5
SILICON PR
O
TECTION
CIRCUITS
Silicon Protection Circuits
199
w w w . l i t t e l f u s e . c o m
TVS Avalanche Diode Array in a Unipolar Chip Scale Package
SP0504BAC, SP0508BAC, SP0516BAC
This family of avalanche diode arrays are designed for ESD protection
and offered in an ultra small chip scale package.
The multi-channel devices are used to help protect sensitive digital or
analog input circuits on data, signal, or control lines with unipolar voltage
levels up to 5VDC.
The state-of-the-art structure is designed to suppress ESD and other
transient over-voltage events to meet the International Electrotechnical
Compatability (EMC transient immunity stantards IEC 61000-4-2 for
Electrostatic Discharge Requirements).
The monolithic silicon devices are comprised of specially designed
structures for transient voltage suppression (TVS). The size and
shape of these structures has been tailored for transient protection.
The low capacitance and clamp voltage are ideal for high speed signal
line protection.
Ordering Information
NOTE: Bump pitch is 0.65mm
Schematic
Features
An Array of 4, 8 and 16 Avalanche Diodes in a ultra small Chip Scale
Package (.65mm bump pitch)
ESD Capability per HBM Standards
- IEC 61000-4-2, Direct Discharge...............................25kV (Level 4)
- IEC 61000-4-2, Air Discharge....................................30kV (Level 4)
- MIL STD 833D (Method 3015.7) ..............................................30kV
Signal line protection for applications up to 5VDC
Fast response time...........................................................................< 1ns
Low input capacitance ..........................................................39pF Typical
Low clamp voltage ..................................................................12V Typical
Low input leakage .....................................................................10uA Max
Operating temperature range ............................................- 40C to 85C
Applications
Cell phone handsets
Personal Digital Assistants (PDA)
Portable handheld equipment (Laptop, Palmtop computers)
Computer port, keyboard (USB1.1)
Set-Top Box (Audio and Video Ports)
PCMCIA cards
PART
NUMBER
SP0504BACT
SP0508BACT
SP0516BACT
QUANTITY
PER REEL
3500
3500
3500
CS PACKAGE
SIZE (MM)
1.804 x 1.154
3.104 x 1.154
3.104 x 2.454
DIODE
CHANNELS
4
8
16
BUMPS
6
10
20
B1
B2 B3
A1
A2 A3
D1 D2
D3
D4 D5
C1
C2 C3
C4
C5
B1 B2
B3
B4
B5
A1
A2 A3
A4
A5
R1 R2
R3 R4
R5
A1
A2 A3
A4
A5
SP0504BAC
SP0516BAC
SP0508BAC
NEW
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200
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SP0504BAC, SP0508BAC, SP0516BAC
Silicon Protection Circuits
TVS Avalanche Diode Array in a Unipolar Chip Scale Package
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperature Opening
Solder Flux Ratio
Solder Paste
Board Trace Finish
ELECTRICAL SPECIFICATIONS T
A
= 25C Unless Otherwise Specified
PARAMETER
Reverse Standoff Voltage
Reverse Standoff Leakage Current
Signal Clamp Voltage
Positive
Negative
Clamp Voltage during ESD
MIL-STD-883D Method 3015
ESD Test Level
IEC-61000-4-2, Contact discharge
MIL-STD-883D Method 3015 (HBM)
Capacitance
Turn on/off Time
Temperature Range
Operating
Storage
TEST CONDITIONS
I = 10A
V = 5.5V
I = 10mA
I = 10mA
8kV Positive
8kV Negative
2.5VDC @ 1Mhz
MIN
5.5
5.6
- 1.2
25
30
- 40
- 65
MAX
-
10
8.0
- 0.4
85
150
UNITS
V
A
V
V
V
V
kV
kV
pF
ns
C
C
TYPICAL
-
6.6
- 0.8
12
- 8
39
<1
0
48
97
Time (s)
145
194
242
290
339
387
435
EXH
CD
RF
Z
Z4
Z3
Z2
PH
EXH
250
225
200
175
150
125
100
75
50
25
T
e
mper
ature (
o
C)
0.300mm
Round
Non-Solder Mask
Defined Pads
(NSMD)
0.350mm
0.152mm
0.360mm (sq)
50/50
No Clean
OSP (Entek Cu
Plus 106A)
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Typical Solder Reflow Thermal Profile (No Clean Flux)
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