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Электронный компонент: SPB160N04S2L-03

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2003-05-22
Page 1
SPB160N04S2L-03
Opti
MOS
Power-Transistor
Product Summary
V
DS
40
V
R
DS(on)
max. SMD version
2.7
m
I
D
160
A
Feature
N-Channel
Enhancement mode
Logic Level
High Current Rating
Low On-Resistance R
DS(on)
175C operating temperature
Avalanche rated
dv/dt rated
P- TO263 -7-3
Marking
P2N04L03
Type
Package
Ordering Code
SPB160N04S2L-03 P- TO263 -7-3 Q67060-S6138
Maximum Ratings, at
T
j
= 25 C, unless otherwise specified
Parameter
Symbol
Value
Unit
Continuous drain current
1)
T
C
=25C
T
C
=100C
I
D
160
160
A
Pulsed drain current
T
C
=25C
I
D puls
640
Avalanche energy, single pulse
I
D
=80A,
V
DD
=25V,
R
GS
=25
E
AS
810
mJ
Repetitive avalanche energy, limited by T
jmax
2)
E
AR
30
Reverse diode dv/dt
I
S
=160A,
V
DS
=32V,
di/dt=200A/s, T
jmax
=175C
dv/dt
6
kV/s
Gate source voltage
V
GS
20
V
Power dissipation
T
C
=25C
P
tot
300
W
Operating and storage temperature
T
j ,
T
stg
-55... +175
C
IEC climatic category; DIN IEC 68-1
55/175/56
2003-05-22
Page 2
SPB160N04S2L-03
Thermal Characteristics
Parameter
Symbol
Values
Unit
min.
typ.
max.
Characteristics
Thermal resistance, junction - case
R
thJC
-
-
0.5
K/W
Thermal resistance, junction - ambient, leaded
R
thJA
-
-
62
SMD version, device on PCB:
@ min. footprint
@ 6 cm
2
cooling area
3)
R
thJA
-
-
-
-
62
40
Electrical Characteristics, at
T
j
= 25 C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
Static Characteristics
Drain-source breakdown voltage
V
GS
=0V, I
D
=1mA
V
(BR)DSS
40
-
-
V
Gate threshold voltage,
V
GS
=
V
DS
I
D
=250A
V
GS(th)
1.2
1.6
2
Zero gate voltage drain current
V
DS
=40V,
V
GS
=0V,
T
j
=25C
V
DS
=40V,
V
GS
=0V,
T
j
=125C
I
DSS
-
-
0.01
1
1
100
A
Gate-source leakage current
V
GS
=20V,
V
DS
=0V
I
GSS
-
1
100
nA
Drain-source on-state resistance
V
GS
=4.5V, I
D
=80A
R
DS(on)
-
2.7
3.7
m
Drain-source on-state resistance
V
GS
=10V, I
D
=80A
R
DS(on)
-
2.1
2.7
1Current limited by bondwire ; with an R
thJC
= 0.5K/W the chip is able to carry I
D
= 243A at 25C, for detailed
information see app.-note ANPS071E available at www.infineon.com/optimos
2Defined by design. Not subject to production test.
3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 m thick) copper area for drain
connection. PCB is vertical without blown air.
2003-05-22
Page 3
SPB160N04S2L-03
Electrical Characteristics
Parameter
Symbol
Conditions
Values
Unit
min.
typ.
max.
Dynamic Characteristics
Transconductance
g
fs
V
DS
2*I
D
*R
DS(on)max
,
I
D
=160A
115
230
-
S
Input capacitance
C
iss
V
GS
=0V,
V
DS
=25V,
f=1MHz
-
6000 8000 pF
Output capacitance
C
oss
-
1900 2530
Reverse transfer capacitance
C
rss
-
460
690
Turn-on delay time
t
d(on)
V
DD
=20V,
V
GS
=10V,
I
D
=160A,
R
G
=1.1
-
12
18
ns
Rise time
t
r
-
80
120
Turn-off delay time
t
d(off)
-
93
140
Fall time
t
f
-
72
110
Gate Charge Characteristics
Gate to source charge
Q
gs
V
DD
=32V, I
D
=160A
-
21
28
nC
Gate to drain charge
Q
gd
-
60
90
Gate charge total
Q
g
V
DD
=32V, I
D
=160A,
V
GS
=0 to 10V
-
170
230
Gate plateau voltage
V
(plateau) V
DD
=32V, I
D
=160A
-
3.7
-
V
Reverse Diode
Inverse diode continuous
forward current
I
S
T
C
=25C
-
-
160 A
Inv. diode direct current, pulsed
I
SM
-
-
640
Inverse diode forward voltage
V
SD
V
GS
=0V,
I
F
=80A
-
0.9
1.3
V
Reverse recovery time
t
rr
V
R
=20V,
I
F=
l
S
,
di
F
/dt=100A/s
-
62
78
ns
Reverse recovery charge
Q
rr
-
145
180 nC
2003-05-22
Page 4
SPB160N04S2L-03
1 Power dissipation
P
tot
= f (
T
C
)
parameter: V
GS
4 V
0
20
40
60
80 100 120 140 160
C
190
T
C
0
40
80
120
160
200
240
W
320
SPB160N04S2L-03
P
tot
2 Drain current
I
D
= f (
T
C
)
parameter: V
GS
10 V
0
20
40
60
80 100 120 140 160
C
190
T
C
0
20
40
60
80
100
120
140
A
170
SPB160N04S2L-03
I
D
4 Max. transient thermal impedance
Z
thJC
= f (t
p
)
parameter : D = t
p
/T
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
10
0
s
t
p
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
K/W
SPB160N04S2L-03
Z
thJC
single pulse
0.01
0.02
0.05
0.10
0.20
D = 0.50
3 Safe operating area
I
D
= f ( V
DS
)
parameter : D = 0 ,
T
C
= 25 C
10
-1
10
0
10
1
10
2
V
V
DS
0
10
1
10
2
10
3
10
A
SPB160N04S2L-03
I
D
R
DS(on)
=
V
DS
/
I
D
1 ms
100 s
10 s
tp = 7.2s
2003-05-22
Page 5
SPB160N04S2L-03
5 Typ. output characteristic
I
D
= f (
V
DS
);
T
j
=25C
parameter: t
p
= 80 s
0
0.5
1
1.5
2
2.5
3
3.5
4
V
5
V
DS
0
40
80
120
160
200
240
280
320
A
380
SPB160N04S2L-03
I
D
VGS [V]
a
a
2.8
b
b
3.0
c
c
3.2
d
d
3.4
e
e
3.6
f
f
3.8
g
g
4.0
h
h
4.5
i
P
tot
= 300W
i
10.0
6 Typ. drain-source on resistance
R
DS(on)
= f (I
D
)
parameter:
V
GS
0
40
80
120
160
200
240
A
300
I
D
0
1
2
3
4
5
6
7
8
10
SPB160N04S2L-03
R
DS(on)
V
GS
[V] =
d
d
3.4
e
e
3.6
f
f
3.8
g
g
4.0
h
h
4.5
i
i
10.0
7 Typ. transfer characteristics
I
D
= f ( V
GS
); V
DS
2 x I
D
x R
DS(on)max
parameter: t
p
= 80 s
0
0.5
1
1.5
2
2.5
3
V
4
V
GS
0
20
40
60
80
100
120
140
160
A
200
I
D
8 Typ. forward transconductance
g
fs
= f(I
D
);
T
j
=25C
parameter:
g
fs
0
20
40
60
80 100 120 140 160
A
200
I
D
0
20
40
60
80
100
120
140
160
180
200
220
S
260
g
fs