ChipFind - документация

Электронный компонент: APU4006

Скачать:  PDF   ZIP
4-Bit Micro-Controller with LCD Driver, 1K Word
1/8
FEATURES
Very low current dissipation.
Wide operating voltage range.
Supports both Ag and Li batteries.
Powerful instruction set.
4-level subroutine nesting (including interrupt).
4 event driven interrupts, 2 external and 2 internal.
ROM size: 1024 x 15 bits.
RAM size: 48 x 4 bits.
Input ports: 1 port/ 4 pins (M-PORT).
Control output: ALARM.
LCD driver outputs (can drive up to 60 LCD segments).
Mask option to select 3 LCD drive modes: static, duplex 1/2 duty 1/2 bias, 1/3 duty 1/2 bias.
Mask option permits LCD driver output pins to be used for DC output ports. Up to 20 pins are
available. SEG13-SEG20 can be selected by open-drain output.
Segment PLA circuit permits any layout on the LCD panel.
Built-in clock generator (crystal or RC).
Built-in voltage doubler, halver.
GENERAL DESCRIPTION
TheAPU4006
is a single-chip 4-bit microcontroller with LCD drivers. It can drive up to 3 common time
20 segments, i.e. 60 segments LCD driver. This 4-bit microcontroller contains a 4-bit parallel
processing ALU, 1024 x 15-bit program ROM, 48 x 4-bit data RAM, input ports, alarm driver, timer,
clock generator, crystal and RC oscillator circuit, LCD driver and 70 powerful instructions in a single
chip. It uses HALT instruction to stop all internal operations other than the timer, clock generator,
crystal/RC oscillator and LCD driver. Very low current dissipation can be easily achieved by
combining 4 types of interrupt function and HALT instruction to minimize the operation cycle.
BLOCK DIAGRAM
O U T P U T
P O R T
I N P U T
P O R T
O S C I L L A T O R
6 B I T S P R E S E T
T I M E R
A L U
R A M 4 8 X 4 B I T S
L C D D I R V E R
S E G M E N T P L A
P R E - D I V I D E R
C O N T R O L
C I R C U I T
4 L E V E L S S T A C K
I N S T R U C T I O N
D E C O D E R
1 0 B I T S P R O G R A M
C O U N T E R
P R O M
1 0 2 4 X 1 5 B I T S
4 B I T S D A T A B U S
V D D 1 ~ 2
S E G 1 ~ 2 0
C O M 1 ~ 3
M 1 ~ 4
A L A R M
O S C
IN
O S C
O U T
C U P 1
C U P 2
R E S E T INT
APLUS APU4006
2/8
1.0 PACKAGE & CHIP INFORMATION
Chip Size
1995 x 1590 (
m
m2)
Pad Pitch
min. 140
m
m
Bounding Diagram
OSCIN
OSCOUT
TESTA
M4
M3
M2
M1
INTPAD
RESET
ALARM
VDD2
V D D 1
G N D
C O M 2
C O M 3
S E G 2 0
S E G 1 9
S E G 1 8
S E G 1 7
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
SEG13
SEG14
SEG15
SEG16
V D D
C U P 1
C U P 2
C O M 1
S E G 1
S E G 2
S E G 3
S E G 4
2.0 PIN/PAD ASSIGNMENT
Unit : um
Coordinate
Coordinate
Pad
No.
Name
X
Y
Pad
No.
Name
X
Y
1
GND
1909.5
1128.60
21
SEG4
85.50
199.50
2
VDD1
1909.5
1275.60
22
SEG5
234.00
88.50
3
VDD2
1757.40
1500.60
23
SEG6
381.00
88.50
4
ALARM
1610.40
1500.60
24
SEG7
519.00
88.50
5
RESET
1465.80
1500.60
25
SEG8
657.00
88.50
6
INT
1327.80
1500.60
26
SEG9
795.00
88.50
7
M1
1152.00
1500.60
27
SEG10
933.00
88.50
8
M2
1023.00
1500.60
28
SEG11
1071.00
88.50
9
M3
894.00
1500.60
29
SEG12
1209.00
88.50
10
M4
765.00
1500.60
30
SEG13
1347.00
88.50
11
TESTA
636.00
1500.60
31
SEG14
1485.00
88.50
12
OSCOUT
498.00
1500.60
32
SEG15
1623.00
88.50
APLUS APU4006
3/8
13
OSCIN
155.10
1500.60
33
SEG16
1761.00
88.50
14
VDD
85.50
1132.50
34
SEG17
1909.50
219.60
15
CUP1
85.50
994.50
35
SEG18
1909.50
375.60
16
CUP2
85.50
865.50
36
SEG19
1909.50
527.10
17
COM1
85.50
736.50
37
SEG20
1909.50
678.60
18
SEG1
85.50
607.50
38
COM3
1909.50
830.10
19
SEG2
85.50
478.50
39
COM2
1909.50
981.60
20
SEG3
85.50
349.50
*Note: The substrate must connect to GND.
3.0 PIN DESCRIPTION
Name
Type
Description
OSCIN
OSCOUT
I
O
Typical 32.768kHz crystal is connected across OSCIN/OSCOUT for
oscillation, R/C oscillation mode is also available.
M1 - 4
I
Input pins with pull-down Tr or "L-level hold" Tr.
INT
I
External interrupt request control input pin.
RESET
I
System reset pin with pull-down resistance.
ALARM
O
Output only for outputting 4kHz/2kHz/1kHz modulation signal. Also can be
used to output non-modulation signal.
VDD
Power supply pin for logic unit inside LSI. When using Li version, a
capacitor must be connected across GND and VDD to prevent logic unit
from malfunctioning.
VDD1
For Ag-B mode positive power supply pin.
VDD2
For Li-B(EXTV) mode positive power supply pin.
GND
Negative power supply pin.
CUP1 - 2
O
Pins for connecting voltage step-up (step-down) capacitor.
Output pins for LCD panel common plate.
The following pins are used in each case.
Static
1/2 duty
1/3 duty
COM1
COM2
COM3
Alternating
frequency
O
32Hz*
O
O
32Hz*
O
O
O
43Hz*
COM1 - 3
O
* Frequency can be doubled, quadrupled with PLA.
SEG1 - 20
O
Output pins for LCD panel segments.
* Also used as output ports with mask option.
TESTA
*
Test pin (for internal testing only).
APLUS APU4006
4/8
4.0 ABSOLUTE MAXIMUM RATINGS
at
Ta = 0 to 70oC, GND = 0V
Name
Symbol
Range
Unit
VDD1
+1.3 to +5.5
V
Maximum Supply Voltage
VDD2
+2.5 to +5.5
V
Maximum Input Voltage
Vin1
-0.3 to VDD1+0.3
V
Vout1
-0.3 to VDD1+0.3
V
Maximum Output Voltage
Vout2
-0.3 to VDD2+0.3
V
Maximum Operating Temperature
Topg
0 to +70
oC
Maximum Storage Temperature
Tstg
-25 to +125
oC
5.0 ALLOWABLE OPERATING CONDITIONS
at Ta = 0 to 70oC, GND = 0V
Name
Symb.
Condition
Min.
Max.
Unit
VDD1
1.5
5.25
V
Supply Voltage
VDD2
External RC Mode
3.5
5.25
V
VDD1
1.2
5.25
V
Supply Voltage
VDD2
Crystal Mode
2.4
5.25
V
Vss1
1.2V
V
Oscillator Start-Up
Supply Voltage
Vss2
Crystal Mode
1.2V
V
Input "H" Voltage
Vih1
VDD1-0.3
VDD1+0.3
V
Input "L" Voltage
Vil1
Ag Battery Mode
-0.5
0.2
V
Input "H" Voltage
Vih2
VDD2-0.6
VDD2+0.6
V
Input "L" Voltage
Vil2
Li Battery Mode
-0.7
0.7
V
Input "H" Voltage
Vih3
0.8 x VDD1
VDD1
V
Input "L" Voltage
Vil3
OSCIN at Ext. RC & Ag
Battery Mode
0
0.2 x VDD1
V
Input "H" Voltage
Vih4
0.8 x VDD2
VDD2
V
Input "L" Voltage
Vil4
OSCIN at Ext. RC & Li
Battery Mode
0
0.2 x VDD2
V
Fopg1
Ag Battery Mode
32
32
KHz
Fopg2
Li Battery Mode
32
100
KHz
Operating Freq.
Fopg3
External RC Mode
32
1000
KHz
6.0 ELECTRICAL CHARACTERISTICS
at #1 : VDD1 = 1.2V ( Ag ); #2 : VDD2 = 2.4V ( Li ); #3 : VDD2 = 4V (ExtV).
6.1 Input Resistance
Name
Symb.
Condition
Min.
Typ.
Max.
Unit
Rllh1
Vi = 0.2VDD1, #1
10
40
100
Kohm
Rllh2
Vi = 0.2VDD1, #2
10
40
100
Kohm
M-Port L-Level Hold Tr
Rllh3
Vi = 0.2VDD1, #3
5
20
50
Kohm
Rmsd1
Vi = VDD1, #1
200
700
2000
Kohm
Rmsd2
Vi = VDD2, #2
200
500
1000
Kohm
M-Port Pull-Down Tr
Rmsd3
Vi = VDD2, #3
100
250
500
Kohm
INT Pull-Up Tr
Rintu1
Vi = VDD1, #1
200
700
2000
Kohm
APLUS APU4006
5/8
Rintu2
Vi = VDD2, #2
200
500
1000
Kohm
Rintu3
Vi = VDD2, #3
100
250
500
Kohm
Rintd1
Vi = GND, #1
200
700
2000
Kohm
Rintd2
Vi = GND, #2
200
500
1000
Kohm
INT Pull-Down Tr
Rintd3
Vi = GND, #3
100
250
500
Kohm
Rres1
Vi = GND or VDD1, #1
5
20
50
Kohm
Rres2
Vi = GND or VDD2, #2
5
20
50
Kohm
RES Pull-Down R
Rres3
Vi = GND or VDD2, #3
5
20
50
Kohm
6.2 DC Output Characteristics
Name
Symb.
Condition
for
Min.
Typ.
Max.
Unit
Voh1a
Ioh = 200
m
A, #1
0.8
0.9
1.0
V
Voh2a
Ioh = 500
m
A, #2
1.5
1.8
2.1
V
Output "H" Voltage
Voh3a
Ioh = 1mA, #3
2.5
3
3.5
V
Vol1a
Iol = 400
m
A, #1
0.2
0.3
0.4
V
Vol2a
Iol = 1mA, #2
0.3
0.6
0.9
V
Output "L" Voltage
Vol3a
Iol = 2mA, #3
Alarm
0.5
1
1.5
V
6.3 Segment Driver Output Characteristics
Name
Symb.
Condition
for
Min.
Typ.
Max.
Unit
CMOS Output Mode
Voh1c
Ioh = -10uA, #1
0.8
0.9
1.0
V
Voh2c
Ioh = -50uA, #2
1.5
1.8
2.1
V
Output "H" Voltage
Voh3c
Ioh = -200uA, #3
2.5
3
3.5
V
Vol1c
Iol = 20uA, #1
0.2
0.3
0.4
V
Vol2c
Iol = 100uA, #2
0.3
0.6
0.9
V
Output "L" Voltage
Vol3c
Iol = 400uA, #3
SEGn
0.5
1
1.5
V
Static Display Mode
Voh1d
Ioh = -1uA, #1
1.0
V
Voh2d
Ioh = -1uA, #2
2.2
V
Output "H" Voltage
Voh3d
Ioh = -1uA, #3
3.8
V
Vol1d
Iol = 1uA, #1
0.2
V
Vol2d
Iol = 1uA, #2
0.2
V
Output "L" Voltage
Vol3d
Iol = 1uA, #3
SEGn
0.2
V
Voh1e
Ioh = -10uA, #1
1.0
V
Voh2e
Ioh = -10uA, #2
2.2
V
Output "H" Voltage
Voh3e
Ioh = -10uA, #3
3.8
V
Vol1e
Iol = 10uA, #1
0.2
V
Vol2e
Iol = 10uA, #2
0.2
V
Output "L" Voltage
Vol3e
Iol = 10uA, #3
COMn
0.2
V
Duplex (1/2 Bias, 1/2 Duty) Display Mode
Voh12f
Ioh = -1uA, #1, #2
2.2
V
Output "H" Voltage
Voh3f
Ioh = -1uA, #3
3.8
V
Vol12f
Iol = 1uA, #1, #2
0.2
V
Output "L" Voltage
Vol3f
Iol = 1uA, #3
SEGn
0.2
V
Voh12g
Ioh = -10uA, #1, #2
2.2
V
Output "H" Voltage
Voh3g
Ioh = -10uA, #3
COMn
3.8
V
APLUS APU4006