BUF
V
CC
switch is switched on;
Normal mode; V
BGE
= V
IO
;
V
TXEN
= 0 V; V
CC
> maximum
value of V
uvd(VCC)
V
CC
-
0.25 V
CC
-
0.05 V
CC
V
V
BUF(off)
off-state voltage on pin
V
BUF
V
CC
switch is switched off; low
power modes in star
configuration; V
CC
< minimum
value of V
uvd(VCC)
4.5
4.9
5.25
V
Pin EN
V
IH(EN)
HIGH-level input voltage
on pin EN
0.7V
IO
0.5V
IO
5.5
V
V
IL(EN)
LOW-level input voltage
on pin EN
-
0.3
0.5V
IO
0.3V
IO
V
I
IH(EN)
HIGH-level input current
on pin EN
V
EN
= 0.7V
IO
3
8
11
A
I
IL(EN)
LOW-level input current
on pin EN
V
EN
= 0 V
-
1
0
+1
A
Pin STBN
V
IH(STBN)
HIGH-level input voltage
on pin STBN
0.7V
IO
0.5V
IO
5.5
V
V
IL(STBN)
LOW-level input voltage
on pin STBN
-
0.3
0.5V
IO
0.3V
IO
V
I
IH(STBN)
HIGH-level input current
on pin STBN
V
STBN
= 0.7V
IO
3
8
11
A
I
IL(STBN)
LOW-level input current
on pin STBN
V
STBN
= 0 V
-
1
0
+1
A
Table 14.
Static characteristics
...continued
All parameters are guaranteed for V
BAT
= 6.5 V to 60 V; V
CC
= 4.75 V to 5.25 V; V
BUF
= 4.75 V to 5.25 V; V
IO
= 2.2 V to 5.25 V;
T
vj
=
-
40
C to + 150
C; R
bus
= 45
; R
TRXD
= 200
unless otherwise specified. All voltages are defined with respect to
ground; positive currents flow into the IC.
[1][2]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
29 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
Pin TXEN
V
IH(TXEN)
HIGH-level input voltage
on pin TXEN
0.7V
IO
0.5V
IO
V
IO
+ 0.3
V
V
IL(TXEN)
LOW-level input voltage
on pin TXEN
-
0.3
0.5V
IO
0.3V
IO
V
I
IH(TXEN)
HIGH-level input current
on pin TXEN
V
TXEN
= V
IO
-
1
0
+1
A
I
IL(TXEN)
LOW-level input current
on pin TXEN
V
TXEN
= 0.3V
IO
-
12
-
9
-
3
A
I
L(TXEN)
leakage current on pin
TXEN
V
TXEN
= 5.25 V; V
IO
= 0 V
-
1
0
+1
A
Pin BGE
V
IH(BGE)
HIGH-level input voltage
on pin BGE
0.7V
IO
0.5V
IO
V
IO
+ 0.3
V
V
IL(BGE)
LOW-level input voltage
on pin BGE
-
0.3
0.5V
IO
0.3V
IO
V
I
IH(BGE)
HIGH-level input current
on pin BGE
V
BGE
= 0.7V
IO
3
8
11
A
I
IL(BGE)
LOW-level input current
on pin BGE
V
BGE
= 0 V
-
1
0
+1
A
Pin TXD
V
IH(TXD)
HIGH-level input voltage
on pin TXD
normal power modes
0.7V
IO
0.5V
IO
V
IO
+ 0.3
V
V
IL(TXD)
LOW-level input voltage
on pin TXD
normal power modes
-
0.3
0.5V
IO
0.3V
IO
V
I
IH(TXD)
HIGH-level input current
on pin TXD
V
TXD
= V
IO
70
300
650
A
I
IL(TXD)
LOW-level input current
on pin TXD
normal power modes;
V
TXD
= 0 V
-
5
0
+5
A
low power modes
-
1
0
+1
A
I
LI(TXD)
input leakage current on
pin TXD
V
TXD
= 5.25 V; V
IO
= 0 V
-
1
0
+1
A
Pin RXD
I
OH(RXD)
HIGH-level output current
on pin RXD
V
RXD
= V
IO
-
0.4 V; V
IO
= V
CC
-
2
-
4
-
15
mA
I
OL(RXD)
LOW-level output current
on pin RXD
V
RXD
= 0.4 V
2
7
20
mA
Pin ERRN
I
OH(ERRN)
HIGH-level output current
on pin ERRN
node configuration;
V
ERRN
= V
IO
-
0.4 V;
V
IO
= V
CC
-
1500
-
550
-
100
A
star configuration;
V
ERRN
= V
IO
-
0.4 V;
V
IO
= V
CC
-
1
0
+1
A
Table 14.
Static characteristics
...continued
All parameters are guaranteed for V
BAT
= 6.5 V to 60 V; V
CC
= 4.75 V to 5.25 V; V
BUF
= 4.75 V to 5.25 V; V
IO
= 2.2 V to 5.25 V;
T
vj
=
-
40
C to + 150
C; R
bus
= 45
; R
TRXD
= 200
unless otherwise specified. All voltages are defined with respect to
ground; positive currents flow into the IC.
[1][2]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
30 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
I
OL(ERRN)
LOW-level output current
on pin ERRN
V
ERRN
= 0.4 V
300
700
1500
A
Pin RXEN
I
OH(RXEN)
HIGH-level output current
on pin RXEN
V
RXEN
= V
IO
-
0.4 V;
V
IO
= V
CC
-
4
-
1.5
-
0.5
mA
I
OL(RXEN)
LOW-level output current
on pin RXEN
V
RXEN
= 0.4 V
1
3
8
mA
Pins TRXD0 and TRXD1
V
IH(TRXD0)
HIGH-level input voltage
on pin TRXD0
star Idle and star Transmit
mode
0.7V
BUF
0.5V
BUF
V
BUF
+ 0.3 V
V
IL(TRXD0)
LOW-level input voltage
on pin TRXD0
star Idle and star Transmit
mode
-
0.3
0.5V
BUF
0.3V
BUF
V
V
OL(TRXD0)
LOW-level output voltage
on pin TRXD0
R
pu
= 200
-
0.3
+0.3
+0.8
V
V
IH(TRXD1)
HIGH-level input voltage
on pin TRXD1
star Idle and star Transmit
mode
0.7V
BUF
0.5V
BUF
V
BUF
+ 0.3 V
V
IL(TRXD1)
LOW-level input voltage
on pin TRXD1
star Idle and star Transmit
mode
-
0.3
0.5V
BUF
0.3V
BUF
V
V
OL(TRXD1)
LOW-level output voltage
on pin TRXD1
R
pu
= 200
-
0.3
+0.3
+0.8
V
Pins BP and BM
V
o(idle)(BP)
idle output voltage on pin
BP
Normal, Receive only, star
Idle, star Transmit and star
Receive mode; V
TXEN
= V
IO
0.4V
BUF
0.5V
BUF
0.6V
BUF
V
Standby, go-to-sleep, Sleep,
star Standby and star Sleep
mode
-
0.1
0
+0.1
V
V
o(idle)(BM)
idle output voltage on pin
BM
Normal, receive only, star
Idle, star Transmit and star
Receive mode; V
TXEN
= V
IO
0.4V
BUF
0.5V
BUF
0.6V
BUF
V
Standby, go to sleep, Sleep,
star Standby and star Sleep
mode
-
0.1
0
+0.1
V
I
o(idle)BP
idle output current on pin
BP
-
60 V <
|
V
BP
|
< +60 V
1
3
7.5
mA
I
o(idle)BM
idle output current on pin
BM
-
60 V <
|
V
BM
|
< +60 V
1
3
7.5
mA
V
o(idle)(dif)
differential idle output
voltage
-
25
0
+25
mV
V
OH(dif)
differential HIGH-level
output voltage
40
< R
bus
< 55
;
V
CC
= V
BUF
= 5 V
600
800
1200
mV
V
OL(dif)
differential LOW-level
output voltage
40
< R
bus
< 55
;
V
CC
= V
BUF
= 5 V
-
1200
-
800
-
600
mV
Table 14.
Static characteristics
...continued
All parameters are guaranteed for V
BAT
= 6.5 V to 60 V; V
CC
= 4.75 V to 5.25 V; V
BUF
= 4.75 V to 5.25 V; V
IO
= 2.2 V to 5.25 V;
T
vj
=
-
40
C to + 150
C; R
bus
= 45
; R
TRXD
= 200
unless otherwise specified. All voltages are defined with respect to
ground; positive currents flow into the IC.
[1][2]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
31 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
V
IH(dif)
differential HIGH-level
input voltage
normal power modes;
-
10 V < V
BP
< +15 V;
-
10 V < V
BM
< +15 V
150
225
300
mV
V
IL(dif)
differential LOW-level
input voltage
normal power modes;
-
10 V < V
BP
< +15 V;
-
10 V < V
BM
< +15 V
-
300
-
225
-
150
mV
low power modes;
-
10 V < V
BP
< +15 V;
-
10 V < V
BM
< +15 V
-
400
-
225
-
125
mV
|
V
i(dif)det(act)
|
activity detection
differential input voltage
(absolute value)
normal power modes
150
225
300
mV
|
I
o(sc)(BP)
|
short-circuit output
current on pin BP
(absolute value)
V
BP
= 0 V, 60 V
10
20
30
mA
|
I
o(sc)(BM)
|
short-circuit output
current on pin BM
(absolute value)
V
BM
= 0 V, 60 V
10
20
30
mA
R
i(BP)
input resistance on pin BP Idle level; R
bus
=
10
20
40
k
R
i(BM)
input resistance on pin
BM
Idle level; R
bus
=
10
20
40
k
R
i(dif)(BP-BM)
differential input
resistance between pin
BP and pin BM
Idle level; R
bus
=
20
40
80
k
I
LI(BP)
input leakage current on
pin BP
V
BP
= 5 V;
V
BAT
= V
CC
= V
IO
= 0 V
-
10
0
+10
A
I
LI(BM)
input leakage current on
pin BM
V
BM
= 5 V;
V
BAT
= V
CC
= V
IO
= 0 V
-
10
0
+10
A
V
cm(bus)(DATA_0)
DATA_0 bus common
mode voltage
R
bus
= 45
0.4V
BUF
0.5V
BUF
0.6V
BUF
V
V
cm(bus)(DATA_1)
DATA_1 bus common
mode voltage
R
bus
= 45
0.4V
BUF
0.5V
BUF
0.6V
BUF
V
V
cm(bus)
bus common mode
voltage difference
R
bus
= 45
-
25
0
+25
mV
Pin INH1
V
OH(INH1)
HIGH-level output voltage
on pin INH1
I
INH1
=
-
0.2 mA
V
BAT
-
0.8
V
BAT
-
0.3
V
BAT
V
I
L(INH1)
leakage current on pin
INH1
Sleep mode
-
5
0
+5
A
I
OL(INH1)
LOW-level output current
on pin INH1
V
INH1
= 0 V
-
15
-
8
-
mA
Table 14.
Static characteristics
...continued
All parameters are guaranteed for V
BAT
= 6.5 V to 60 V; V
CC
= 4.75 V to 5.25 V; V
BUF
= 4.75 V to 5.25 V; V
IO
= 2.2 V to 5.25 V;
T
vj
=
-
40
C to + 150
C; R
bus
= 45
; R
TRXD
= 200
unless otherwise specified. All voltages are defined with respect to
ground; positive currents flow into the IC.
[1][2]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
32 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
[1]
All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % are tested at 125
C for dies on
wafer level (pre-testing) and above this for cased products 100 % are tested at T
amb
=
-
40
C and +25
C (final testing) unless otherwise
specified. Both pre-testing and final testing use correlated test conditions to cover the specified temperature and power supply voltage
range. For bare dies all parameters are only guaranteed with the backside of the bare die connected to ground.
[2]
At power-up V
BAT
should be supplied first. When V
BAT
reaches 6.5 V, V
CC
and V
IO
may be switched on with a delay of at least 60
s with
respect to V
BAT
.
[3]
Current flows from V
CC
to V
BUF
. This means that the maximum sum current I
CC
+ I
BUF
is 35 mA.
Pin INH2
V
OH(INH2)
HIGH-level output voltage
on pin INH2
I
INH2
=
-
0.2 mA
V
BAT
-
0.8
V
BAT
-
0.3
V
BAT
V
I
L(INH2)
leakage current on pin
INH2
Sleep mode
-
5
0
+5
A
I
OL(INH2)
LOW-level output current
on pin INH2
V
INH2
= 0 V
-
15
-
8
-
mA
Pin WAKE
V
th(det)(WAKE)
detection threshold
voltage on pin WAKE
low power mode
2.5
3.7
4.5
V
I
IL(WAKE)
LOW-level input current
on pin WAKE
V
WAKE
= 2.4 V for
t > t
wake(WAKE)
3
6.5
11
A
I
IH(WAKE)
HIGH-level input current
on pin WAKE
V
WAKE
= 4.6 V for
t > t
wake(WAKE)
-
11
-
6.5
-
3
A
Temperature protection
T
j(warn)(medium)
medium warning junction
temperature
155
165
175
C
T
j(dis)(high)
high disable junction
temperature
180
190
200
C
Table 14.
Static characteristics
...continued
All parameters are guaranteed for V
BAT
= 6.5 V to 60 V; V
CC
= 4.75 V to 5.25 V; V
BUF
= 4.75 V to 5.25 V; V
IO
= 2.2 V to 5.25 V;
T
vj
=
-
40
C to + 150
C; R
bus
= 45
; R
TRXD
= 200
unless otherwise specified. All voltages are defined with respect to
ground; positive currents flow into the IC.
[1][2]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
33 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
11. Dynamic characteristics
Table 15.
Dynamic characteristics
All parameters are guaranteed for V
BAT
= 6.5 V to 60 V; V
CC
= 4.75 V to 5.25 V; V
BUF
= 4.75 V to 5.25 V; V
IO
= 2.2 V to 5.25 V;
T
vj
=
-
40
C to + 150
C; R
bus
= 45
; R
TRXD
= 200
unless otherwise specified. All voltages are defined with respect to
ground; positive currents flow into the IC
[1]
.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Pins BP and BM
t
d(TXD-bus)
delay time from TXD to bus
Normal or star Transmit
mode
[2]
DATA_0
-
31
50
ns
DATA_1
-
32
50
ns
t
d(TXD-bus)
delay time difference from TXD
to bus
Normal or star Transmit
mode; between DATA_0
and DATA_1
[2]
-
1
4
ns
t
d(TRXD-bus)
delay time from TRXD to bus
star Transmit mode
[3]
DATA_0
-
27
50
ns
DATA_1
-
28
50
ns
t
d(TRXD-bus)
delay time difference from TRXD
to bus
star Transmit mode;
between DATA_0 and
DATA_1
[3][4]
-
1
5
ns
t
d(bus-RXD)
delay time from bus to RXD
normal or star Transmit
mode; C
RXD
= 15 pF; see
Figure 11
DATA_0
-
28
50
ns
DATA_1
-
30
50
ns
t
d(bus-RXD)
delay time difference from bus to
RXD
normal or star Transmit
mode; C
RXD
= 15 pF;
between DATA_0 and
DATA_1; see
Figure 11
-
2
5
ns
t
d(bus-TRXD)
delay time from bus to TRXD
star Receive mode; see
Figure 11
DATA_0
-
28
50
ns
DATA_1
-
28
50
ns
t
d(bus-TRXD)
delay time difference from bus to
TRXD
star Receive mode;
between DATA_0 and
DATA_1; see
Figure 11
[4]
-
0
5
ns
t
d(TXEN-busidle)
delay time from TXEN to bus
idle
Normal mode
-
28
50
ns
t
d(TXEN-busact)
delay time from TXEN to bus
active
Normal mode
-
22
50
ns
t
d(BGE-busidle)
delay time from BGE to bus idle
Normal mode
-
30
50
ns
t
d(BGE-busact)
delay time from BGE to bus
active
Normal mode
-
22
50
ns
t
r(dif)(bus)
bus differential rise time
10 % to 90 %; R
L
= 45
;
C
L
= 100 pF
8
12
23
ns
t
f(dif)(bus)
bus differential fall time
90 % to 10 %; R
L
= 45
;
C
L
= 100 pF
8
12
23
ns
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
34 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
WAKE symbol detection
t
det(wake)DATA_0
DATA_0 wake-up detection time
Standby, Sleep,
star Standby or star Sleep
mode;
-
10 V < V
BP
< +15 V;
-
10 V < V
BM
< +15 V
1
2.2
4
s
t
det(wake)idle
idle wake-up detection time
1
2.5
4
s
t
det(wake)tot
total wake-up detection time
50
-
115
s
Undervoltage
t
det(uv)(VCC)
undervoltage detection time on
pin V
CC
100
-
670
ms
t
rec(uv)(VCC)
undervoltage recovery time on
pin V
CC
1
-
5.2
ms
t
det(uv)(VIO)
undervoltage detection time on
pin V
IO
100
-
670
ms
t
to(uv)(VCC)
undervoltage time-out time on
pin V
CC
for entering Standby
mode
star configuration; wake
flag is set
432
-
900
s
Activity detection
t
det(act)(TXEN)
activity detection time on pin
TXEN
star configuration
100
140
200
ns
t
det(act)(TRXD)
activity detection time on pin
TRXD
star configuration
100
140
200
ns
t
det(act)(bus)
activity detection time on bus
pins
V
dif
: 0
400 mV
100
150
250
ns
t
det(idle)(TXEN)
idle detection time on pin TXEN
star configuration
100
140
200
ns
t
det(idle)(TRXD)
idle detection time on pin TRXD
star configuration
50
75
100
ns
t
det(idle)(bus)
idle detection time on bus pins
V
dif
: 400 mV
0
100
150
250
ns
Star modes
t
to(idle-sleep)
idle to sleep time-out time
640
-
2660
ms
t
to(tx-locked)
transmit to locked time-out time
2600
-
10400
s
t
to(rx-locked)
receive to locked time-out time
2600
-
10400
s
t
to(locked-sleep)
locked to sleep time-out time
64
-
333
ms
t
to(locked-idle)
locked to idle time-out time
1.4
-
5.1
s
Node modes
t
d(STBN-RXD)
STBN to RXD delay time
wake flag set
-
1
2
s
t
d(STBN-INH2)
STBN to INH2 delay time
-
3
10
s
t
h(gotosleep)
go-to-sleep hold time
20
35
50
s
Status register
t
det(EN)
detection time on pin EN
for mode control
20
-
80
s
T
EN
time period on pin EN
for reading status bits
4
-
20
s
t
d(EN-ERRN)
delay time from EN to ERRN
for reading status bits
-
0.8
2
s
Table 15.
Dynamic characteristics
...continued
All parameters are guaranteed for V
BAT
= 6.5 V to 60 V; V
CC
= 4.75 V to 5.25 V; V
BUF
= 4.75 V to 5.25 V; V
IO
= 2.2 V to 5.25 V;
T
vj
=
-
40
C to + 150
C; R
bus
= 45
; R
TRXD
= 200
unless otherwise specified. All voltages are defined with respect to
ground; positive currents flow into the IC
[1]
.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
35 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
[1]
At power-up V
BAT
should be supplied first. When V
BAT
reaches 6.5 V, V
CC
and V
IO
may be switched on with a delay of at least 60
s with
respect to V
BAT
.
[2]
Rise and fall time (10 % to 90 %) of t
r(TXD)
and t
f(TXD)
= 5 ns.
[3]
Rise and fall time (10 % to 90 %) of t
r(TRXD)
and t
f(TRXD)
= 5 ns.
[4]
The worst case asymmetry from one branch to another is the sum of the delay difference from TRXD0 and TRXD1 to DATA_0 and
DATA_1 plus the delay difference from DATA_0 and DATA_1 to TRXD0 and TRXD1. The TJA1080 should not be used in topologies with
cascaded stars.
WAKE
t
wake(WAKE)
wake-up time on pin WAKE
low power mode; falling
edge on pin WAKE;
6.5 V < V
BAT
< 27 V
5
25
100
s
low power mode; falling
edge on pin WAKE;
27 V < V
BAT
< 60 V
25
75
175
s
Miscellaneous
t
detCL(TXEN_BGE)
TXEN_BGE clamp detection
time
2600
-
10400
s
Table 15.
Dynamic characteristics
...continued
All parameters are guaranteed for V
BAT
= 6.5 V to 60 V; V
CC
= 4.75 V to 5.25 V; V
BUF
= 4.75 V to 5.25 V; V
IO
= 2.2 V to 5.25 V;
T
vj
=
-
40
C to + 150
C; R
bus
= 45
; R
TRXD
= 200
unless otherwise specified. All voltages are defined with respect to
ground; positive currents flow into the IC
[1]
.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
TJ
A1080_1
K
oninklijk
e Philips Electronics N.V
. 2006. All r
ights reser
v
ed.
Preliminar
y data sheet
Re
v
.
01 -- 20 J
u
l
y
2006
36 of 44
Philips Semiconductor
s
TJ
A1080
Fle
xRa
y transceiver
Fig 10. Detailed timing diagram in node configuration
001aae445
10 %
90 %
t
d(bus-RXD)
t
d(bus-RXD)
t
det(idle)(bus)
t
det(act)(bus)
t
det(idle)(bus)
-
150 mV
0.7V
IO
0.3V
IO
0.7V
IO
0.3V
IO
0.7V
IO
0.3V
IO
+300 mV
-
300 mV
0 V
BP and BM
BGE
TXEN
TXD
RXEN
RXD
0.7V
IO
0.3V
IO
0.7V
IO
0.3V
IO
-
300 mV
-
150 mV
-
300 mV
t
det(act)(bus)
t
r(dif)(bus)
t
f(dif)(bus)
t
d(TXD-bus)
t
d(TXD-bus)
t
d(TXEN-busidle)
t
d(BGE-busidle)
t
d(TXEN-busact)
t
d(BGE-busact)
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
37 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
V
dif
is the receiver test signal.
Fig 11. Receiver test signal
001aae446
22.5 ns
600
V
dif
(mV)
RXD
300
-
300
-
600
t
d(bus-RXD)
57.5 ns
80 ns
22.5 ns
t
d(bus-RXD)
22.5 ns
600
V
dif
(mV)
RXD
300
-
300
-
600
t
d(bus-RXD)
57.5 ns
80 ns
22.5 ns
t
d(bus-RXD)
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
38 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
12. Test information
Fig 12. Test circuit for dynamic characteristics
The waveforms of the applied transients are in accordance with ISO 7637, test pulses 1, 2, 3a,
3b, 4 and 5.
Test conditions:
Normal mode: bus idle
Normal mode: bus active; TXD at 5 MHz and TXEN at 1 kHz
Fig 13. Test circuit for automotive transients
001aae447
22
F
15 pF
TJA1080
10
F
+12 V
V
CC
V
IO
V
BAT
RL
CL
V
BUF
BP
18
4
19
14
20
17
7
BM
RXD
+5 V
100
nF
001aae448
12 V or 42 V
1 nF
1 nF
ISO 7637
PULSE
GENERATOR
ISO 7637
PULSE
GENERATOR
10
F
TJA1080
10
F
V
CC
V
IO
V
BAT
RL
CL
V
BUF
BP
18
4
19
14
20
17
BM
+5 V
100
nF
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
39 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
13. Package outline
Fig 14. Package outline SOT339-1 (SSOP20)
UNIT
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
e
H
E
L
L
p
Q
(1)
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
7.4
7.0
5.4
5.2
0.65
7.9
7.6
0.9
0.7
0.9
0.5
8
0
o
o
0.13
1.25
0.2
0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT339-1
MO-150
99-12-27
03-02-19
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
1
10
20
11
y
0.25
pin 1 index
0
2.5
5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
A
max.
2
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
40 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
14. Soldering
14.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow temperatures range from 215
C to 260
C depending on solder paste
material. The peak top-surface temperature of the packages should be kept below:
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
Table 16.
SnPb eutectic process - package peak reflow temperatures (from
J-STD-020C
July 2004)
Package thickness
Volume mm
3
< 350
Volume mm
3
350
< 2.5 mm
240
C + 0/
-
5
C
225
C + 0/
-
5
C
2.5 mm
225
C + 0/
-
5
C
225
C + 0/
-
5
C
Table 17.
Pb-free process - package peak reflow temperatures (from
J-STD-020C July
2004)
Package thickness
Volume mm
3
< 350
Volume mm
3
350 to
2000
Volume mm
3
> 2000
< 1.6 mm
260
C + 0
C
260
C + 0
C
260
C + 0
C
1.6 mm to 2.5 mm
260
C + 0
C
250
C + 0
C
245
C + 0
C
2.5 mm
250
C + 0
C
245
C + 0
C
245
C + 0
C
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
41 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250
C
or 265
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270
C and 320
C.
14.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the
(LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
Table 18.
Suitability of surface mount IC packages for wave and reflow soldering methods
Package
[1]
Soldering method
Wave
Reflow
[2]
BGA, HTSSON..T
[3]
, LBGA, LFBGA, SQFP,
SSOP..T
[3]
, TFBGA, VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable
[4]
suitable
PLCC
[5]
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
[5][6]
suitable
SSOP, TSSOP, VSO, VSSOP
not recommended
[7]
suitable
CWQCCN..L
[8]
, PMFP
[9]
, WQCCN..L
[8]
not suitable
not suitable
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
42 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217
C
10
C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
15. Abbreviations
16. References
[1]
EPL -- FlexRay Communications System Electrical Physical Layer Specification
Version 2.1 Rev. A, FlexRay Consortium, Dec 2005
[2]
PS41 -- Product Specification: TJA1041; High speed CAN transceiver,
www.semiconductors.philips.com
[3]
PS54 -- Product Specification: TJA1054; Fault-tolerant CAN transceiver,
www.semiconductors.philips.com
17. Revision history
Table 19.
Abbreviations
Abbreviation
Description
CAN
Communications Area Network
CDM
Charge Device Model
EMC
ElectroMagnetic Compatibility
EME
ElectroMagnetic Emission
EMI
ElectroMagnetic Interference
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
PWON
Power-on
Table 20.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TJA1080_1
20060720
Objective data sheet
-
-
TJA1080_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 20 July 2006
43 of 44
Philips Semiconductors
TJA1080
FlexRay transceiver
18. Legal information
18.1
Data sheet status
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term `short data sheet' is explained in section "Definitions".
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL
http://www.semiconductors.philips.com.
18.2
Definitions
Draft -- The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Philips Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet -- A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Philips Semiconductors
sales office. In case of any inconsistency or conflict with the short data sheet,
the full data sheet shall prevail.
18.3
Disclaimers
General -- Information in this document is believed to be accurate and
reliable. However, Philips Semiconductors does not give any representations
or warranties, expressed or implied, as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of
such information.
Right to make changes -- Philips Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use -- Philips Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a Philips Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. Philips Semiconductors accepts no liability for inclusion and/or use
of Philips Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer's own risk.
Applications -- Applications that are described herein for any of these
products are for illustrative purposes only. Philips Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values -- Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale -- Philips Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at
http://www.semiconductors.philips.com/profile/terms
, including those
pertaining to warranty, intellectual property rights infringement and limitation
of liability, unless explicitly otherwise agreed to in writing by Philips
Semiconductors. In case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter will prevail.
No offer to sell or license -- Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
18.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Philips Semiconductors
TJA1080
FlexRay transceiver
Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.
Date of release: 20 July 2006
Document identifier: TJA1080_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section `Legal information'.
20. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.1
Optimized for time triggered communication
systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.2
Low power management . . . . . . . . . . . . . . . . . 2
2.3
Diagnosis (detection and signalling) . . . . . . . . . 2
2.4
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
7
Functional description . . . . . . . . . . . . . . . . . . . 6
7.1
Operating configurations. . . . . . . . . . . . . . . . . . 6
7.1.1
Node configuration . . . . . . . . . . . . . . . . . . . . . . 6
7.1.2
Star configuration . . . . . . . . . . . . . . . . . . . . . . . 6
7.1.3
Bus activity and idle detection . . . . . . . . . . . . . 7
7.2
Operating modes in node configuration . . . . . . 7
7.2.1
Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.2.2
Receive only mode . . . . . . . . . . . . . . . . . . . . . 14
7.2.3
Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . 14
7.2.4
Go-to-sleep mode . . . . . . . . . . . . . . . . . . . . . . 14
7.2.5
Sleep mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.3
Operating modes in star configuration . . . . . . 15
7.3.1
Star Idle mode . . . . . . . . . . . . . . . . . . . . . . . . 17
7.3.2
Star Transmit mode. . . . . . . . . . . . . . . . . . . . . 18
7.3.3
Star Receive mode . . . . . . . . . . . . . . . . . . . . . 18
7.3.4
Star Standby mode . . . . . . . . . . . . . . . . . . . . . 18
7.3.5
Star Sleep mode . . . . . . . . . . . . . . . . . . . . . . . 18
7.3.6
Star Locked mode. . . . . . . . . . . . . . . . . . . . . . 19
7.4
Start-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.4.1
Node configuration . . . . . . . . . . . . . . . . . . . . . 19
7.4.2
Star configuration . . . . . . . . . . . . . . . . . . . . . . 19
7.5
Wake-up mechanism . . . . . . . . . . . . . . . . . . . 19
7.5.1
Node configuration . . . . . . . . . . . . . . . . . . . . . 19
7.5.2
Star configuration . . . . . . . . . . . . . . . . . . . . . . 19
7.5.3
Bus wake-up . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.5.4
Local wake-up via pin WAKE . . . . . . . . . . . . . 20
7.6
Fail silent behavior . . . . . . . . . . . . . . . . . . . . . 20
7.6.1
V
BAT
undervoltage. . . . . . . . . . . . . . . . . . . . . . 21
7.6.2
V
CC
undervoltage . . . . . . . . . . . . . . . . . . . . . . 21
7.6.3
V
IO
undervoltage. . . . . . . . . . . . . . . . . . . . . . . 21
7.7
Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.7.1
Local wake-up source flag . . . . . . . . . . . . . . . 21
7.7.2
Remote wake-up source flag . . . . . . . . . . . . . 21
7.7.3
Wake flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.7.4
Power-on flag . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.7.5
Node or star configuration flag . . . . . . . . . . . . 22
7.7.6
Temperature medium flag . . . . . . . . . . . . . . . 22
7.7.7
Temperature high flag . . . . . . . . . . . . . . . . . . 22
7.7.8
TXEN_BGE clamped flag. . . . . . . . . . . . . . . . 22
7.7.9
Bus error flag . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.7.10
UV
VBAT
flag. . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.7.11
UV
VCC
flag . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.7.12
UV
VIO
flag. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.7.13
Error flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.8
TRXD collision . . . . . . . . . . . . . . . . . . . . . . . . 23
7.9
Status register . . . . . . . . . . . . . . . . . . . . . . . . 23
8
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 25
9
Thermal characteristics . . . . . . . . . . . . . . . . . 26
10
Static characteristics . . . . . . . . . . . . . . . . . . . 27
11
Dynamic characteristics . . . . . . . . . . . . . . . . . 33
12
Test information. . . . . . . . . . . . . . . . . . . . . . . . 38
13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 39
14
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
14.1
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
14.2
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 40
14.3
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 40
14.4
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 41
14.5
Package related soldering information . . . . . . 41
15
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 42
16
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
17
Revision history . . . . . . . . . . . . . . . . . . . . . . . 42
18
Legal information . . . . . . . . . . . . . . . . . . . . . . 43
18.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 43
18.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
18.3
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 43
18.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 43
19
Contact information . . . . . . . . . . . . . . . . . . . . 43
20
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
PDF 
ZIP