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Электронный компонент: MH2

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Rev. 4145BAERO06/02
1
Features
Comprehensive Library of Standard Logic Cells
MH2 I/O Cells Designed to Operate With VDD 2.5V 0.2V as Main Target Operating
Conditions
IO33 Pad Library Provides Interface to 3.3V Environment
Memory Cells Compiled to the Precise Requirements of the Design
Processed on 0.25 m CMOS Process, 5 Metal Layers
Pre-defined Pad Frames
LVDS, LVTTL, PCI, PECL Buffers
75 m Buffer Pitch Allowing up to 750 Pads
High Speed: <100 ps Typical Propagation Gate Delay (NAND2 with FO = 2)
Up to 5M gates
Up to 2.25-Mbit Memory Compiler
MQFP Package with Pin Count up to 352
CLGA Packages with 1.27 mm and 1 mm Column Pitches and Pin Count up to 613
Description
The Atmel MH2 cell based ASIC series are fabricated on a 0.25 micron CMOS pro-
cess, with up to 5 levels of metal for interconnect. This family allows up to 5 million
gates and 800 pads. The high density and high pin count capabilities of the MH2 fam-
ily, coupled with the ability to embed processor cores and memories on the same
silicon, make the MH2 series an ideal choice for System Level Integration.
The MH2 series is supported by an advanced software environment based on industry
standards linking proprietary and commercial tools. Verilog
, DFT
, Synopsys
and
Vital are the reference front-end tools. The Cadence
TM
"Logic Design Planner" floor
planning associated with timing driven layout provides an efficient back-end cycle.
The MH2 series comes as a dual use of the MH2RT series, without the radiation
assurance.
The MH2 series is the Atmel 8th generation of ASIC series designed for military and
avionics applications over 19 years.
It is made available to any of the currently available quality grades, including
QML Q.
The Atmel MH2 family is fabricated on a proprietary 0.25 micron five-layer-metal
CMOS process intended for use with a supply voltage of 2.5V 0.2V. Table 1 shows
the range for which Atmel library cells will be characterized.
The MH2 Series is offered with a multi project wafer service.
5M Gates
0.25 m CMOS
Cell-based ASIC
for Military/
Avionics
MH2
Advanced
Information
2
MH2
4145BAERO06/02
The Atmel cell libraries and megacell compilers have been designed in order to be com-
patible with each other. Simulation representations exist for three types of operating
conditions. They correspond to three characterization conditions defined as follows:
MIN conditions:
TJ = -55
C
VDD (cell) = 2.7V
Process = fast (military best case)
TYP conditions:
TJ = +25
C
VDD (cell) = 2.5V
Process = typ (military typical case)
MAX conditions:
TJ = +125
C
VDD (cell) = 2.3V
Process = slow (military worst case)
Delays to tri-state are defined as delays in turning off (VGS < VT) of the driving devices.
Output pad drain current corresponds to the output current of the pad when the output
voltage is VOL or VOH. The output resistor of the pad and the voltage drop due to
access resistors (in and out of the die) are taken into account. In order to have accurate
timing estimates, all characterization has been run on electrical netlists extracted from
the layout database.
Table 1. Recommended Operating Conditions
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
DD
DC Supply Voltage
Core and Standard I/Os
2.3
2.5
2.7
V
V
DD3
DC Supply Voltage
3V Interface I/Os
3
3.3
3.6
V
V
I
DC Input Voltage
0
V
DD
V
V
O
DC Output Voltage
0
V
DD
V
TEMP
Operating Free Air
Temperature Range
Military
-55
+125
C
3
MH2
4145BAERO06/02
Standard Cell Library
The Atmel Standard Cell Library, contains a comprehensive set of combinational logic
and storage cells. The library includes cells which belong to the following categories:
Buffers and Gates
Multiplexers
Flip-flops
Scan Flip-flops
Latches
Adders and Subtractors
Decoding the Cell Name
The table below shows the naming conventions for the cells in the library. Each cell
name begins with either a two-, three-, or four-letter code that defines the type of cell.
This indicates the range of standard cells available.
Table 2. Cell Codes
Code
Description
Code
Description
AD
Adder
INVT
Inverting 3-State Buffer
AH
Half Adder
JK
JK Flip-Flop
AS
Adder/Subtractor
LA
D Latch
AN
AND Gate
MI
Inverting Multiplexer
AOI
AND-OR-Invert Gate
MX
Multiplexer
AON
AND-OR-AND-Invert Gates
ND
NAND Gate
AOR
AND-OR Gate
NR
NOR Gate
BH
Bus Holder
OAI
OR-AND-Invert Gate
BUFB
Balanced Buffer
OAN
OR-AND-OR-Invert Gates
BUFF
Non-Inverting Buffer
OR
OR Gate
BUFT
Non-Inverting 3-State Buffer
ORA
OR-AND Gate
CG
Carry Generator
SD
Multiplexed Scan D Flip-Flop
CLK2
Clock Buffer
SE
Multiplexed Scan Enable D Flip-Flop
DE
D-Enabled Flip-Flop
SRLA
Set/Reset Latches with NAND input
DF
D Flip-Flop
SU
Subtractor
INV0
Inverter
XN
Exclusive NOR Gate
INVB
Balanced Inverter
XR
Exclusive OR Gate
4
MH2
4145BAERO06/02
Cell Matrices
The following three tables provide a quick reference to the storage elements in the
library. Note that all storage elements feature buffered clock inputs and buffered output.
Table 3. JK Flip-flops
Macro Name
Set
Clear
1x Drive
2x Drive
JKBRBx
Table 4. D Flip-flops
Macro Name
Set
Clear
Enabled D Input
1x Drive
2x Drive
Single Output
DFBRBx
DFCRBx
DFCRQx
DFCRNx
DFNRBx
DFNRQx
DFPRBx
DEPRQx
DENRQx
DENRBx
DECRQx
Table 5. Scan Flip-flops
Macro Name
Set
Clear
1x Drive
2x Drive
Single Output
SDBRBx
SDCRBx
SDCRNx
SDCRQx
SDNRBx
SDNRNx
SDNRQx
SDPRBx
SECRQx
SENRQx
SEPRQx
5
MH2
4145BAERO06/02
Input/Output Pad Cell
Libraries IO25lib and
IO33lib
The Atmel Input/Output Cell Library, IO25lib, contains a comprehensive list of input, out-
put, bidirectional and tri-state cells. The MH2 (2.5V) cell library includes a special set of
I/O cells, IO33lib, for interfacing with external 3.3V devices.
Voltage Levels
The IO25lib library is made up exclusively of low-voltage chip interface circuits powered
by a voltage in the range of 2.3V to 2.7V. The library is compatible with the 2.5-volt stan-
dard cells library.
Power and Ground Pads
Designers are strongly encouraged to provide three kinds of power pairs for the IO25lib
library. These are "AC", "DC" and core power pairs. AC power is used by the I/O to
switch its output from one state to the other. This switching generates noise in the AC
power buses on the chip. DC power is used by the I/O to maintain its output in a steady
state. The best noise performance is achieved when the DC power buses on the chip
are free of noise; designers are encouraged to use separate power pairs for AC and DC
power to prevent most of the noise in the AC power buses from reaching the DC power
buses. The same power pairs can be used to supply both DC power to the I/Os and
power to the core without affecting noise performance.
Table 6. VSS Power Pad Combinations
Core
Switching I/O
Quiet I/O
Library Cell Name
Signal Name
Vssi
VssAC
VssDC
pv25i00
VSS
pv25a00
VSS
pv25d00
VSS
pv25e00
VSS
pv25b00
VSS
pv25f00
VSS
Table 7. VDD Power Pad Combinations
Core
Switching I/O
Quiet I/O
Library Cell Name
Signal Name
Vddi
VddAC
VddDC
pv25i25
VDD
pv25a25
VDD
pv25d25
VDD
pv25e25
VDD
pv25b25
VDD
pv25f25
VDD