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Электронный компонент: PCA9500

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Philips
Semiconductors
PCA9500
8-bit I
2
C and SMBus I/O port with
2-kbit EEPROM
Product data sheet
Supersedes data of 27 Jun 2003
2004 Sep 30
INTEGRATED CIRCUITS
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2
2004 Sep 30
FEATURES
8 general purpose input/output expander/collector
Drop in replacement for PCF8574 with integrated 2-kbit EEPROM
Internal 256
8 EEPROM
Self timed write cycle
4 byte page write operation
I
2
C and SMBus interface logic
Internal power-on reset
Noise filter on SCL/SDA inputs
3 address pins allowing up to 8 devices on the I
2
C/SMBus
No glitch on power-up
Supports hot insertion
Power-up with all channels configured as inputs
Low standby current
Operating power supply voltage range of 2.5 V to 3.6 V
5 V tolerant inputs/outputs
0 kHz to 400 kHz clock frequency
ESD protection exceeds 2000 V HBM per JESD22-A114,
200 V MM per JESD22-A115 and 1000 V CDM per JESD22-C101
Latch-up testing is done to JESDEC Standard JESD78 which
exceeds 100 mA
Package offerred: SO16, TSSOP16, HVQFN16
DESCRIPTION
The PCA9500 is an 8-bit I/O expander with an on-board 2-kbit
EEPROM.
The I/O expander's eight quasi bidirectional data pins can be
independently assigned as inputs or outputs to monitor board level
status or activate indicator devices such as LEDs. The system
master writes to the I/O configuation bits in the same way as for the
PCF8574. The data for each Input or Output is kept in the
corresponding Input or Output register. The system master can read
all registers.
The EEPROM can be used to store error codes or board
manufacturing data for read-back by application software for
diagnostic purposes and is included in the I/O expander package.
The PCA9500 has three address pins with internal pull-up resistors
allowing up to 8 devices to share the common two-wire I
2
C software
protocol serial data bus. The fixed GPIO I
2
C address is the same as
the PCF8574 and the fixed EEPROM I
2
C address is the same as
the PCF8582C-2, so the PCA9500 appears as two separate devices
to the bus master.
The PCA9500 supports hot insertion to facilitate usage in removable
cards on backplane systems.
The PCA9501 is an alternative to the functionally similar PCA9500
for systems where a higher number of devices are required to share
the same I
2
C-bus or an interrupt output is required.
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
ORDER CODE
TOPSIDE MARK
DRAWING NUMBER
16-Pin Plastic SO (wide)
40
C to +85
C
PCA9500D
PCA9500D
SOT162-1
16-Pin Plastic TSSOP
40
C to +85
C
PCA9500PW
PCA9500
SOT403-1
16-Pin Plastic HVQFN
40
C to +85
C
PCA9500BS
9500
SOT629-1
Standard packing quantities and other packaging data are available at www.standardproducts.philips.com/packaging.
SMBus as specified by the Smart Battery System Implementers Forum is a derivative of the Philips I
2
C patent.
I
2
C is a trademark of Philips Semiconductors Corporation.
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
3
PIN CONFIGURATION SO, TSSOP
1
2
3
4
5
6
7
8
SW00902
9
10
11
12
13
14
15
16
A0
A1
A2
I/O0
I/O1
I/O2
I/O3
V
SS
V
DD
SDA
SCL
WC
I/O7
I/O6
I/O5
I/O4
PCA9500
Figure 1. Pin configuration SO, TSSOP
PIN CONFIGURATION HVQFN
12
11
10
9
5
6
7
8
1
2
3
4
16
15
14
13
SW02004
TOP VIEW
A2
I/O0
I/O1
I/O2
I/O3
I/O4
V
SS
I/O5
WC
I/O6
I/O7
SDA
V
DD
A0
A1
SCL
Figure 2. Pin configuration HVQFN
PIN DESCRIPTION
SO, TSSOP
PIN NUMBER
HVQFN
PIN NUMBER
SYMBOL
NAME AND FUNCTION
1,2,3
15, 16, 1
A02
Address lines (internal pull-up)
4,5,6,7
2, 3, 4, 5
I/O0 to I/O3
Quasi-bidirectional I/O pins
8
6
V
SS
Supply ground
9,10,11,12
7, 8, 9, 10
I/O4 to I/O7
Quasi-bidirectional I/O pins
13
11
WC
Active LOW write control pin
14
12
SCL
I
2
C Serial Clock
15
13
SDA
I
2
C Serial Data
16
14
V
DD
Supply Voltage
BLOCK DIAGRAM
POWER-ON
RESET
INPUT
FILTER
I
2
C/SMBus
CONTROL
INPUT/
OUTPUT
PORTS
WRITE pulse
READ pulse
A0
A1
A2
SCL
SDA
V
DD
V
SS
8-BIT
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
SW01074
PCA9500
WC
EEPROM
256 x 8
300 k
Figure 3. Block diagram
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
4
FUNCTIONAL DESCRIPTION
SW00546
WRITE PULSE
DATA FROM
SHIFT REGISTER
POWER-ON
RESET
READ PULSE
DATA TO
SHIFT REGISTER
V
DD
I/O0 TO I/O7
V
SS
100
A
C
I
S
D
Q
FF
C
I
S
D
Q
FF
Figure 4. Simplified schematic diagram of each I/O
DEVICE ADDRESSING
Following a START condition the bus master must output the address of the slave it is accessing. The address of the PCA9500 is shown in
Figure 5. Internal pullup resistors are incorporated on the hardware selectable address pins.
R/W
0
1
0
0
A2
A1
A0
0
1
1
0
A2
A1
A0
a.
b.
(a) I/O EXPANDER
(b) MEMORY
SW01075
SLAVE ADDRESS
SLAVE ADDRESS
FIXED
HARDWARE
PROGRAMMABLE
R/W
FIXED
HARDWARE
PROGRAMMABLE
Figure 5. PCA9500 slave addresses
The last bit of the address byte defines the operation to be performed. When set to logic 1 a read is selected while a logic 0 selects a write
operation.
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
5
CONTROL REGISTER
The PCA9500 contains a single 8-bit register called the Control Register, which can be written and read via the I
2
C-bus. This register is sent
after a successful acknowledgment of the slave address.
It contains the I/O operation information.
I/O OPERATIONS (see also Figure 4)
Each of the PCA9500's eight I/Os can be independently used as an input or output. Output data is transmitted to the port by the I/O WRITE
mode (see Figure 6). Input I/O data is transferred from the port to the microcontroller by the READ mode (See Figure 7).
S
0
1
0
0
A2
A1
A0
0
A
DATA 1
A
DATA 2
A
SDA
SCL
t pv
1
2
3
4
5
6
7
8
t pv
DATA 2 VALID
DATA 1 VALID
SW00548
ACKNOWLEDGE
FROM SLAVE
R/W
START CONDITION
ACKNOWLEDGE
FROM SLAVE
ACKNOWLEDGE
FROM SLAVE
SLAVE ADDRESS (I/O EXPANDER)
DATA TO PORT
DATA TO PORT
WRITE TO
PORT
DATA OUT
FROM PORT
Figure 6. I/O WRITE mode (output)
S
0
1
0
0
A2
A1
A0
1
A
DATA 1
A
DATA 4
1
SDA
t ph
t ps
DATA 4
P
DATA 2
DATA 3
SW00549
SLAVE ADDRESS (I/O EXPANDER)
DATA FROM PORT
DATA FROM PORT
READ FROM
PORT
DATA INTO
PORT
START CONDITION
ACKNOWLEDGE
FROM SLAVE
R/W
ACKNOWLEDGE
FROM MASTER
STOP
CONDITION
DATA 1
Figure 7. I/O READ mode (input)
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
6
Quasi-bidirectional I/Os (see Figure 8)
A quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data direction. At power-on the I/Os are HIGH.
In this mode, only a current source to V
DD
is active. An additional strong pull-up to V
DD
allows fast rising edges into heavily loaded outputs.
These devices turn on when an output is written HIGH, and are switched off by the negative edge of SCL. The I/Os should be HIGH before
being used as inputs.
S
0
1
0
0
A2
A1
A0
0
A
A
A
SDA
SCL
1
2
3
4
5
6
7
8
SW00905
ACKNOWLEDGE
FROM SLAVE
R/W
START CONDITION
ACKNOWLEDGE
FROM SLAVE
SLAVE ADDRESS (I/O EXPANDER)
DATA TO PORT
DATA TO PORT
1
I/O3
0
I/O3
P
I/O3
OUTPUT
VOLTAGE
I/O3
PULL-UP
OUTPUT
CURRENT
I
OHt
I
OH
Figure 8. Transient pull-up current I
OHt
while I/O3 changes from LOW-to-HIGH and back to LOW
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
7
MEMORY OPERATIONS
Write operations
Write operations require an additional address field to indicate the
memory address location to be written. The address field is eight
bits long, providing access to any one of the 256 words of memory.
There are two types of write operations, byte write and page write.
Write operation is possible when WC control pin put at a low logic
level (0). When this control signal is set at 1, write operation is not
possible and data in the memory is protected.
Byte Write and Page Write explained below assume that Write
Control pin (WC) is set to 0.
Byte Write (see Figure 9)
To perform a byte write the start condition is followed by the memory
slave address and the R/W bit set to 0. The PCA9500 will respond
with an acknowledge and then consider the next eight bits sent as
the word address and the eight bits after the word address as the
data. The PCA9500 will issue an acknowledge after the receipt of
both the word address and the data. To terminate the data transfer
the master issues the stop condition, initiating the internal write cycle
to the non-volatile memory. Only write and read operations to the
Quasi-bidirectional I/O are allowed during the internal write cycle.
Page Write (see Figure 10)
A page write is initiated in the same way as the byte write. If after
sending the first word of data, the stop condition is not received the
PCA9500 considers subsequent words as data. After each data
word the PCA9500 responds with an acknowledge and the two least
significant bits of the memory address field are incremented. Should
the master not send a stop condition after four data words the
address counter will return to its initial value and overwrite the data
previously written. After the receipt of the stop condition the inputs
will behave as with the byte write during the internal write cycle.
SW02036
STOP CONDITION.
WRITE TO THE
MEMORY IS
PERFORMED
ACKNOWLEDGE
FROM SLAVE
S
1
0
1
0
A2
A1
A0
0
A
A
A
SDA
ACKNOWLEDGE
FROM SLAVE
R/W
START CONDITION
ACKNOWLEDGE
FROM SLAVE
SLAVE ADDRESS (MEMORY)
WORD ADDRESS
DATA
P
DATA
Figure 9. Byte write
SW02037
ACKNOWLEDGE
FROM SLAVE
S
1
0
1
0
A2 A1 A0
0
A
A
A
SDA
ACKNOWLEDGE
FROM SLAVE
R/W
START CONDITION
ACKNOWLEDGE
FROM SLAVE
SLAVE ADDRESS (MEMORY)
WORD ADDRESS
DATA TO MEMORY
DATA n
A
P
DATA n + 3
STOP CONDITION.
WRITE TO THE MEMORY
IS PERFORMED
DATA TO MEMORY
Figure 10. Page Write
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
8
Read operations
PCA9500 read operations are initiated in an identical manner to
write operations with the exception that the memory slave address'
R/W bit is set to a one. There are three types of read operations;
current address, random and sequential.
Current Address Read (see Figure 11)
The PCA9500 contains an internal address counter that increments
after each read or write access, as a result if the last word accessed
was at address n then the address counter contains the address
n+1.
When the PCA9500 receives its memory slave address with the
R/W bit set to one it issues an acknowledge and uses the next eight
clocks to transmit the data contained at the address stored in the
address counter. The master ceases the transmission by issuing the
stop condition after the eighth bit. There is no ninth clock cycle for
the acknowledge.
Random Read (see Figure 12)
The PCA9500's random read mode allows the address to be read
from to be specified by the master. This is done by performing a
dummy write to set the address counter to the location to be read.
The master must perform a byte write to the address location to be
read, but instead of transmitting the data after receiving the
acknowledge from the PCA9500 the master reissues the start
condition and memory slave address with the R/W bit set to one.
The PCA9500 will then transmit an acknowledge and use the next
eight clock cycles to transmit the data contained in the addressed
location. The master ceases the transmission by issuing the stop
condition after the eighth bit, omitting the ninth clock cycle
acknowledge.
Sequential Read (see Figure 13)
The PCA9500 sequential read is an extension of either the current
address read or random read. If the master doesn't issue a stop
condition after it has received the eighth data bit, but instead issues
an acknowledge, the PCA9500 will increment the address counter
and use the next eight cycles to transmit the data from that location.
The master can continue this process to read the contents of the
entire memory. Upon reaching address 255 the counter will return to
address 0 and continue transmitting data until a stop condition is
received. The master ceases the transmission by issuing the stop
condition after the eighth bit, omitting the ninth clock cycle
acknowledge.
SW00556
S
1
0
1
0
A2
A1
A0
1
A
P
SDA
ACKNOWLEDGE
FROM SLAVE
R/W
START CONDITION
STOP
CONDITION
SLAVE ADDRESS (MEMORY)
DATA FROM MEMORY
Figure 11. Current Address Read
S
P
SDA
SW00557
1
0
1
0
A2 A1 A0
A
A
0
START
CONDITION
R/W
ACKNOWLEDGE
FROM SLAVE
ACKNOWLEDGE
FROM SLAVE
A
ACKNOWLEDGE
FROM SLAVE
DATA FROM MEMORY
STOP
CONDITION
S
START
CONDITION
1
0
1
0
A2 A1 A0
1
R/W
SLAVE ADDRESS (MEMORY)
WORD ADDRESS
SLAVE ADDRESS (MEMORY)
Figure 12. Random Read
S
P
SDA
SW00558
SLAVE ADDRESS (MEMORY)
DATA FROM MEMORY
DATA FROM MEMORY
1
0
1
0
A2 A1 A0
A
A
1
START CONDITION
R/W
ACKNOWLEDGE
FROM SLAVE
ACKNOWLEDGE
FROM MASTER
DATA n
A
ACKNOWLEDGE
FROM MASTER
DATA n+X
STOP
CONDITION
DATA n+1
DATA FROM MEMORY
Figure 13. Sequential Read
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
9
CHARACTERISTICS OF THE I
2
C-BUS
The I
2
C-bus is for 2-way, 2-line communication between different ICs
or modules. The two lines are a serial data line (SDA) and a serial
clock line (SCL). Both lines must be connected to a positive supply
via a pull-up resistor when connected to the output stages of a device.
Data transfer may be initiated only when the bus is not busy.
Bit transfer
One data bit is transferred during each clock phase. The data on the
SDA line must remain stable during the HIGH period of the clock
pulse as changes in the data line at this time will be interpreted as
control signals (See Figure 14).
Start and Stop conditions
Both data and clock lines remain HIGH when the bus is not busy. A
HIGH-to-LOW transition of the data line, while the clock is HIGH is
defined as the Start condition (S). A LOW-to-HIGH transition of the
data line while the clock is HIGH is defined as the Stop condition (P)
(see Figure 15).
System configuration
A device generating a message is a "transmitter", a device receiving
is the "receiver". The device that controls the message is the
"master" and the devices which are controlled by the master are the
"slaves" (see Figure 16).
SDA
SCL
SW00542
DATA LINE
STABLE;
DATA VALID
CHANGE
OF DATA
ALLOWED
Figure 14. Bit transfer
SDA
SCL
P
SDA
SCL
S
SW00543
START CONDITION
STOP CONDITION
Figure 15. Definition of start and stop conditions
SDA
SCL
SW00544
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER/
RECEIVER
Figure 16. System configuration
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
10
Acknowledge (see Figure 17)
The number of data bytes transferred between the start and the stop
conditions from transmitter to receiver is not limited. Each byte of
eight bits is followed by one acknowledge bit. The acknowledge bit
is a HIGH level put on the bus by the transmitter whereas the
master generates an extra acknowledge related clock pulse.
A slave receiver which is addressed must generate an acknowledge
after the reception of each byte. Also a master must generate an
acknowledge after the reception of each byte that has been clocked
out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse, so that
the SDA line is stable LOW during the HIGH period of the
acknowledge related clock pulse, set-up and hold times must be
taken into account.
A master receiver must signal an end of data to the transmitter by
not generating an acknowledge on the last byte that has been
clocked out of the slave. In this event the transmitter must leave the
data line HIGH to enable the master to generate a stop condition.
S
9
8
2
1
SW00545
DATA OUTPUT
BY TRANSMITTER
DATA OUTPUT
BY RECEIVER
SCL FROM
MASTER
ACKNOWLEDGE
NOT ACKNOWLEDGE
CLOCK PULSE FOR
ACKNOWLEDGEMENT
START
CONDITION
Figure 17. Acknowledgment on the I
2
C-bus
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
11
TYPICAL APPLICATION
Applications
Board version tracking and configuration
Board health monitoring and status reporting
Multi-card systems in Telecom, Networking, and Base Station
Infrastructure Equipment
Field recall and troubleshooting functions for installed boards
General-purpose integrated I/O with memory
Drop in replacement for PCF8574 with integrated 2-kbit EEPROM
Bus master sees GPIO and EEPROM as two separate devices
Three hardware address pins allow up to 8 PCA9500s to be
located in the same I
2
C/SMBus
CONTROL
EEPROM
GPIO
I
2
C
I
2
C
I
2
C
I
2
C
ASIC
BACKPLANE
CPU
OR
C
I
2
C
MONITORING
AND
CONTROL
INPUTS
ALARM
LEDs
PCA9500
CARD ID, SUBROUTINES, CONFIGURATION DATA, OR REVISION HISTORY
SW02003
UP TO 8 CARDS
CONFIGURATION CONTROL
I
2
C
Figure 18. Typical application
A central processor/controller typically located on the system main
board can use the 400 kHz I
2
C/SMBus to poll the PCA9500 devices
located on the system cards for status or version control type of
information. The PCA9500 may be programmed at manufacturing to
store information regarding board build, firmware version,
manufacturer identification, configuration option data
...
Alternately,
these devices can be used as convenient interface for board
configuration, thereby utilizing the I
2
C/SMBus as an intra-system
communication bus.
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
12
TYPICAL APPLICATION
SW01076
I/0
0
I/0
1
I/0
2
I/0
3
I/0
4
I/0
5
I/0
6
I/0
7
V
DD
V
DD
SCL
SDA
RESET
MASTER
CONTROLLER
GND
SCL
SDA
PCA9500
A2
A1
A0
V
SS
V
DD
SUBSYSTEM 3
(e.g. alarm
system)
SUBSYSTEM 2
(e.g. counter)
SUBSYSTEM 1
(e.g. temp sensor)
INT
V
DD
ALARM
Controlled Switch
(e.g. CBT device)
ENABLE
10 k
10 k
2 k
NOTE: GPIO device address configured as 0100100 for this example
EEPROM device address configured as 1010100 for this example
I/0
0
, I/0
2
, I/0
3
, configured as outputs
I/0
1
, I/0
4
, I/0
5
, configured as inputs
I/0
06
, I/0
7
, are not used and have to be configured as outputs
A
B
10 k
(optional)
Figure 19. Typical application
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
13
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied.
SYMBOL
PARAMETER
MIN
MAX
UNIT
V
CC
Supply voltage
0.5
4.0
V
V
I
Input voltage
V
SS
0.5
5.5
V
I
I
DC input current
20
20
mA
I
O
DC output current
25
25
mA
I
DD
Supply current
100
100
mA
I
SS
Supply current
100
100
mA
P
tot
Total power dissipation
--
400
mW
P
O
Total power dissipation per output
--
100
mW
T
stg
Storage temperature
65
+150
_
C
T
amb
Operating temperature
40
+85
_
C
DC ELECTRICAL CHARACTERISTICS
T
amb
= 40 to +85
_
C unless otherwise specified; V
CC
= 3.3 V
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
Supply
V
DD
Supply voltage
2.5
3.3
3.6
V
I
DDQ
Standby current
A0, A1, A2, WC = HIGH
--
--
60
A
I
DD1
Supply current read
--
--
1
mA
I
DD2
Supply current write
--
--
2
mA
V
POR
Power-on reset voltage
--
--
2.4
V
Input SCL; input, output SDA
V
IL
LOW-level input voltage
0.5
--
0.3V
DD
V
V
IH
HIGH-level input voltage
0.7V
DD
--
5.5
V
I
OL
LOW-level output current
V
OL
= 0.4 V
3
--
--
mA
I
LI
Input leakage current
V
I
= V
DD
or V
SS
1
--
1
A
C
I
Input capacitance
V
I
= V
SS
--
--
7
pF
I/O Expander Port
V
IL
LOW-level input voltage
0.5
--
0.3V
DD
V
V
IH
HIGH-level input voltage
0.7V
DD
--
5.5
V
I
IHL(max)
Input current through protection diodes
400
--
400
A
I
OL
LOW-level output current
V
OL
= 1 V
10
25
--
mA
I
OH
HIGH-level output current
V
OH
= V
ss
30
100
300
A
I
OHt
Transient pull-up current
--
2
--
mA
C
I
Input capacitance
--
--
10
pF
C
O
Output capacitance
--
--
10
pF
Address Inputs (A0, A1, A2), WC input
V
IL
LOW-level input voltage
0.5
--
0.3V
DD
V
V
IH
HIGH-level input voltage
0.7V
DD
--
5.5
V
I
Input leakage current
V
I
= V
DD
1
--
1
A
I
LI
Input leakage (pull-up) current
V
I
= V
SS
10
25
100
A
NOTES:
1. Each I/O must be externally limited to a maximum of 25 mA and the device must be limited to a maximum current of 100 mA.
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
14
NON-VOLATILE STORAGE SPECIFICATIONS
PARAMETER
SPECIFICATION
Memory cell data retention
10 years minimum
Number of memory cell write cycles
100,000 cycles minimum
I
2
C-BUS TIMING CHARACTERISTICS
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
I
2
C-bus timing (see Figure 20; Note 2)
f
SCL
SCL clock frequency
--
--
400
kHz
t
SW
tolerable spike width on bus
--
--
50
ns
t
BUF
bus free time
1.3
--
--
s
t
SU;STA
START condition set-up time
0.6
--
--
s
t
HD;STA
START condition hold time
0.6
--
--
s
t
r
SCL and SDA rise time
--
--
0.3
s
t
f
SCL and SDA fall time
--
--
0.3
s
t
SU;DAT
data set-up time
250
--
--
ns
t
HD;DAT
data hold time
0
--
--
ns
t
VD;DAT
SCL LOW to data out valid
--
--
1.0
s
t
SU;STO
STOP condition set-up time
0.6
--
--
s
NOTE:
2. All the timing values are valid within the operating supply voltage and ambient temperature range and refer to V
IL
and V
IH
with an input
voltage swing of V
SS
to V
DD
.
PORT TIMING CHARACTERISTICS
SYMBOL
PARAMETER
MIN
TYP
MAX
UNIT
t
pv
Output data valid; C
L
100 pF
--
--
4
s
t
ps
Input data setup time; C
L
100 pF
0
--
--
s
t
ph
Input data hold time; C
L
100 pF
4
--
--
s
handbook, full pagewidth
SCL
SDA
MBD820
BIT 0
LSB
(R/W)
t
HD;STA
t
SU;DAT
t
HD;DAT
t
VD;DAT
t
SU;STO
t
f
r
t
t
BUF
t
SU;STA
1 / f
SCL
START
CONDITION
(S)
BIT 7
MSB
(A7)
BIT 6
(A6)
ACKNOWLEDGE
(A)
STOP
CONDITION
(P)
SW00561
PROTOCOL
Figure 20.
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
15
POWER-UP TIMING
SYMBOL
PARAMETER
MAX.
UNIT
t
PUR
1
Power-up to Read Operation
1
ms
t
PUW
1
Power-up to Write Operation
5
ms
NOTE:
1. t
PUR
and t
PUW
are the delays required from the time V
CC
is stable until the specified operation can be initiated. These parameters are
guaranteed by design.
WRITE CYCLE LIMITS
SYMBOL
PARAMETER
MIN.
TYP.
(5)
MAX.
UNIT
t
WR
1
Write Cycle Time
--
5
10
ms
NOTE:
1. t
WR
is the maximum time that the device requires to perform the internal write operation.
Write Cycle Timing
SCL
SDA
8th Bit
Word n
ACK
Stop
Condition
Start
Condition
MEMORY
ADDRESS
t
WR
SW00560
Figure 21.
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
16
TYPICAL PERFORMANCE CURVES
160
120
100
80
60
40
20
0
20
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
T
amb
= 40
C
I
OH
(
A)
V
OH
(V)
SW02351
2.5 V
2.7 V
3.0 V
3.3 V
3.6 V
140
Figure 22. V
OH
versus I
OH
(T
amb
= 40
C)
140
120
100
80
60
40
20
0
20
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
T
amb
= 25
C
I
OH
(
A)
V
OH
(V)
SW02350
2.5 V
2.7 V
3.0 V
3.3 V
3.6 V
Figure 23. V
OH
versus I
OH
(T
amb
= 25
C)
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
17
120
100
80
60
40
20
0
20
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
T
amb
= 85
C
I
OH
(
A)
V
OH
(V)
SW02352
2.5 V
2.7 V
3.0 V
3.3 V
3.6 V
140
Figure 24. V
OH
versus I
OH
(T
amb
= 85
C)
NOTE:
Rapid fall off in V
OH
at current inception is due to a diode that provides 5 V overvoltage protection for the GPIO I/O pins. When the GPIO I/O are
being used as inputs, the internal current source V
OH
should be evaluated to determine if external pull-up resistors are required to provide
sufficient V
IH
threshold noise margin.
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
18
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave
soldering is often preferred when through-hole and surface mounted
components are mixed on one printed-circuit board. However, wave
soldering is not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these situations
reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more
in-depth account of soldering ICs can be found in our
IC Package
Databook (order code 9398 652 90011).
DIP
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260
C;
solder at this temperature must not be in contact with the joint for
more than 5 seconds. The total contact time of successive solder
waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the
temperature of the plastic body must not exceed the specified
maximum storage temperature (T
stg
max). If the printed-circuit board
has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of
the package, below the seating plane or not more than 2 mm above
it. If the temperature of the soldering iron bit is less than 300
C it
may remain in contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
SO and SSOP
Reflow soldering
Reflow soldering techniques are suitable for all SO and SSOP
packages.
Reflow soldering requires solder paste (a suspension of fine solder
particles, flux and binding agent) to be applied to the printed-circuit
board by screen printing, stencilling or pressure-syringe dispensing
before package placement.
Several techniques exist for reflowing; for example, thermal
conduction by heated belt. Dwell times vary between 50 and 300
seconds depending on heating method. Typical reflow temperatures
range from 215 to 250
C.
Preheating is necessary to dry the paste and evaporate the binding
agent. Preheating duration: 45 minutes at 45
C.
Wave soldering
Wave soldering is not recommended for SSOP packages. This is
because of the likelihood of solder bridging due to closely-spaced
leads and the possibility of incomplete solder penetration in
multi-lead devices.
If wave soldering cannot be avoided, the following conditions
must be observed:
A double-wave (a turbulent wave with high upward pressure
followed by a smooth laminar wave) soldering technique
should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow and must incorporate solder
thieves at the downstream end.
Even with these conditions, only consider wave soldering
SSOP packages that have a body width of 4.4 mm, that is
SSOP16 (SOT369-1) or SSOP20 (SOT266-1).
During placement and before soldering, the package must be fixed
with a droplet of adhesive. The adhesive can be applied by screen
printing, pin transfer or syringe dispensing. The package can be
soldered after the adhesive is cured.
Maximum permissible solder temperature is 260
C, and maximum
duration of package immersion in solder is 10 seconds, if cooled to
less than 150
C within 6 seconds. Typical dwell time is 4 seconds
at 250
C.
A mildly-activated flux will eliminate the need for removal of
corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally opposite end
leads. Use only a low voltage soldering iron (less than 24 V) applied
to the flat part of the lead. Contact time must be limited to
10 seconds at up to 300
C. When using a dedicated tool, all other
leads can be soldered in one operation within 2 to 5 seconds
between 270 and 320
C.
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
19
SO16:
plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
20
TSSOP16:
plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
21
HVQFN16:
plastic thermal enhanced very thin quad flat package; no leads; 16 terminals;
body 4 x 4 x 0.85 mm
SOT629-1
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
22
REVISION HISTORY
Rev
Date
Description
_3
20040930
Product data sheet (9397 750 14134). Supersedes data of 2003 Jun 27 (9397 750 11682).
Modifications:
Figure 19: resistor values changed to 10 k
"DC characteristics" table on page : add Table note 1.
Added "Typical performance curves" section
_2
20030627
Product data (9397 750 11682); ECN 853-2369 30018 dated 11 June 2003.
Supersedes data of 2002 September 09 (9397 750 10326).
_1
20020927
Product data (9397 750 10326); ECN: 8532369 28875 (2002 Sep 27)
Philips Semiconductors
Product data sheet
PCA9500
8-bit I
2
C and SMBus I/O port with 2-kbit EEPROM
2004 Sep 30
23
Purchase of Philips I
2
C components conveys a license under the Philips' I
2
C patent
to use the components in the I
2
C system provided the system conforms to the
I
2
C specifications defined by Philips. This specification can be ordered using the
code 9398 393 40011.
Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes -- Philips Semiconductors reserves the right to make changes in the products--including circuits, standard cells, and/or software--described
or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated
via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys
no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent,
copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com.
Koninklijke Philips Electronics N.V. 2004
All rights reserved. Published in the U.S.A.
Date of release: 09-04
Document number:
9397 750 14134
Philips
Semiconductors
Data sheet status
[1]
Objective data sheet
Preliminary data sheet
Product data sheet
Product
status
[2] [3]
Development
Qualification
Production
Definitions
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Level
I
II
III