ChipFind - документация

Электронный компонент: HFBR-1119T

Скачать:  PDF   ZIP

Document Outline

200
Fiber Optic Transmitter
and Receiver Data Links
for 266 MBd
Technical Data
HFBR-1119T Transmitter
HFBR-2119T Receiver
*ST is a registered trademark of AT&T Lightguide Cable Connectors.
applications specified at 266 MBd
for Fibre Channel applications or
for general-purpose fiber optic
data link transmission.
These modules are designed for
50 or 62.5
m core multimode
optical fiber and operate at a
nominal wavelength of 1300 nm.
They incorporate our high-
performance, reliable, long-
wavelength, optical devices and
proven circuit technology to give
long life and consistent
performance.
Transmitter
The transmitter utilizes a 1300 nm
surface-emitting InGaAsP LED,
packaged in an optical subassem-
bly. The LED is dc-coupled to a
custom IC which converts
differential-input, PECL logic
signals, ECL-referenced (shifted)
to a +5 V power supply, into an
analog LED drive current.
Receiver
The receiver utilizes an InGaAs
PIN photodiode coupled to a
custom silicon transimpedance
preamplifier IC. The PIN-
preamplifier combination is ac-
Features
Full Compliance with the
Optical Performance
Requirements of the Fibre
Channel Physical Layer
Other Versions Available for:
- FDDI
- ATM
Compact 16-pin DIP Package
with Plastic ST* Connector
Wave Solder and Aqueous
Wash Process Compatible
Package
Manufactured in an ISO
9001 Certified Facility
Applications
Fibre Channel Interfaces
Multimode Fiber Optic Links
up to 266 MBd at 1500 m
General Purpose, Point-to-
Point Data Communications
Replaces DLT/R1040-ST2
Model Transmitters and
Receivers
Description
The HFBR-1119/-2119 series of
data links are high-performance,
cost-efficient, transmitter and
receiver modules for serial
optical data communication
coupled to a custom quantizer IC
which provides the final pulse
shaping for the logic output and
the Signal Detect function. Both
the Data and Signal Detect
Outputs are differential. Also,
both Data and Signal Detect
Outputs are PECL compatible,
ECL-referenced (shifted) to a
+5 V power supply.
Package
The overall package concept for
the Data Links consists of the
following basic elements: two
optical subassemblies, two
electrical subassemblies, and the
outer housings as illustrated in
Figure 1.
5965-3483E (8/96)
201
DATA IN
SIGNAL
DETECT OUT
DATA IN
RECEIVER
QUANTIZER
IC
DRIVER IC
TOP VIEW
PIN PHOTODIODE
OPTICAL
SUBASSEMBLIES
PREAMP IC
DIFFERENTIAL
DIFFERENTIAL
DIFFERENTIAL
VBB
TRANSMITTER
LED
ELECTRICAL
SUBASSEMBLIES
SIMPLEX ST
RECEPTACLE
The package outline drawing and
pinout are shown in Figures 2
and 3. The details of this package
outline and pinout are compatible
with other data-link modules from
other vendors.
The optical subassemblies consist
of a transmitter subassembly in
which the LED resides and a
receiver subassembly housing the
PIN-preamplifier combination.
The electrical subassemblies con-
sist of a multi-layer printed circuit
board on which the IC chips and
various surface-mounted, passive
circuit elements are attached.
Figure 1. Transmitter and Receiver Block Diagram.
Figure 2. Package Outline Drawing.
41 MAX.
8.31
12.19
MAX.
THREADS
3/8 32 UNEF-2A
HFBR-111X/211XT
DATE CODE (YYWW)
SINGAPORE
5.05
19.72
2.45
7.01
5.0
9.8 MAX.
3
0.9
PCB PINS
DIA. 0.46 mm
NOTE 2
8 x 7.62
17.78
(7 x 2.54)
12
HOUSING PINS 0.38 x 0.5 mm
NOTE 1
NOTES:
1. MATERIAL ALLOY 194 1/2H 0.38 THK
FINISH MATTE TIN PLATE 7.6 m MIN.
2. MATERIAL PHOSPHOR BRONZE WITH
120 MICROINCHES TIN LEAD (90/10)
OVER 50 MICROINCHES NICKEL.
3. UNITS = mm
202
OPTICAL POWER BUDGET dB
FIBER OPTIC CABLE LENGTH km
4
2
0.5
8
1
0
6
0
2
1.5
1
3
5
7
62.5/125 m
50/125 m
Each transmitter and receiver
package includes an internal shield
for the electrical subassembly to
ensure low EMI emissions and high
immunity to external EMI fields.
The outer housing, including the
ST* port, is molded of filled, non-
conductive plastic to provide
mechanical strength and electrical
isolation. For other port styles,
please contact your Hewlett-
Packard Sales Representative.
Each data-link module is attached
to a printed circuit board via the
16-pin DIP interface. Pins 8 and 9
provide mechanical strength for
these plastic-port devices and will
provide port-ground for forthcom-
ing metal-port modules.
Application Information
The Applications Engineering
group of the Optical Communi-
cation Division is available to assist
you with the technical understand-
ing and design tradeoffs associated
with these transmitter and receiver
modules. You can contact them
through your Hewlett-Packard
sales representative.
The following information is
provided to answer some of the
most common questions about the
use of these parts.
Transmitter and Receiver
Optical Power Budget
versus Link Length
The Optical Power Budget (OPB)
is the available optical power for a
fiber-optic link to accommodate
fiber cable losses plus losses due to
in-line connectors, splices, optical
switches, and to provide margin for
link aging and unplanned losses
due to cable plant reconfiguration
or repair.
Figure 4 illustrates the predicted
OPB associated with the trans-
mitter and receiver specified in this
data sheet at the Beginning of Life
(BOL). This curve represents the
attenuation and chromatic plus
modal dispersion losses associated
with 62.5/125
m and 50/125
m
fiber cables only. The area under
the curve represents the remaining
OPB at any link length, which is
available for overcoming non-fiber
cable related losses.
Hewlett-Packard LED technology
has produced 1300 nm LED
devices with lower aging character-
istics than normally associated with
these technologies in the industry.
The industry convention is 1.5 dB
aging for 1300 nm LEDs; however,
HP 1300 nm LEDs will experience
less than 1 dB of aging over
normal commercial equipment
mission-life periods. Contact your
Hewlett-Packard sales represen-
tative for additional details.
Figure 4 was generated with a
Hewlett-Packard fiber-optic link
model containing the current
industry conventions for fiber
cable specifications and Fibre
Channel optical parameters. These
parameters are reflected in the
guaranteed performance of the
transmitter and receiver specifica-
tions in this data sheet. This same
model has been used extensively in
the ANSI and IEEE committees,
including the ANSI X3T9.5
committee, to establish the optical
performance requirements for
various fiber-optic interface
standards. The cable parameters
used come from the ISO/IEC JTC1/
*ST is a registered trademark of AT&T Lightguide Cable Connectors.
Figure 3. Pinout Drawing.
Figure 4. Optical Power Budget at
BOL vs. Fiber Optic Cable Length.
NC
8
9
NC
GND
7
10
NO PIN
VCC
6
11
GND
VCC
5
12
GND
GND
4
13
GND
DATA
3
14
GND
DATA
2
15
VBB
NC
1
16
NC
OPTICAL PORT
TRANSMITTER
NC
8
9
NC
NO PIN
7
10
GND
GND
6
11
VCC
GND
5
12
VCC
GND
4
13
VCC
SD
3
14
DATA
SD
2
15
DATA
NO PIN
1
16
NC
OPTICAL PORT
RECEIVER
203
SC 25/WG3 Generic Cabling for
Customer Premises per DIS 11801
document and the EIA/TIA-568-A
Commercial Building Telecom-
munications Cabling Standard per
SP-2840.
Transmitter and Receiver
Signaling Rate Range and
BER Performance
For purposes of definition, the
symbol rate (Baud), also called
signaling rate, is the reciprocal of
the symbol time. Data rate (bits/
sec) is the symbol rate divided by
the encoding factor used to encode
the data (symbols/bit).
The specifications in this data
sheet have all been measured using
the standard Fibre Channel symbol
rate of 266 MBd.
The data link modules can be used
for other applications at signaling
rates different than specified in this
data sheet. Depending on the
actual signaling rate, there may be
some differences in optical power
budget. This is primarily caused by
a change in receiver sensitivity.
These data link modules can also
be used for applications which
require different bit-error-ratio
(BER) performance. Figure 5
illustrates the typical trade-off
between link BER and the receiver
input optical power level.
Data Link Jitter
Performance
The Hewlett-Packard 1300 nm data
link modules are designed to
operate per the system jitter
allocations stated in FC-PH Annex
A.4.3 and A.4.4.
The 1300 nm transmitter will
tolerate the worst-case input
electrical jitter allowed, without
violating the worst-case output
optical jitter requirements.
The 1300 nm receiver will tolerate
the worst-case input optical jitter
allowed without violating the
worst-case output electrical jitter
allowed.
The jitter specifications stated in
the following transmitter and
receiver specification tables are
derived from the values in FC-PH
Annex A.4.3 and A.4.4. They
represent the worst-case jitter
contribution that the transmitter
and receiver are allowed to make
to the overall system jitter without
violating the allowed allocation. In
practice, the typical jitter contribu-
tion of the Hewlett-Packard data
link modules is well below the
maximum allowed amounts.
Recommended Handling
Precautions
It is advised that normal static pre-
cautions be taken in the handling
and assembly of these data link
modules to prevent damage which
may be induced by electrostatic
discharge (ESD). The HFBR-1119/
-2119 series meets MIL-STD-883C
Method 3015.4 Class 2.
Figure 5. HFBR-1119T/2119T Bit-
Error-Ratio vs. Relative Receiver
Input Optical Power.
Care should be taken to avoid
shorting the receiver Data or
Signal Detect Outputs directly to
ground without proper current-
limiting impedance.
Solder and Wash Process
Compatibility
The transmitter and receiver are
delivered with protective process
caps covering the individual ST*
ports. These process caps protect
the optical subassemblies during
wave solder and aqueous wash
processing and act as dust covers
during shipping.
These data link modules are
compatible with either industry
standard wave- or hand-solder
processes.
Shipping Container
The data link modules are
packaged in a shipping container
designed to protect it from
mechanical and ESD damage
during shipment or storage.
Board LayoutInterface
Circuit and Layout
Guidelines
It is important to take care in the
layout of your circuit board to
achieve optimum performance
from these data link modules.
Figure 6 provides a good example
of a power supply filter circuit that
works well with these parts. Also,
suggested signal terminations for
the Data, Data-bar, Signal Detect
and Signal Detect-bar lines are
shown. Use of a multilayer,
ground-plane printed circuit board
will provide good high-frequency
circuit performance with a low
inductance ground return path. See
additional recommendations noted
in the interface schematic shown in
Figure 6.
BIT ERROR RATIO
RELATIVE INPUT OPTICAL POWER dB
1 x 10
-8
1 x 10
-10
-4
1 x 10
-2
-2
1 x 10
-12
1 x 10
-6
-6
2
0
1 x 10
-11
1 x 10
-9
1 x 10
-7
1 x 10
-5
1 x 10
-3
1 x 10
-4
CONDITIONS:
1. 266 MBd
2. PRBS 2
7
-1
3. TA = 25 C
4. VCC = 5 Vdc
5. INPUT OPTICAL RISE/FALL TIMES =
1.0/1.9 ns
CENTER OF SYMBOL
204
NC 8
9 NC
GND 7
10
V
CC
6
11 GND
V
CC
5
12 GND
V
CC
4
13 GND
D 3
14 SD
D
2
15 SD
NC 1
16
Rx
A
*
L1
1
R12
130
DATA
DATA
TERMINATE D, D, SD, SD AT
INPUTS OF FOLLOW-ON DEVICES
*
NO
PIN
NO
PIN
C1
0.1
C7
10
(OPTIONAL)
C3
0.1
C4
10
R6
130
R8
130
R5
82
R7
82
R9
82
C6
0.1
SD
R11
82
SD
R10
130
TOP VIEWS
Figure 6. Recommended Interface Circuitry and Power Supply Filter Circuits.
NOTES:
1. RESISTANCE IS IN OHMS. CAPACITANCE IS IN MICROFARADS. INDUCTANCE IS IN MICROHENRIES.
2. TERMINATE TRANSMITTER INPUT DATA AND DATA-BAR AT THE TRANSMITTER INPUT PINS. TERMINATE THE RECEIVER OUTPUT DATA, DATA-BAR, AND SIGNAL DETECT-
BAR AT THE FOLLOW-ON DEVICE INPUT PINS. FOR LOWER POWER DISSIPATION IN THE SIGNAL DETECT TERMINATION CIRCUITRY WITH SMALL COMPROMISE TO THE
SIGNAL QUALITY, EACH SIGNAL DETECT OUTPUT CAN BE LOADED WITH 510 OHMS TO GROUND INSTEAD OF THE TWO RESISTOR, SPLIT-LOAD PECL TERMINATION
SHOWN IN THIS SCHEMATIC.
3. MAKE DIFFERENTIAL SIGNAL PATHS SHORT AND OF SAME LENGTH WITH EQUAL TERMINATION IMPEDANCE.
4. SIGNAL TRACES SHOULD BE 50 OHMS MICROSTRIP OR STRIPLINE TRANSMISSION LINES. USE MULTILAYER, GROUND-PLANE PRINTED CIRCUIT BOARD FOR BEST HIGH-
FREQUENCY PERFORMANCE.
5. USE HIGH-FREQUENCY, MONOLITHIC CERAMIC BYPASS CAPACITORS AND LOW SERIES DC RESISTANCE INDUCTORS. RECOMMEND USE OF SURFACE-MOUNT COIL
INDUCTORS AND CAPACITORS. IN LOW NOISE POWER SUPPLY SYSTEMS, FERRITE BEAD INDUCTORS CAN BE SUBSTITUTED FOR COIL INDUCTORS. LOCATE POWER
SUPPLY FILTER COMPONENTS CLOSE TO THEIR RESPECTIVE POWER SUPPLY PINS. C7 IS AN OPTIONAL BYPASS CAPACITOR FOR IMPROVED, LOW-FREQUENCY NOISE
POWER SUPPLY FILTER PERFORMANCE.
6. DEVICE GROUND PINS SHOULD BE DIRECTLY AND INDIVIDUALLY CONNECTED TO GROUND.
7. CAUTION: DO NOT DIRECTLY CONNECT THE FIBER-OPTIC MODULE PECL OUTPUTS (DATA, DATA-BAR, SIGNAL DETECT, SIGNAL DETECT-BAR, V
BB
) TO GROUND WITHOUT
PROPER CURRENT LIMITING IMPEDANCE.
8. (*) OPTIONAL METAL ST OPTICAL PORT TRANSMITTER AND RECEIVER MODULES WILL HAVE PINS 8 AND 9 ELECTRICALLY CONNECTED TO THE METAL PORT ONLY AND
NOT CONNECTED TO THE INTERNAL SIGNAL GROUND.
NC 8
9 NC
7
10 GND
GND 6
11 V
CC
GND 5
12 V
CC
GND 4
13 GND
GND 3
14 D
V
BB
2
15 D
NC 1
16 NC
NO
PIN
Tx
A
C2
0.1
*
L2
1
R3
82
R4
130
R2
82
R1
130
C5
0.1
+5 Vdc
GND
DATA
DATA
TERMINATE D, D
AT Tx INPUTS
*