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Электронный компонент: MBRD1035CTL

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DS30286 Rev. B-2
1 of 3
MBRD1035CTL
MBRD1035CTL
10A SURFACE MOUNT DUAL SCHOTTKY BARRIER RECTIFIER
Features
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Case: DPAK Molded Plastic
Terminals: Solderable per MIL-STD-202,
Method 208
Polarity: See Diagram
Marking: See Sheet 2
Weight: 0.4 grams (approx.)
Ordering Information: See Below
Mechanical Data
B
C
D
E
G
H
J
K
L
M
A
P
1
2
3
4
PIN 1
PIN 3
PIN 4, BOTTOMSIDE
HEAT SINK
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
35
V
RMS Reverse Voltage
V
R(RMS)
25
V
Average Rectified Output Current Per Leg
(See Figure 4) Per Package
I
O
5
10
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Per Package (JEDEC Method)
I
FSM
75
A
Typical Thermal Resistance Junction to Case Bottom Side Per Leg
(Note 1)
R
qJC
2.43
C/W
Voltage Rate of Change @ V
R
= 35V, T
j
= 25C
dv/dt
10,000
V/
ms
Operating Temperature Range
T
j
-55 to +125
C
Storage Temperature Range
T
STG
-55 to +125
C
Guard Ring Die Construction for
Transient Protection
Low Power Loss, High Efficiency
High Surge Capability
Very Low Forward Voltage Drop
For Use in Low Voltage, High Frequency
Inverters, OR'ing, and Polarity Protection
Applications
Plastic Material: UL Flammability
Classification Rating 94V-0
NEW
PRODUCT
Maximum Ratings
@ T
A
= 25
C unless otherwise specified
DPAK
Dim
Min
Max
A
6.3
6.7
B
10
C
0.3
0.8
D
2.3 Nominal
E
2.1
2.5
G
0.4
0.6
H
1.2
1.6
J
5.3
5.7
K
0.5 Nominal
L
1.3
1.8
M
1.0
P
5.1
5.5
All Dimensions in mm
Notes:
1. Device mounted on PC board with 14mm
2
(.013mm thick) copper pad areas.
Ordering Information
(Note 2)
Device
Packaging
Shipping
MBRD1035CTL-T
DPAK
2500/Tape & Reel
Notes:
2. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
MBRD1035CTL = Product type marking code
= Manufacturers' code marking
YWW = Date code marking
Y = Last digit of year ex: 2 for 2002
WW = Week code 01 to 52
YWW
MBRD
1035CTL
DS30286 Rev. B-2
2 of 3
MBRD1035CTL
Notes:
1. Device mounted on PC board with 14mm
2
(.013mm thick) copper pad areas.
2. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
3. Short duration pulse test used to minimize self-heating effect.
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 3)
V
(BR)R
35
V
I
R
= 500
mA
Forward Voltage (Note 3)
V
FM
0.47
0.41
0.56
0.55
V
I
F
= 5A, T
S
= 25
C
I
F
= 5A, T
S
= 100
C
I
F
= 10A, T
S
= 25
C
I
F
= 10A, T
S
= 100
C
Peak Reverse Current (Note 3)
I
RM
0.04
2.0
30
200
5
mA
mA
mA
mA
V
R
= 35V, T
j
= 25C
V
R
= 35V, T
j
= 100C
V
R
= 17.5V, T
j
= 25C
V
R
= 17.5V, T
j
= 100C
Typical Junction Capacitance
C
j
340
pF
f = 1.0MHz, V
R
= 4.0V DC
Electrical Characteristics
@ T
A
= 25
C unless otherwise specified
NEW
PRODUCT
1
0.1
0.01
0.001
10
100
0
10
20
30
35
I
,
INST
ANT
ANE
O
US
REVERSE
CURRENT
(mA)
R
V , INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 2 Typical Reverse Characteristics (Per Element)
R
5
15
25
T = +25 C
j
T = +125 C
j
T = +100 C
j
0
100
200
300
400
600
500
I
,
INST
ANT
ANE
O
US
F
O
R
W
ARD
CURRENT
(A)
F
V , INSTANTANEOUS FORWARD VOLTAGE (mV)
Fig. 1 Typical Forward Characteristics (Per Element)
F
10
1
0.1
0.01
0.001
0.0001
100
T = +25 C
j
T = 125 C
j
T = 100 C
j
Marking Information
DS30286 Rev. B-2
3 of 3
MBRD1035CTL
NEW
PRODUCT
0
0.5
1.0
1.5
2.5
2.0
3.0
3.5
4.0
0
1
3
2
4
5
6
7
8
9
10
P
,
A
VERAGE
FOR
W
ARD
POWER
DISSIP
A
TION
(W
)
F(A
V)
I
, AVERAGE FORWARD CURRENT (A)
Fig. 5 Forward Power Dissipation (Per Element)
F(AV)
T = 125C
j
2
3
10
100
1000
0
15
10
25
30
35
20
40
C
,
JUNCTION
CAP
ACIT
ANCE
(pF)
j
V , REVERSE VOLTAGE (V)
Fig. 3 Typical Junction Capacitance vs.
Reverse Voltage (Per Element)
R
5
f = 1MHz
0
1
2
4
3
5
6
7
-25
0
25
50
75
100
125
150
I
,
A
VERAGE
F
O
R
W
ARD
CURRENT
(A)
F(A
V)
T , AMBIENT TEMPERATURE (C)
Fig. 4 DC Forward Current Derating (Per Element)
A
Note 1
Note 2
Note 3
Notes: 1. T
A
= T
SOLDERING POINT
, R
qJC
= 2.43
C/W, R
qCA
= 0
C/W.
2. Device mounted on GETEK substrate, 2"x2", 2 oz. copper, double-sided, cathode pad dimensions 0.75" x 1.0", anode pad
dimensions 0.25" x 1.0". R
qJA
in range of 15-30C/W.
3. Device mounted on FR-4 substrate, 2"x2", 2 oz. copper, single-sided, pad layout as per Diodes Inc. suggested pad layout
document AP02001 which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. R
qJA
in range of
60-75C/W.