Philips Semiconductors
Objective specification
PowerMOS transistors
PHX6NA60E
Low capacitance
Avalanche energy rated
FEATURES
SYMBOL
QUICK REFERENCE DATA
Repetitive Avalanche Rated
Fast switching
V
DSS
= 600 V
Low feedback capacitance
Stable off-state characteristics
I
D
= 3.9 A
High thermal cycling performance
Low thermal resistance
R
DS(ON)
1.2
GENERAL DESCRIPTION
PINNING
SOT186A
N-channel,
enhancement
mode
PIN
DESCRIPTION
field-effect
power
transistor,
intended for use in off-line switched
1
gate
mode power supplies, T.V. and
computer monitor power supplies,
2
drain
d.c. to d.c. converters, motor control
circuits
and
general
purpose
3
source
switching applications.
case
isolated
The PHX6NA60E is supplied in the
SOT186A
full
pack,
isolated
package.
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
DSS
Drain-source voltage
T
j
= 25 C to 150C
-
600
V
V
DGR
Drain-gate voltage
T
j
= 25 C to 150C; R
GS
= 20 k
-
600
V
V
GS
Gate-source voltage
-
30
V
I
D
Continuous drain current
T
hs
= 25 C; V
GS
= 10 V
-
3.9
A
T
hs
= 100 C; V
GS
= 10 V
-
2.6
A
I
DM
Pulsed drain current
T
hs
= 25 C
-
26
A
P
D
Total dissipation
T
hs
= 25 C
-
45
W
T
j
, T
stg
Operating junction and
- 55
150
C
storage temperature range
AVALANCHE ENERGY LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
E
AS
Single pulse avalanche
Unclamped inductive load, ID = 6.5A;
-
570
mJ
energy
V
DD
50 V; starting T
j
= 25C; R
GS
= 50
;
V
GS
= 10 V
E
AR
Repetitive avalanche energy
1
-
9.5
mJ
I
AS
, I
AR
Avalanche current
-
6.5
A
d
g
s
1 2 3
case
1 pulse width and repetition rate limited by T
j
max.
January 1998
1
Rev 1.000
Philips Semiconductors
Objective specification
PowerMOS transistors
PHX6NA60E
Low capacitance
Avalanche energy rated
ISOLATION LIMITING VALUE & CHARACTERISTIC
T
hs
= 25 C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
isol
R.M.S. isolation voltage from all
f = 50-60 Hz; sinusoidal
-
2500
V
three terminals to external
waveform;
heatsink
R.H.
65% ; clean and dustfree
C
isol
Capacitance from T2 to external f = 1 MHz
-
10
-
pF
heatsink
THERMAL RESISTANCES
SYMBOL PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
R
th j-hs
Thermal resistance junction
with heatsink compound
-
-
2.78
K/W
to heatsink
R
th j-a
Thermal resistance junction
-
60
-
K/W
to ambient
ELECTRICAL CHARACTERISTICS
T
j
= 25 C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
V
(BR)DSS
Drain-source breakdown
V
GS
= 0 V; I
D
= 0.25 mA
600
-
-
V
voltage
V
(BR)DSS
/ Drain-source breakdown
V
DS
= V
GS
; I
D
= 0.25 mA
-
0.1
-
%/K
T
j
voltage temperature
coefficient
R
DS(ON)
Drain-source on resistance
V
GS
= 10 V; I
D
= 3.25 A
-
-
1.2
V
GS(TO)
Gate threshold voltage
V
DS
= V
GS
; I
D
= 0.25 mA
2.0
3.0
4.0
V
g
fs
Forward transconductance
V
DS
= 30 V; I
D
= 3.25 A
3
4.5
-
S
I
DSS
Drain-source leakage current V
DS
= 600 V; V
GS
= 0 V
-
2
100
A
V
DS
= 480 V; V
GS
= 0 V; T
j
= 125 C
-
50
500
A
I
GSS
Gate-source leakage current V
GS
=
30 V; V
DS
= 0 V
-
10
200
nA
Q
g(tot)
Total gate charge
I
D
= 6.5 A; V
DD
= 480 V; V
GS
= 10 V
-
-
75
nC
Q
gs
Gate-source charge
-
7
-
nC
Q
gd
Gate-drain (Miller) charge
-
23
-
nC
t
d(on)
Turn-on delay time
V
DD
= 300 V; R
D
= 56
;
-
-
50
ns
t
r
Turn-on rise time
R
G
= 9.1
-
-
125
ns
t
d(off)
Turn-off delay time
-
-
110
ns
t
f
Turn-off fall time
-
-
30
ns
L
d
Internal drain inductance
Measured from drain lead to centre of die
-
3.5
-
nH
L
s
Internal source inductance
Measured from source lead to source
-
7.5
-
nH
bond pad
C
iss
Input capacitance
V
GS
= 0 V; V
DS
= 25 V; f = 1 MHz
-
-
1550
pF
C
oss
Output capacitance
-
140
-
pF
C
rss
Feedback capacitance
-
40
-
pF
January 1998
2
Rev 1.000
Philips Semiconductors
Objective specification
PowerMOS transistors
PHX6NA60E
Low capacitance
Avalanche energy rated
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
T
j
= 25 C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
I
S
Continuous source current
T
hs
= 25C
-
-
6.5
A
(body diode)
I
SM
Pulsed source current (body
T
hs
= 25C
-
-
26
A
diode)
V
SD
Diode forward voltage
I
S
= 6.5 A; V
GS
= 0 V
-
-
1.2
V
t
rr
Reverse recovery time
I
S
= 6.5 A; V
GS
= 0 V; dI/dt = 100 A/
s
-
530
-
ns
Q
rr
Reverse recovery charge
-
6.7
-
C
January 1998
3
Rev 1.000
Philips Semiconductors
Objective specification
PowerMOS transistors
PHX6NA60E
Low capacitance
Avalanche energy rated
MECHANICAL DATA
Dimensions in mm
Net Mass: 2 g
Fig.1. SOT186A; The seating plane is electrically isolated from all terminals.
Notes
1. Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent
damage to MOS gate oxide.
2. Refer to mounting instructions for F-pack envelopes.
3. Epoxy meets UL94 V0 at 1/8".
10.3
max
3.2
3.0
4.6
max
2.9 max
2.8
seating
plane
6.4
15.8
max
0.6
2.5
2.54
5.08
1
2
3
3 max.
not tinned
3
0.5
2.5
0.9
0.7
M
0.4
15.8
max.
19
max.
13.5
min.
Recesses (2x)
2.5
0.8 max. depth
1.0 (2x)
1.3
January 1998
4
Rev 1.000
Philips Semiconductors
Objective specification
PowerMOS transistors
PHX6NA60E
Low capacitance
Avalanche energy rated
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
January 1998
5
Rev 1.000
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