Advanced Product Information
1.1
1
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email:
sales@filcsi.com
Website: www.filcs.com
FMS2006
DC- 6 GHz SPDT WLAN GaAs Low Loss Switch
Features:
Suitable for Multi-band WLAN Applications
Excellent low control voltage performance
Very low Insertion loss <0.55 dB at 6GHz typical
High isolation >25 dB at 6GHz typical
VC1
ANT
VC2
RF1
RF2
GND
GND
Description and Applications:
The FMS2006 is a low loss, multi-band single pole double throw Gallium Arsenide antenna switch
designed for use in Wireless LAN applications. The die is fabricated using the Filtronic FL05 0.5
m
switch process technology that offers leading edge performance optimised for switch applications.
Simulated Electrical Specifications:
(T
AMBIENT
= 25C,V
ctrl
= 0V/(2.4V,+3.3V), Z
IN
= Z
OUT
= 50
)
Parameter
Conditions
Min
Typ
Max
Units
Insertion Loss (All Paths)
(0.5-6) GHz, Small Signal
0.55
dB
Isolation (All Paths)
(0.5-6) GHz, Small Signal
25
dB
Return Loss
(0.5-6) GHz, Small Signal
20
dB
2nd Harmonic Level
3 GHz, Pin = 20dBm, Vctrl =2.4V
-70
dBc
3rd Harmonic Level
3 GHz, Pin = 20dBm, Vctrl =2.4V
-70
dBc
Switching speed
Vctrl=2.4V, Pin=20dBm
30
ns
P1dB
2.4V
control
30 dBm
Note: External DC blocking capacitors are required on all RF ports (typ: 47pF)
Functional Schematic
Advanced Product Information
1.1
2
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email:
sales@filcsi.com
Website: www.filcs.com
FMS2006
Truth Table:
V
ctrl1
V
ctrl2
ANT-RF1
ANT-RF2
High Low On Off
Low High Off On
Note:
`High' = +2.4V to +3.3V
`Low' = 0V to +0.2V
Pad and Die Layout:
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
Die Size
( m x m )
Die Thickness (
m)
Min. Bond Pad
Pitch(
m)
Min. Bond pad
Opening (
m xm )
750 x 510
150
152
72 x 72
Pad
Reference
Description
Pin Coordinates
(m)
ANT Antenna
375,412
RF1 Receive
108,260
RF2 Transmit
641,260
VC1
Vctrl1 (ANT to RF1 Control)
108,412
VC2
Vctrl2 (ANT to RF2 Control)
641,412
GND1 Ground
108,108
GND2 Ground
641,108
VC1
RF1
GND1
VC2
RF2
GND2
ANT
Advanced Product Information
1.1
3
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email:
sales@filcsi.com
Website: www.filcs.com
FMS2006
Simulated Performance:
Insertion Loss
0.5
2.5
4.5
6
Frequency (GHz)
-0.58
-0.56
-0.54
-0.52
-0.5
-0.48
L
o
ss (
d
B)
Isolation
0.5
2.5
4.5
6
Frequency (GHz)
-45
-40
-35
-30
-25
Is
ol
ati
on (
d
B
)
Return Loss
0.5
2.5
4.5
6
Frequency (GHz)
-35
-30
-25
-20
-15
S1
1 (
d
B)
Advanced Product Information
1.2
4
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email:
sales@filsi.com
Website: www.filcs.com
FMS2006
Preferred Assembly Instructions:
GaAs devices are fragile and should be handled with great care. Specially designed collets should be
used where possible.
The back of the die is not metallised and the recommended mounting method is by the use of
conductive epoxy. Epoxy should be applied to the attachment surface uniformly and sparingly to avoid
encroachment of epoxy on to the top face of the die and ideally should not exceed half the chip height.
For automated dispense Ablestick LMISR4 is recommended and for manual dispense Ablestick 84-1
LMI or 84-1 LMIT are recommended. These should be cured at a temperature of 150
C for 1 hour in
an oven especially set aside for epoxy curing only. If possible the curing oven should be flushed with
dry nitrogen.
This part has gold (Au) bond pads requiring the use of gold (99.99% pure) bondwire. It is
recommended that 25.4
m diameter gold wire is used. Thermosonic ball bonding is preferred. A
nominal stage temperature of 150
C and a bonding force of 40g has been shown to give effective
results for 25
m wire. Ultrasonic energy shall be kept to a minimum. For this bonding technique,
stage temperature should not be raised above 200C and bond force should not be raised above 60g.
Thermosonic wedge bonding and thermocompression wedge bonding can also be used to achieve
good wire bonds.
Bonds should be made from the die first and then to the mounting substrate or package. The physical
length of the bondwires should be minimised especially when making RF or ground connections.
Handling Precautions:
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic
Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and
testing. These devices should be treated as Class 1A (0-500 V) as defined in JEDEC Standard No.
22-A114-B. Further information on ESD control measures can be found in MIL-STD-1686 and MIL-
HDBK-263.
Disclaimers:
This product is not designed for use in any space based or life sustaining/supporting equipment.
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