ChipFind - документация

Электронный компонент: MC74HCT04A

Скачать:  PDF   ZIP
www.docs.chipfind.ru
background image
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
1
REV 6
Motorola, Inc. 1995
10/95
Hex Inverter
With LSTTLCompatible Inputs
HighPerformance SiliconGate CMOS
The MC74HCT04A may be used as a level converter for interfacing
TTL or NMOS outputs to HighSpeed CMOS inputs.
The HCT04A is identical in pinout to the LS04.
Output Drive Capability: 10 LSTTL Loads
TTL/NMOSCompatible Input Levels
Outputs Directly Interface to CMOS, NMOS and TTL
Operating Voltage Range: 4.5 to 5.5V
Low Input Current: 1
A
In Compliance With the JEDEC Standard No. 7A Requirements
Chip Complexity: 48 FETs or 12 Equivalent Gates
LOGIC DIAGRAM
Y1
A1
A2
A3
A4
A5
A6
Y2
Y3
Y4
Y5
Y6
1
3
5
9
11
13
2
4
6
8
10
12
Y = A
Pin 14 = VCC
Pin 7 = GND
Pinout: 14Lead Packages (Top View)
13
14
12
11
10
9
8
2
1
3
4
5
6
7
VCC
A6
Y6
A5
Y5
A4
Y4
A1
Y1
A2
Y2
A3
Y3
GND
L
H
MC74HCT04A
FUNCTION TABLE
Inputs
Outputs
A
H
L
Y
D SUFFIX
SOIC PACKAGE
CASE 751A03
N SUFFIX
PLASTIC PACKAGE
CASE 64606
ORDERING INFORMATION
MC74HCTXXAN
MC74HCTXXAD
MC74HCTXXADT
Plastic
SOIC
TSSOP
1
14
1
14
1
14
DT SUFFIX
TSSOP PACKAGE
CASE 948G01
background image
MC74HCT04A
MOTOROLA
HighSpeed CMOS Logic Data
DL129 -- Rev 6
2
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
0.5 to VCC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
0.5 to VCC + 0.5
V
Iin
DC Input Current, per Pin
20
mA
Iout
DC Output Current, per Pin
25
mA
ICC
DC Supply Current, VCC and GND Pins
50
mA
PD
Power Dissipation in Still Air
Plastic DIP
SOIC Package
TSSOP Package
750
500
450
mW
Tstg
Storage Temperature Range
65 to + 150
_
C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP, SOIC or TSSOP Package
260
_
C
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
Derating -- Plastic DIP: 10 mW/
_
C from 65
_
to 125
_
C
SOIC Package: 7 mW/
_
C from 65
_
to 125
_
C
TSSOP Package: 6.1 mW/
_
C from 65
_
to 125
_
C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
4.5
5.5
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to GND)
0
VCC
V
TA
Operating Temperature Range, All Package Types
55
+ 125
_
C
tr, tf
Input Rise/Fall Time (Figure 1)
0
500
ns
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this highimpedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND
v
(Vin or Vout)
v
VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
background image
MC74HCT04A
HighSpeed CMOS Logic Data
DL129 -- Rev 6
3
MOTOROLA
DC CHARACTERISTICS
(Voltages Referenced to GND)
VCC
V
Guaranteed Limit
Symbol
Parameter
Condition
VCC
V
55 to 25
C
85
C
125
C
Unit
VIH
Minimum HighLevel Input Voltage
Vout = 0.1V
|Iout|
20
A
4.5
5.5
2.0
2.0
2.0
2.0
2.0
2.0
V
VIL
Maximum LowLevel Input Voltage
Vout = VCC 0.1V
|Iout|
20
A
4.5
5.5
0.8
0.8
0.8
0.8
0.8
0.8
V
VOH
Minimum HighLevel Output
Voltage
Vin = VIL
|Iout|
20
A
4.5
5.5
4.4
5.4
4.4
5.4
4.4
5.4
V
Vin = VIL
|Iout|
4.0mA
4.5
3.98
3.84
3.70
VOL
Maximum LowLevel Output
Voltage
Vin = VIH
|Iout|
20
A
4.5
5.5
0.1
0.1
0.1
0.1
0.1
0.1
V
Vin = VIH
|Iout|
4.0mA
4.5
0.26
0.33
0.40
Iin
Maximum Input Leakage Current
Vin = VCC or GND
5.5
0.1
1.0
1.0
A
ICC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Iout = 0
A
5.5
1
10
40
A
ICC
Additional Quiescent Supply
Current
Vin = 2.4V, Any One Input
Vin = VCC or GND, Other Inputs
Iout = 0
A
5.5
55
C
25 to 125
C
Current
Vin = VCC or GND, Other Inputs
Iout = 0
A
5.5
2.9
2.4
mA
1. Information on typical parametric values can be found in Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).
2. Total Supply Current = ICC +
ICC.
AC CHARACTERISTICS
(VCC = 5.0V
10%, CL = 50pF, Input tr = tf = 6ns)
Guaranteed Limit
Symbol
Parameter
55 to 25
C
85
C
125
C
Unit
tPLH,
tPHL
Maximum Propagation Delay, Input A to Output Y
(Figures 1 and 2)
15
17
19
21
22
26
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 2)
15
19
22
ns
Cin
Maximum Input Capacitance
10
10
10
pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High
Speed CMOS Data Book (DL129/D).
CPD
Power Dissipation Capacitance (Per Inverter)*
Typical @ 25
C, VCC = 5.0 V
pF
CPD
Power Dissipation Capacitance (Per Inverter)*
22
pF
* Used to determine the noload dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the
Motorola HighSpeed CMOS Data Book (DL129/D).
background image
MC74HCT04A
MOTOROLA
HighSpeed CMOS Logic Data
DL129 -- Rev 6
4
Figure 1. Switching Waveforms
GND
3.0V
OUTPUT Y
INPUT A
CL*
*Includes all probe and jig capacitance
TEST
POINT
90%
1.3V
10%
tTLH
DEVICE
UNDER
TEST
OUTPUT
Figure 2. Test Circuit
Y
A
Figure 3. Expanded Logic Diagram
(1/6 of the Device Shown)
tTHL
2.7V
1.3V
0.3V
tPLH
tPHL
tf
tr
background image
MC74HCT04A
HighSpeed CMOS Logic Data
DL129 -- Rev 6
5
MOTOROLA
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC DIP PACKAGE
CASE 64606
ISSUE L
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
1
7
14
8
B
A
F
H
G
D
K
C
N
L
J
M
SEATING
PLANE
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.715
0.770
18.16
19.56
B
0.240
0.260
6.10
6.60
C
0.145
0.185
3.69
4.69
D
0.015
0.021
0.38
0.53
F
0.040
0.070
1.02
1.78
G
0.100 BSC
2.54 BSC
H
0.052
0.095
1.32
2.41
J
0.008
0.015
0.20
0.38
K
0.115
0.135
2.92
3.43
L
0.300 BSC
7.62 BSC
M
0
10
0
10
N
0.015
0.039
0.39
1.01
_
_
_
_
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A03
ISSUE F
MIN
MIN
MAX
MAX
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
8.55
3.80
1.35
0.35
0.40
0.19
0.10
0
5.80
0.25
8.75
4.00
1.75
0.49
1.25
0.25
0.25
7
6.20
0.50
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0
0.228
0.010
0.344
0.157
0.068
0.019
0.049
0.009
0.009
7
0.244
0.019
1.27 BSC
0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
A
B
P
7 PL
G
C
K
SEATING
PLANE
D
14 PL
M
J
R
X 45
1
7
8
14
0.25 (0.010)
T
B
A
M
S
S
B
0.25 (0.010)
M
M
F
background image
MC74HCT04A
MOTOROLA
HighSpeed CMOS Logic Data
DL129 -- Rev 6
6
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G01
ISSUE O
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
4.90
5.10
0.193
0.200
B
4.30
4.50
0.169
0.177
C
1.20
0.047
D
0.05
0.15
0.002
0.006
F
0.50
0.75
0.020
0.030
G
0.65 BSC
0.026 BSC
H
0.50
0.60
0.020
0.024
J
0.09
0.20
0.004
0.008
J1
0.09
0.16
0.004
0.006
K
0.19
0.30
0.007
0.012
K1
0.19
0.25
0.007
0.010
L
6.40 BSC
0.252 BSC
M
0
8
0
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE W.
_
_
_
_
S
U
0.15 (0.006) T
2X
L/2
S
U
M
0.10 (0.004)
V
S
T
L
U
SEATING
PLANE
0.10 (0.004)
T
SECTION NN
DETAIL E
J J1
K
K1
DETAIL E
F
M
W
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U
0.15 (0.006) T
V
14X REF
K
N
N
How to reach us:
USA/EUROPE: Motorola Literature Distribution;
JAPAN: Nippon Motorola Ltd.; TatsumiSPDJLDC, Toshikatsu Otsuki,
P.O. Box 20912; Phoenix, Arizona 85036. 18004412447
6F SeibuButsuryuCenter, 3142 Tatsumi KotoKu, Tokyo 135, Japan. 0335218315
MFAX: RMFAX0@email.sps.mot.com TOUCHTONE (602) 2446609
HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
INTERNET: http://DesignNET.com
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 85226629298
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different
applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does
not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in
systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of
the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such
unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
MC74HCT04A/D
*MC74HCT04A/D*
CODELINE