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Электронный компонент: PDS3200

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3
Case: PowerDI
5
Case Material: Molded Plastic, "Green" Molding
Compound. UL Flammability Classification Rating
94V-0
Moisture sensitivity: Level 1 per J-STD-020C
Terminals: Finish Matte Tin annealed over
Copper leadframe. Solderable per MIL-STD-202,
Method 208
Polarity: See Diagram
Marking: See Page 3
Weight: 0.096 grams (approx.)
DS30470 Rev. 12 - 2
1 of 3
PDS3200
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
Diodes Incorporated
PDS3200
3A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER
PowerDI
5
Features
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Mechanical Data
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
200
V
RMS Reverse Voltage
V
R(RMS)
141
V
Average Rectified Output Current (See also figure 5)
I
O
3
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
I
FSM
180
A
Operating and Storage Temperature Range
T
j
, T
STG
-65 to +150
C
Guard Ring Die Construction for
Transient Protection
Low Forward Voltage Drop
Very Low Leakage Current
High Junction Temperature Capability
High Forward Surge Current Capability
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
T
C
U
D
O
R
P
W
E
N
E
E1
b1
A
A2
A2
D
b2
b1
e
L1
L1
E
b1
D
b2
b1
e
D2
L
E2
L1
LEFT PIN
RIGHT PIN
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
BOTTOMSIDE
HEAT SINK
W
PowerDI
5
Dim
Min
Max
A
1.05
1.15
A2
0.33
0.43
b1
0.80
0.99
b2
1.70
1.88
D
3.90
4.05
D2
3.05 NOM
E
6.40
6.60
e
1.84 NOM
E1
5.30
5.45
E2
3.55 NOM
L
0.75
0.95
L1
0.50
0.65
W
1.20
1.50
All Dimensions in mm
Maximum Ratings
@ T
A
= 25
C unless otherwise specified
Characteristic
Symbol
Typ
Max
Unit
Thermal Resistance Junction to Soldering Point
R
qJS
2.0
C/W
Thermal Resistance Junction to Ambient Air (Note 2)
R
qJA
75
90
C/W
Thermal Characteristics
@ T
A
= 25
C unless otherwise specified
Notes: 1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
SPICE MODEL: PDS3200
DS30470 Rev. 12 - 2
2 of 3
PDS3200
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
T
C
U
D
O
R
P
W
E
N
0
40
80
120
160
200
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Fig. 3 Typical Reverse Characteristics
I
,
INST
ANT
ANE
O
US
REVERSE
CURRENT
(mA)
R
0.001
0.01
0.1
1
10
T = +125C
j
T = +150C
j
T = +85C
j
0
40
80
120
160
200
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Fig. 2 Typical Reverse Characteristics
0.0001
0.001
0.01
0.1
1
T = +25C
j
T = -65C
j
V , INSTANTANEOUS FORWARD VOLTAGE (mV)
F
Fig. 1 Typical Forward Characteristics
I
,
INST
ANT
ANE
O
US
F
O
R
W
ARD
CURRENT
(mA)
F
0.01
0.1
1
10
100
1000
10000
100000
0
100 200 300 400 500 600 700 800 900 1000 1100 1200 1300
T = 150
C
j
T = 125
C
j
T = 85
C
j
T = 25
C
j
T = -65
C
j
Electrical Characteristics
@ T
A
= 25
C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 3)
V
(BR)R
200
V
I
R
= 10
mA
Forward Voltage
V
F
0.75
0.59
0.82
0.66
0.78
0.64
0.88
0.71
V
I
F
= 3A, T
S
= 25
C
I
F
= 3A, T
S
= 125
C
I
F
= 6A, T
S
= 25
C
I
F
= 6A, T
S
= 125
C
Reverse Leakage Current (Note 3)
I
R
1
0.8
10
4.5
mA
mA
T
S
= 25
C, V
R
= 200V
T
S
= 125
C, V
R
= 200V
Notes: 3. Short duration test pulse used to minimize self-heating effect.
0
40
C
,
T
O
T
A
L
CAP
ACIT
ANCE
(pF)
T
V , REVERSE VOLTAGE (V)
R
Fig. 4 Typical Total Capacitance
0
100
200
300
400
500
600
700
800
5
10
15
20
25
30
35
f = 1MHz
DS30470 Rev. 12 - 2
3 of 3
PDS3200
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
T
C
U
D
O
R
P
W
E
N
S3200 = Product type marking code
= Manufacturers' code marking
YYWW = Date code marking
YY = Last digit of year ex: 04 for 2004
WW = Week code 01 to 52
K = Factory Designator
YYWWK
S3200
Device
Packaging
Shipping
PDS3200-13
PowerDI
5
5000/Tape & Reel
(Note 5)
0
I
,
DC
FOR
W
ARD
CURRENT
(A)
F
T , AMBIENT TEMPERATURE (C)
A
Fig. 5 DC Forward Current Derating
0
0.75
1.5
2.25
3.0
3.75
20
40
60
80 100 120
160
140
180
Note 2
Note 4
T = 150
C
j
0
2
10
8
6
4
0
3
6
9
P
,
A
VERAGE
FOR
W
ARD
F(A
V)
POWER
DISSIP
A
TION
(W)
I
, AVERAGE FORWARD CURRENT (A)
F(AV)
Fig. 6 Forward Power Dissipation
T = 150
C
j
I
PK
I
AV
= 1 (DC)
0
40
20
200
180
160
140
120
100
80
60
0
50
100
150
200
T
,
DERA
TED
AMBIENT
TEMPERA
TURE
(C)
A
V , DC REVERSE VOLTAGE (V)
R
Fig. 7 Operating Temperature Derating
Note 2
Ordering Information
Notes: 2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
3. Short duration test pulse used to minimize self-heating effect.
4. Polyimide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
5.
For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information