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Freescale Semiconductor
Data Sheet: Product Preview
Document Number: MPC5566
Rev. 0, 06/2006
Contents
Freescale Semiconductor, Inc., 2006. All rights reserved.
Preliminary--Subject to Change Without Notice
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
This document provides electrical specifications, pin
assignments, and package diagrams for the MPC5566
microcontroller device. For functional characteristics,
refer to the MPC5566 Microcontroller Reference
Manual.
1
Overview
The MPC5566 microcontroller (MCU) is a member of
the MPC5500 family of microcontrollers based on the
PowerPCTM Book E architecture. This family of parts
contains many new features coupled with high
performance CMOS technology to provide substantial
reduction of cost per feature and significant performance
improvement over the MPC500 family.
The host processor core of this device is compatible with
the PowerPC Book E architecture. It is 100% user mode
compatible (with floating point library) with the classic
PowerPC instruction set. The Book E architecture has
enhancements that improve the PowerPC architecture's
fit in embedded applications. This core also has
additional instructions, including digital signal
processing (DSP) instructions, beyond the classic
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2
Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . 5
3.3
Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.4
EMI (Electromagnetic Interference) Characteristics 8
3.5
ESD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 9
3.6
VRC/POR Electrical Specifications . . . . . . . . . . . . . 9
3.7
Power Up/Down Sequencing. . . . . . . . . . . . . . . . . 10
3.8
DC Electrical Specifications. . . . . . . . . . . . . . . . . . 12
3.9
Oscillator & FMPLL Electrical Characteristics . . . . 19
3.10 eQADC Electrical Characteristics . . . . . . . . . . . . . 20
3.11 H7Fa Flash Memory Electrical Characteristics . . . 22
3.12 AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.13 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.14 Fast Ethernet AC Timing Specifications . . . . . . . . 45
4
Mechanicals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
4.1
Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
4.2
Package Dimensions. . . . . . . . . . . . . . . . . . . . . . . 52
5
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . 53
MPC5566 Microcontroller
Data Sheet
by: Microcontroller Division
MPC5566 Microcontroller Data Sheet, Rev. 0
Preliminary--Subject to Change Without Notice
Overview
Freescale Semiconductor
2
PowerPC instruction set. This family of parts contains many new features coupled with high performance
CMOS technology to provide significant performance improvement over the MPC565.
The MPC5566 of the MPC5500 family has two levels of memory hierarchy. The fastest accesses are to the
32-kilobyte unified cache. The next level in the hierarchy contains the 128-kilobyte on-chip internal
SRAM and 3 Mbyte internal Flash memory. Both the internal SRAM and the Flash memory can hold
instructions and data. The external bus interface has been designed to support most of the standard
memories used with the MPC5xx family.
The complex I/O timer functions of the MPC5500 family are performed by two enhanced time processor
unit engines (eTPU). Each eTPU engine controls 32 hardware channels. The eTPU has been enhanced
over the TPU by providing 24-bit timers, double action hardware channels, variable number of parameters
per channel, angle clock hardware, and additional control and arithmetic instructions. The eTPU can be
programmed using a high-level programming language.
The less complex timer functions of the MPC5500 family are performed by the enhanced modular
input/output system (eMIOS). The eMIOS' 24 hardware channels are capable of single action, double
action, pulse width modulation (PWM), and modulus counter operation. Motor control capabilities include
edge-aligned and center-aligned PWM.
Off-chip communication is performed by a suite of serial protocols including controller area networks
(FlexCANs), enhanced deserial/serial peripheral interfaces (DSPI), and enhanced serial communications
interfaces (eSCIs). The DSPIs support pin reduction through hardware serialization and deserialization of
timer channels and general-purpose input/output (GPIO) signals.
The MCU of the MPC5566 has an on-chip 40-channel enhanced queued dual analog-to-digital converter
(eQADC).
The system integration unit (SIU) performs several chip-wide configuration functions. Pad configuration
and general-purpose input and output (GPIO) are controlled from the SIU. External interrupts and reset
control are also found in the SIU. The internal multiplexer submodule (SIU_DISR) provides multiplexing
of eQADC trigger sources, daisy chaining the DSPIs and external interrupt signal multiplexing.
Ordering Information
MPC5566 Microcontroller Data Sheet, Rev. 0
Preliminary--Subject to Change Without Notice
Freescale Semiconductor
3
2
Ordering Information
Figure 1. MPC5500 Family Part Number Example
Table 1. Orderable Part Numbers
Freescale Part
Number
Description
Speed
(MHz)
Max Speed
1
(MHz) (f
MAX
)
1
Speed is the nominal maximum frequency. Max Speed is the maximum speed allowed including any frequency
modulation. 80-MHz parts allow for 80 MHz + 2% modulation. However, 132-MHz allows only 128 MHz + 2% FM.
Temperature
MPC5566MVR132
MPC5566 Lead free 416 package
132
132
-40 C to 125 C
MPC5566MZP132
MPC5566 Lead 416 package
132
132
-40 C to 125 C
MPC5566MVR112
MPC5566 Lead free 416 package
112
114
-40 C to 125 C
MPC5566MZP112
MPC5566 Lead 416 package
112
114
-40 C to 125 C
MPC5566MVR80
MPC5566 Lead free 416 package
80
82
-40 C to 125 C
MPC5566MZP80
MPC5566 Lead 416 package
80
82
-40 C to 125 C
M PC
M
80 R2
Qualification Status
Core Code
Device Number
Temperature Range
Package Identifier
Operating Frequency (MHz)
Tape and Reel Status
Temperature Range
M = -40 C to 125 C
A = -55 C to 125 C
Package Identifier
ZP = 416PBGA SnPb
VR = 416PBGA Pb-free
Operating Frequency
80 = 80MHz
112 = 112MHz
132 = 132MHz
Note: Not all options are available on all devices. Refer to
Table 1
.
Tape and Reel Status
R2 = Tape and Reel
(blank) = Trays
Qualification Status
P = Pre Qualification
M = Full Spec Qualified
5566
ZP
MPC5566 Microcontroller Data Sheet, Rev. 0
Preliminary--Subject to Change Without Notice
Electrical Characteristics
Freescale Semiconductor
4
3
Electrical Characteristics
This section contains detailed information on power considerations, DC/AC electrical characteristics, and
AC timing specifications for the MCU.
3.1
Maximum Ratings
Table 2. Absolute Maximum Ratings
1
Num
Characteristic
Symbol
Min
Max
2
Unit
1
1.5V Core Supply Voltage
3
V
DD
0.3
1.7
V
2
Flash Program/Erase Voltage
V
PP
0.3
6.5
V
3
Flash Core Voltage
V
DDF
0.3
1.7
V
4
Flash Read Voltage
V
FLASH
0.3
4.6
V
5
SRAM Standby Voltage
V
STBY
0.3
1.7
V
6
Clock Synthesizer Voltage
V
DDSYN
0.3
4.6
V
7
3.3V I/O Buffer Voltage
V
DD33
0.3
4.6
V
8
Voltage Regulator Control Input Voltage
V
RC33
0.3
4.6
V
9
Analog Supply Voltage (reference to V
SSA
)
V
DDA
0.3
5.5
V
10
I/O Supply Voltage (Fast I/O Pads)
4
V
DDE
0.3
4.6
V
11
I/O Supply Voltage (Slow/Medium I/O Pads)
4
V
DDEH
0.3
6.5
V
12
DC Input Voltage
5
VDDEH powered I/O Pads, except eTPUB15 and
SINB (DSPI_B_SIN)
VDDEH powered I/O Pads (eTPUB15 and SINB)
VDDE powered I/O Pads
V
IN
1.0
6
0.3
7
1.0
6
6.5
8
6.5
8
4.6
9
V
13
Analog Reference High Voltage (reference to VRL)
V
RH
0.3
5.5
V
14
VSS Differential Voltage
V
SS
V
SSA
0.1
0.1
V
15
VDD Differential Voltage
V
DD
V
DDA
V
DDA
V
DD
V
16
V
REF
Differential Voltage
V
RH
V
RL
0.3
5.5
V
17
V
RH
to VDDA Differential Voltage
V
RH
V
DDA
5.5
5.5
V
18
V
RL
to VSSA Differential Voltage
V
RL
V
SSA
0.3
0.3
V
19
V
DDEH
to V
DDA
Differential Voltage
V
DDEH
V
DDA
V
DDA
V
DDEH
V
20
V
DDF
to V
DD
Differential Voltage
V
DDF
V
DD
0.3
0.3
V
21
This spec has been moved to
Table 9
, spec 43a.
22
VSSSYN to VSS Differential Voltage
V
SSSYN
V
SS
0.1
0.1
V
23
V
RCVSS
to V
SS
Differential Voltage
V
RCVSS
V
SS
0.1
0.1
V
24
Maximum DC Digital Input Current
10
(per pin, applies to all
digital pins)
5
I
MAXD
2
2
mA
25
Maximum DC Analog Input Current
11
(per pin, applies to all
analog pins)
I
MAXA
3
3
mA
26
Maximum Operating Temperature Range
12
-- Die Junction
Temperature
T
J
40.0
150.0
o
C
Electrical Characteristics
MPC5566 Microcontroller Data Sheet, Rev. 0
Preliminary--Subject to Change Without Notice
Freescale Semiconductor
5
3.2
Thermal Characteristics
27
Storage Temperature Range
T
STG
55.0
150.0
o
C
28
Maximum Solder Temperature
13
T
SDR
--
260.0
o
C
29
Moisture Sensitivity Level
14
MSL
--
3
1
Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond the listed maxima may affect device reliability or
cause permanent damage to the device.
2
Absolute maximum voltages are currently maximum burn-in voltages. Absolute maximum specifications for device stress have
not yet been determined.
3
1.5V +/ 10% for proper operation. This parameter is specified at a maximum junction temperature of 150C.
4
All functional non-supply I/O pins are clamped to VSS and VDDE or VDDEH.
5
AC signal over and undershoot of the input voltages of up to +/ 2.0 volts is permitted for a cumulative duration of 60 hours
over the complete lifetime of the device (injection current does not need to be limited for this duration).
6
Internal structures will hold the voltage above 1.0 volt if the injection current limit of 1 mA is met.
7
Internal structures will not clamp to a safe voltage. External protection must be used to ensure that voltage on the pin stays
above 0.3 volts.
8
Internal structures hold the input voltage below this maximum voltage on all pads powered by VDDEH supplies, if the maximum
injection current specification is met (1 mA for all pins) and VDDEH is within Operating Voltage specifications.
9
Internal structures hold the input voltage below this maximum voltage on all pads powered by VDDE supplies, if the maximum
injection current specification is met (1 mA for all pins) and VDDE is within Operating Voltage specifications.
10
Total injection current for all pins (including both digital and analog) must not exceed 25mA.
11
Total injection current for all analog input pins must not exceed 15mA.
12
Lifetime operation at these specification limits is not guaranteed.
13
Solder profile per CDF-AEC-Q100.
14
Moisture sensitivity per JEDEC test method A112.
Table 3. Thermal Characteristics
Num
Characteristic
Symbol
Unit
Value
416 PBGA
1
Junction to Ambient
1, 2
Natural Convection
(Single layer board)
R
JA
C/W
24
2
Junction to Ambient
1, 3
Natural Convection
(Four layer board 2s2p)
R
JA
C/W
16
3
Junction to Ambient
1,3
(@200 ft./min.,
Single layer board)
R
JMA
C/W
18
4
Junction to Ambient
1,3
(@200 ft./min.,
Four layer board 2s2p)
R
JMA
C/W
13
5
Junction to Board
4
(Four layer board 2s2p)
R
JB
C/W
8
Table 2. Absolute Maximum Ratings
1
(continued)
Num
Characteristic
Symbol
Min
Max
2
Unit
Document Outline
- MPC5566 Microcontroller Data Sheet
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