ChipFind - документация

Электронный компонент: BAS40LT1

Скачать:  PDF   ZIP
Semiconductor Components Industries, LLC, 2006
March, 2006 - Rev. 6
1
Publication Order Number:
BAS40LT1/D
BAS40LT1
Preferred Device
Schottky Barrier Diodes
These Schottky barrier diodes are designed for high speed switching
applications, circuit protection, and voltage clamping. Extremely low
forward voltage reduces conduction loss. Miniature surface mount
package is excellent for hand held and portable applications where
space is limited.
Features
Pb-Free Package is Available
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Reverse Voltage
V
R
40
V
Forward Power Dissipation
@ T
A
= 25
C
Derate above 25
C
P
F
225
1.8
mW
mW/
C
Operating Junction and Storage
Temperature Range
T
J,
T
stg
- 55 to +150
C
Forward Continuous Current
I
F
120
mA
Forward Surge Current
t
v
1 s
t
v
10 ms
I
FSM
200
600
mA
Thermal Resistance
Junction-to-Ambient
R
q
JA
508
(Note 1)
311
(Note 2)
C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR-4 @ minimum pad.
2. FR-4 @ 1.0 x 1.0 in pad.
http://onsemi.com
Preferred devices are recommended choices for future use
and best overall value.
Device
Package
Shipping
ORDERING INFORMATION
BAS40LT1
SOT-23
3000/Tape & Reel
SOT-23 (TO-236AB)
CASE 318
STYLE 8
40 VOLTS
SCHOTTKY BARRIER DIODES
MARKING DIAGRAM
1
2
3
3
CATHODE
1
ANODE
B1 M
G
G
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
BAS40LT1G
SOT-23
(Pb-Free)
3000/Tape & Reel
B1 = Specific Device Code
M
= Date Code*
G
= Pb-Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may vary
depending upon manufacturing location.
BAS40LT1
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS
(T
A
= 25
C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
Reverse Breakdown Voltage
(I
R
= 10
m
A)
V
(BR)R
40
-
V
Total Capacitance
(V
R
= 1.0 V, f = 1.0 MHz)
C
T
-
5.0
pF
Reverse Leakage
(V
R
= 25 V)
I
R
-
1.0
m
Adc
Forward Voltage
(I
F
= 1.0 mAdc)
V
F
-
380
mVdc
Forward Voltage
(I
F
= 10 mAdc)
V
F
-
500
mVdc
Forward Voltage
(I
F
= 40 mAdc)
V
F
-
1.0
Vdc
100
0
0.1
V
F
, FORWARD VOLTAGE (VOLTS)
0.2
0.3
0.4
0.5
10
1.0
0.1
85C
10
0
V
R
, REVERSE VOLTAGE (VOLTS)
1.0
0.1
0.01
0.001
5.0
10
15
20
25
3.5
0
V
R
, REVERSE VOLTAGE (VOLTS)
3.0
1.0
0.5
0
C T
, CAP
ACIT
ANCE (pF)
5.0
10
15
40
I F
, FOR
W
ARD CURRENT
(mA)
Figure 1. Typical Forward Voltage
Figure 2. Reverse Current versus Reverse
Voltage
Figure 3. Typical Capacitance
-40C
25C
T
A
= 150C
25C
I R
, REVERSE CURRENT
(

A)
0.8
-55C
125C
150C
100
25
20
1.5
2.0
2.5
0.6
0.7
125C
85C
30
35
BAS40LT1
http://onsemi.com
3
PACKAGE DIMENSIONS
SOT-23 (TO-236)
CASE 318-08
ISSUE AN
D
A1
3
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318-01 THRU -07 AND -09 OBSOLETE, NEW
STANDARD 318-08.
mm
inches
SCALE 10:1
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
SOLDERING FOOTPRINT*
VIEW C
L
0.25
L1
q
e
E
E
b
A
SEE VIEW C
DIM
A
MIN
NOM
MAX
MIN
MILLIMETERS
0.89
1.00
1.11
0.035
INCHES
A1
0.01
0.06
0.10
0.001
b
0.37
0.44
0.50
0.015
c
0.09
0.13
0.18
0.003
D
2.80
2.90
3.04
0.110
E
1.20
1.30
1.40
0.047
e
1.78
1.90
2.04
0.070
L
0.10
0.20
0.30
0.004
0.040
0.044
0.002
0.004
0.018
0.020
0.005
0.007
0.114
0.120
0.051
0.055
0.075
0.081
0.008
0.012
NOM
MAX
L1
H
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
2.10
2.40
2.64
0.083
0.094
0.104
H
E
0.35
0.54
0.69
0.014
0.021
0.029
c
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
"Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800-282-9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051
Phone: 81-3-5773-3850
BAS40LT1/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082-1312 USA
Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada
Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.