IRFZ48S/L
HEXFET
Power MOSFET
PD - 9.894A
l
Advanced Process Technology
l
Surface Mount (IRFZ48S)
l
Low-profile through-hole (IRFZ48L)
l
175C Operating Temperature
l
Fast Switching
V
DSS
= 60V
R
DS(on)
= 0.018
I
D
= 50A
2
D P a k
T O - 2 6 2
S
D
G
8/25/97
Parameter
Typ.
Max.
Units
R
JC
Junction-to-Case
0.80
R
JA
Junction-to-Ambient ( PCB Mounted,steady-state)**
40
Thermal Resistance
C/W
Parameter
Max.
Units
I
D
@ T
C
= 25C
Continuous Drain Current, V
GS
@ 10V
50
I
D
@ T
C
= 100C
Continuous Drain Current, V
GS
@ 10V
50
A
I
DM
Pulsed Drain Current
290
P
D
@T
A
= 25C
Power Dissipation
3.7
W
P
D
@T
C
= 25C
Power Dissipation
190
W
Linear Derating Factor
1.3
W/C
V
GS
Gate-to-Source Voltage
20
V
E
AS
Single Pulse Avalanche Energy
100
mJ
dv/dt
Peak Diode Recovery dv/dt
4.5
V/ns
T
J
Operating Junction and
-55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
C
Absolute Maximum Ratings
Description
Third Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The D
2
Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
2
Pak is suitable for high current applications because of
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRFZ48L) is available for low-
profile applications.
C
IRFZ48S/L
V
DD
= 25V
,
starting T
J
= 25C, L = 22H
R
G
= 25
, I
AS
= 72A. (See Figure 12)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Notes:
** When mounted on 1" square PCB (FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
I
SD
72A, di/dt
200A/s, V
DD
V
(BR)DSS
,
T
J
175C
Pulse width
300s; duty cycle
2%.
Uses IRFZ48 data and test conditions
Parameter
Min. Typ. Max. Units
Conditions
I
S
Continuous Source Current
MOSFET symbol
(Body Diode)
showing the
I
SM
Pulsed Source Current
integral reverse
(Body Diode)
p-n junction diode.
V
SD
Diode Forward Voltage
2.0
V
T
J
= 25C, I
S
= 72A, V
GS
= 0V
t
rr
Reverse Recovery Time
120
180
ns
T
J
= 25C, I
F
= 72A
Q
rr
Reverse Recovery Charge
500
800
nC
di/dt = 100A/s
t
on
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
A
Parameter
Min. Typ. Max. Units
Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage
60
V
V
GS
= 0V, I
D
= 250A
V
(BR)DSS
/
T
J
Breakdown Voltage Temp. Coefficient
0.06
V/C
Reference to 25C, I
D
=1mA
R
DS(on)
Static Drain-to-Source On-Resistance
0.018
V
GS
=10V, I
D
= 43A
V
GS(th)
Gate Threshold Voltage
2.0
4.0
V
V
DS
= V
GS
, I
D
= 250A
g
fs
Forward Transconductance
27
S
V
DS
= 25V, I
D
= 43A
25
A
V
DS
= 60V, V
GS
= 0V
250
V
DS
= 48V, V
GS
= 0V, T
J
= 150C
Gate-to-Source Forward Leakage
100
V
GS
= 20V
Gate-to-Source Reverse Leakage
-100
nA
V
GS
= -20V
Q
g
Total Gate Charge
110
I
D
= 72A
Q
gs
Gate-to-Source Charge
29
nC
V
DS
= 48V
Q
gd
Gate-to-Drain ("Miller") Charge
36
V
GS
= 10V, See Fig. 6 and 13
t
d(on)
Turn-On Delay Time
8.1
V
DD
= 30V
t
r
Rise Time
250
I
D
= 72A
t
d(off)
Turn-Off Delay Time
210
R
G
= 9.1
t
f
Fall Time
250
R
D
= 0.34
,
See Fig. 10
Between lead,
and center of die contact
C
iss
Input Capacitance
2400
V
GS
= 0V
C
oss
Output Capacitance
1300
pF
V
DS
= 25V
C
rss
Reverse Transfer Capacitance
190
= 1.0MHz, See Fig. 5
Electrical Characteristics @ T
J
= 25C (unless otherwise specified)
I
GSS
ns
I
DSS
Drain-to-Source Leakage Current
nH
7.5
L
S
Internal Source Inductance
50
290
Calculated continuous current based on maximum allowable
junction temperature; for recommended current-handling of the
package refer to Design Tip # 93-4
S
D
G
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