Page 0
Version 1.0 July 2002
MR16R1622(4/8/G)DF0
MR18R1622(4/8/G)DF0
Change History
Version 1.0 (July 2002)
* First copy.
* Based on the 1.4 ver. (July 2002) 256/288Mbit A-die RIMM
Module Datasheet
Page 1
Version 1.0 July 2002
MR16R1622(4/8/G)DF0
MR18R1622(4/8/G)DF0
Overview
The RIMM
module is a general purpose high- performance
memory module suitable for use in a broad range of applica-
tions including computer memory, personal computers,
workstations and other applications where high bandwidth
and low latency are required.
The RIMM module consists of 256/288Mb RDRAM
devices. These are extremely high-speed CMOS DRAMs
organized as 16M words by 16 or 18 bits. The use of
Rambus Signaling Level (RSL) technology permits up to
1066 MHz transfer rates while using conventional system
and board design technologies. RDRAM devices are capable
of sustained data transfers at 0.94 ns per two bytes (7.5ns per
16 bytes).
The RDRAM architecture enables the highest sustained
bandwidth for multiple, simultaneous, randomly addressed,
memory transactions. The separate control and data buses
with independent row and column control yield over 95%
bus efficiency. The RDRAM device's 32-bank architecture
supports up to four simultaneous transactions per device.
Features
High speed up to 1066 MHz RDRAM storage
184 edge connector pads with 1mm pad spacing
Module PCB size : 133.35mm x 31.75mm x 1.27mm
(5.25
"
x 1.25
"
x 0.05
"
) - 256Mb and 288Mb base PC800
RIMM Module
Module PCB size : 133.35mm x 34.93mm x 1.27mm
(5.25
"
x 1.375
"
x 0.05
"
) - 256Mb and 288Mb base
PC1066 RIMM Module
Each RDRAM device has 32 banks, for a total of 512, 256,
128, 64 banks on each 512/576MB, 256/288MB,
128/144MB, 64/72MB module respectively
Gold plated edge connector pad contacts
Serial Presence Detect(SPD) support
Operates from a 2.5 volt supply (5%)
Powerdown self refresh modes
Separate Row and Column buses for higher efficiency
WBGA package (92 balls)
Key Timing Parameters/Part Numbers
The following table lists the frequency and latency bins
available for RIMM modules.
Table 1: Part Number by Freq. & Latency
Form Factor
The RIMM modules are offered in 184-pad 1mm edge
connector pad pitch suitable for 184 contact RIMM connec-
tors. Figure 1 below, shows a sixteen device RIMM module.
Organization
Speed
Part Number
Bin
I/O
Freq.
(MHz)
t
RAC
(Row
Access
Time) ns
32M x 16/18
-CT9
1066
32P
MR16/18R1622DF0-CT9
-CN9
1066
32
MR16/18R1622DF0-CN9
-CM9
1066
35
MR16/18R1622DF0-CM9
-CM8
800
40
MR16/18R1622DF0-CM8
-CK8
800
45
MR16/18R1622DF0-CK8
64M x 16/18
-CT9
1066
32P
MR16/18R1624DF0-CT9
-CN9
1066
32
MR16/18R1624DF0-CN9
-CM9
1066
35
MR16/18R1624DF0-CM9
-CM8
800
40
MR16/18R1624DF0-CM8
-CK8
800
45
MR16/18R1624DF0-CK8
128M x 16/18
-CT9
1066
32P
MR16/18R1628DF0-CT9
-CN9
1066
32
MR16/18R1628DF0-CN9
-CM9
1066
35
MR16/18R1628DF0-CM9
-CM8
800
40
MR16/18R1628DF0-CM8
-CK8
800
45
MR16/18R1628DF0-CK8
256M x 16/18
-CT9
1066
32P
MR16/18R162GDF0-CT9
-CN9
1066
32
MR16/18R162GDF0-CN9
-CM9
1066
35
MR16/18R162GDF0-CM9
-CM8
800
40
MR16/18R162GDF0-CM8
-CK8
800
45
MR16/18R162GDF0-CK8
Figure 1: RIMM Module shown with heat spreader removed
Note: On double sided modules, RDRAM devices are also installed on bottom side of PCB.
(16Mx16)*2(4/8/16)pcs RIMM
Module based on 256Mb D-die, 32s banks,16K/32ms Ref, 2.5V
(16Mx18)*2(4/8/16)pcs RIMM
Module based on 288Mb D-die, 32s banks,16K/32ms Ref, 2.5V
Page 2
Version 1.0 July 2002
MR16R1622(4/8/G)DF0
MR18R1622(4/8/G)DF0
Table 2: Module Pad Numbers and Signal Names
Pin
Pin Name
Pin
Pin Name
Pin
Pin Name
Pin
Pin Name
A1
Gnd
B1
Gnd
A47
NC
B47
NC
A2
LDQA8
B2
LDQA7
A48
NC
B48
NC
A3
Gnd
B3
Gnd
A49
NC
B49
NC
A4
LDQA6
B4
LDQA5
A50
NC
B50
NC
A5
Gnd B5
Gnd
A51
Vref
B51
Vref
A6
LDQA4
B6
LDQA3
A52
Gnd
B52
Gnd
A7
Gnd
B7
Gnd
A53
SCL
B53
SA0
A8
LDQA2
B8
LDQA1
A54
Vdd
B54
Vdd
A9
Gnd
B9
Gnd
A55
SDA
B55
SA1
A10
LDQA0
B10
LCFM
A56
SVdd
B56
SVdd
A11
Gnd
B11
Gnd
A57
SWP
B57
SA2
A12
LCTMN
B12
LCFMN
A58
Vdd
B58
Vdd
A13
Gnd
B13
Gnd
A59
RSCK
B59
RCMD
A14
LCTM
B14
NC
A60
Gnd
B60
Gnd
A15
Gnd
B15
Gnd
A61
RDQB7
B61
RDQB8
A16
NC
B16
LROW2
A62
Gnd
B62
Gnd
A17
Gnd
B17
Gnd
A63
RDQB5
B63
RDQB6
A18
LROW1
B18
LROW0
A64
Gnd
B64
Gnd
A19
Gnd
B19
Gnd
A65
RDQB3
B65
RDQB4
A20
LCOL4
B20
LCOL3
A66
Gnd
B66
Gnd
A21
Gnd
B21
Gnd
A67
RDQB1
B67
RDQB2
A22
LCOL2
B22
LCOL1
A68
Gnd
B68
Gnd
A23
Gnd
B23
Gnd
A69
RCOL0
B69
RDQB0
A24
LCOL0
B24
LDQB0
A70
Gnd
B70
Gnd
A25
Gnd
B25
Gnd
A71
RCOL2
B71
RCOL1
A26
LDQB1
B26
LDQB2
A72
Gnd
B72
Gnd
A27
Gnd
B27
Gnd
A73
RCOL4
B73
RCOL3
A28
LDQB3
B28
LDQB4
A74
Gnd
B74
Gnd
A29
Gnd
B29
Gnd
A75
RROW1
B75
RROW0
A30
LDQB5
B30
LDQB6
A76
Gnd
B76
Gnd
A31
Gnd
B31
Gnd
A77
NC
B77
RROW2
A32
LDQB7
B32
LDQB8
A78
Gnd
B78
Gnd
A33
Gnd
B33
Gnd
A79
RCTM
B79
NC
A34
LSCK
B34
LCMD
A80
Gnd
B80
Gnd
A35
Vcmos
B35
Vcmos
A81
RCTMN
B81
RCFMN
A36
SOUT
B36
SIN
A82
Gnd
B82
Gnd
A37
Vcmos
B37
Vcmos
A83
RDQA0
B83
RCFM
A38
NC
B38
NC
A84
Gnd
B84
Gnd
A39
Gnd
B39
Gnd
A85
RDQA2
B85
RDQA1
A40
NC
B40
NC
A86
Gnd
B86
Gnd
A41
Vdd
B41
Vdd
A87
RDQA4
B87
RDQA3
A42
Vdd
B42
Vdd
A88
Gnd
B88
Gnd
A43
NC
B43
NC
A89
RDQA6
B89
RDQA5
A44
NC
B44
NC
A90
Gnd
B90
Gnd
A45
NC
B45
NC
A91
RDQA8
B91
RDQA7
A46
NC
B46
NC
A92
Gnd
B92
Gnd
Page 3
Version 1.0 July 2002
MR16R1622(4/8/G)DF0
MR18R1622(4/8/G)DF0
Table 3: Module Connector Pad Description
Signal
Pins
I/O
Type
Description
Gnd
A1, A3, A5, A7, A9, A11, A13, A15,
A17, A19, A21, A23, A25, A27, A29,
A31, A33, A39, A52, A60, A62, A64,
A66, A68, A70, A72, A74, A76, A78,
A80, A82, A84, A86, A88, A90, A92,
B1, B3, B5, B7, B9, B11, B13, B15,
B17, B19, B21, B23, B25, B27, B29,
B31, B33, B39, B52, B60, B62, B64,
B66, B68, B70, B72, B74, B76, B78,
B80, B82, B84, B86, B88, B90, B92
Ground reference for RDRAM core and interface. 72 PCB
connector pads.
LCFM
B10
I
RSL
Clock from master. Interface clock used for receiving RSL
signals from the Channel. Positive polarity.
LCFMN
B12
I
RSL
Clock from master. Interface clock used for receiving RSL
signals from the Channel. Negative polarity.
LCMD
B34
I
V
CMOS
Serial Command used to read from and write to the control
registers. Also used for power management.
LCOL4..
LCOL0
A20, B20, A22, B22, A24
I
RSL
Column bus. 5-bit bus containing control and address infor-
mation for column accesses.
LCTM
A14
I
RSL
Clock to master. Interface clock used for transmitting RSL
signals to the Channel. Positive polarity.
LCTMN
A12
I
RSL
Clock to master. Interface clock used for transmitting RSL
signals to the Channel. Negative polarity.
LDQA8..
LDQA0
A2, B2, A4, B4, A6, B6, A8, B8, A10
I/O
RSL
Data bus A. A 9-bit bus carrying a byte of read or write data
between the Channel and the RDRAM device. LDQA8 is
non-functional on modules with x16 RDRAM devices
LDQB8..
LDQB0
B32, A32, B30, A30, B28, A28, B26,
A26, B24
I/O
RSL
Data bus B. A 9-bit bus carrying a byte of read or write data
between the Channel and the RDRAM device. LDQB8 is non-
functional on modules with x16 RDRAM devices.
LROW2..
LROW0
B16, A18, B18
I
RSL
Row bus. 3-bit bus containing control and address information
for row accesses.
LSCK
A34
I
V
CMOS
Serial Clock input. Clock source used to read from and write
to the RDRAM control registers.
NC
A16, B14, A38, B38, A40, B40, A43,
B43, A44, B44, A45, B45, A46, B46,
A47, B47, A48, B48, A49, B49, A50,
B50, A77, B79
These pads are not connected. These 24 connector pads are
reserved for future use.
RCFM
B83
I
RSL
Clock from master. Interface clock used for receiving RSL
signals from the Channel. Positive polarity.
RCFMN
B81
I
RSL
Clock from master. Interface clock used for receiving RSL
signals from the Channel. Negative polarity.
RCMD
B59
I
V
CMOS
Serial Command Input. Pin used to read from and write to the
control registers. Also used for power management.
Page 4
Version 1.0 July 2002
MR16R1622(4/8/G)DF0
MR18R1622(4/8/G)DF0
RCOL4..
RCOL0
A73, B73, A71, B71, A69
I
RSL
Column bus. 5-bit bus containing control and address infor-
mation for column accesses.
RCTM
A79
I
RSL
Clock to master. Interface clock used for transmitting RSL
signals to the Channel. Positive polarity.
RCTMN
A81
I
RSL
Clock to master. Interface clock used for transmitting RSL
signals to the Channel. Negative polarity.
RDQA8..
RDQA0
A91, B91, A89, B89, A87, B87, A85,
B85, A83
I/O
RSL
Data bus A. A 9-bit bus carrying a byte of read or write data
between the Channel and the RDRAM device. RDQA8 is
non-functional on modules x16 RDRAM devices.
RDQB8..
RDQB0
B61, A61, B63, A63, B65, A65, B67,
A67, B69
I/O
RSL
Data bus B. A 9-bit bus carrying a byte of read or write data
between the Channel and the RDRAM device. RDQB8 is
non-functional on modules x16 RDRAM devices.
RROW2..
RROW0
B77, A75, B75
I
RSL
Row bus. 3-bit bus containing control and address information
for row accesses.
RSCK
A59
I
V
CMOS
Serial Clock input. Clock source used to read from and write
to the RDRAM control registers.
SA0
B53
I
SV
DD
Serial Presence Detect Address 0.
SA1
B55
I
SV
DD
Serial Presence Detect Address 1.
SA2
B57
I
SV
DD
Serial Presence Detect Address 2.
SCL
A53
I
SV
DD
Serial Presence Detect Clock.
SDA
A55
I/O
SV
DD
Serial Presence Detect Data (Open Collector I/O).
SIN
B36
I/O
V
CMOS
Serial I/O for reading from and writing to the control registers.
Attaches to SIO0 of the first RDRAM device on the module.
SOUT
A36
I/O
V
CMOS
Serial I/O for reading from and writing to the control registers.
Attaches to SIO1 of the last RDRAM device on the module.
SV
DD
A56, B56
SPD Voltage. Used for signals SCL, SDA, SWE, SA0, SA1
and SA2.
SWP
A57
I
SV
DD
Serial Presence Detect Write Protect (active high). When low,
the SPD can be written as well as read.
V
CMOS
A35, B35, A37, B37
CMOS I/O Voltage. Used for signals CMD, SCK, SIN, SOUT.
Vdd
A41, A42, A54, A58, B41, B42, B54,
B58
Supply voltage for the RDRAM core and interface logic.
Vref
A51, B51
Logic threshold reference voltage for RSL signals.
Signal
Pins
I/O
Type
Description
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