MAX811TEUS
Rev. A
RELIABILITY REPORT
FOR
MAX811TEUS
PLASTIC ENCAPSULATED DEVICES
September 10, 2002
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Bryan J. Preeshl
Quality Assurance
Quality Assurance
Reliability Lab Manager
Executive Director
Conclusion
The MAX811T successfully meets the quality and reliability standards required of all Maxim products. In
addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet
Maxim's quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
......Attachments
I. Device Description
A. General
The MAX811T is a low-power microprocessor (P) supervisory circuit used to monitor power supplies in P and
digital systems. It provides excellent circuit reliability and low cost by eliminating external components and
adjustments when used with 5V- powered or 3V-powered circuits. The MAX811T also provides a debounced manual
reset input.
This device performs a single function: It asserts a reset signal whenever the V
CC
supply voltage falls below a preset
threshold, keeping it asserted for at least 140ms after V
CC
has risen above the reset threshold. The MAX811 has an
active-low RESET output (which is guaranteed to be in the correct state for V
CC
down to 1V. The reset comparator is
designed to ignore fast transients on V
CC
. Reset thresholds for this device is 3.08V.
Low supply current makes the MAX811T ideal for use in portable equipment. This device comes in a 4-pin SOT143
package.
B. Absolute Maximum Ratings
Item
Rating
Terminal Voltage (with respect to GND)
VCC
-0.3V to 6.0V
All Other Inputs
-0.3V to (VCC + 0.3V)
Input Current, VCC, MR
20mA
Output Current, RESET or RESET
20mA
Operating Temperature Range
-40C to +85C
Storage Temperature Range
-65C to +160C
Lead Temperature (soldering, 10sec)
+300C
Continuous Power Dissipation (TA = +70C)
4-Lead SOT143
320mW
Derates above +70
C
4-Lead SOT143
4mW/
C
II. Manufacturing Information
A. Description/Function:
4-Pin P Voltage Monitors with Manual Reset Input
B. Process:
S12 (SG1.2) - Standard 1.2 micron silicon gate CMOS
C. Fabrication Location:
Oregon, USA
D. Transistor Count:
341
D. Assembly Location:
Malaysia or Thailand
E. Date of Initial Production:
January, 1997
III. Packaging Information
A. Package Type:
4-Lead SOT143
B. Lead Frame:
Copper
C. Lead Finish:
Solder Plate
D. Die Attach:
Silver-filled Epoxy
E. Bondwire:
Gold (1.0 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
Buildsheet # 05-1701-0263
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard JESD22-A112:
Level 1
IV. Die Information
A. Dimensions:
37 x 31 mils
B. Passivation:
Si
3
N
4
/SiO
2
(Silicon nitride/ Silicon dioxide)
C. Interconnect:
Aluminum/Copper/Si
D. Backside Metallization:
None
E. Minimum Metal Width:
1.2 microns (as drawn)
F. Minimum Metal Spacing:
1.2 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO
2
I. Die Separation Method:
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts: Jim Pedicord
(Reliability Lab Manager)
Bryan Preeshl (Executive Director of QA)
Kenneth Huening (Vice President)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135
C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate (
) is calculated as follows:
= 1 = 1.83 (Chi square value for MTTF upper limit)
MTTF
192 x 4389 x 240 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
= 4.52 x 10
-9
= 4.52 F.I.T. (60% confidence level @ 25
C)
This low failure rate represents data collected from Maxim's reliability qualification and monitor programs.
Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The
reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates
to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The
Burn-In Schematic (Spec. # 06-4556) shows the static circuit used for this test. Maxim also performs 1000 hour
life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M).
B. Moisture Resistance Tests
Maxim evaluates pressure pot stress from every assembly process during qualification of each new design.
Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85
C/85%RH or
HAST tests are performed quarterly per device/package family.
C. E.S.D. and Latch-Up Testing
The PW67-2 die type has been found to have all pins able to withstand a transient pulse of
2500V, per
Mil-Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of
250mA and/or
20V.
Table 1
Reliability Evaluation Test Results
MAX811TEUS
TEST ITEM
TEST CONDITION
FAILURE
SAMPLE
NUMBER OF
IDENTIFICATION
SIZE
FAILURES
Static Life Test (Note 1)
Ta = 135
C
DC Parameters
240
0
Biased
& functionality
Time = 192 hrs.
Moisture Testing
Pressure Pot
Ta = 121
C
DC Parameters
77
0
P = 15 psi.
& functionality
RH= 100%
Time = 168hrs.
85/85
Ta = 85
C
DC Parameters
77
0
RH = 85%
& functionality
Biased
Time = 1000hrs.
Mechanical Stress
Temperature
-65
C/150
C
DC Parameters
77
0
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic D.I.P. qualification lots for the package.
Note 2: Generic Package/Process Data
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