3918-pixel CCD Linear Image Sensor (B/W)
Description
The ILX514 is a reduction type CCD linear sensor
developed for high resolution facsimiles and copiers.
This sensor reads A4-size documents at a density of
400 DPI (Dot Per Inch). A built-in timing generator
and clock-drivers ensure direct drive at 5V logic for
easy use. In addition, reset pulse can be switched
between internal generation and external input.
Features
Number of effective pixels: 3918 pixels
Pixel size: 7m
7m (7m pitch)
Built-in timing generator and clock-drivers
Ultra low lag/ultra high sensitivity/low dark output
Single output method
Maximum clock frequency: 5MHz
Absolute Maximum Ratings
Supply voltage
V
DD1
11
V
V
DD2
6
V
Operating temperature
10 to +60
C
Storage temperature
30 to +80
C
Pin Configuration (Top View)
1
E93302C78-PS
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
ILX514
22 pin DIP (Cer-DIP)
1
NC
2
GND
3
GND
4
RSSW
5
CLK
6
V
DD1
7
NC
8
NC
9
10
NC
11
ROG
12
NC
22
21
20
19
18
17
16
15
14
13
NC
V
DD1
RS/SH
GND
GND
V
DD1
GND
NC
1
3918
V
OUT
V
DD2
V
DD1
For the availability of this product, please contact the sales office.
2
ILX514
Block Diagram
V
OUT
GND
GND
RS/SH
CLK
V
DD1
V
DD2
NC
NC
NC
V
DD1
RSSW
NC
GND
GND
V
DD1
GND
NC
2
3
4
5
7
8
9
10
11
12
13
14
15
16
17
20
22
Read out gate
CCD analog shift register
Clock-drivers
Clock pulse generator
Sample-and-hold pulse generator
Mode
selector
Read out gate
pulse generator
Output amplifier
Sample-and-hold circuit
Feed through
suppression circuit
.
D116
D99
S3918
S3917
S2
S1
D98
D18
D17
18
19
21
CCD analog shift register
Read out gate
Clock-drivers
6
ROG
1
NC
NC
V
DD1
3
ILX514
Pin Description
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Symbol
NC
GND
V
DD1
V
OUT
GND
ROG
NC
V
DD2
RSSW
1
NC
NC
NC
NC
GND
GND
NC
GND
V
DD1
V
DD1
RS/SH
1
V
DD1
CLK
Description
NC
GND
9V power supply
Signal output
GND
Clock pulse
NC
5V power supply
Reset pulse swithover pin
NC
NC
NC
NC
GND
GND
NC
GND
9V power supply
9V power supply
Clock pulse or with S/H; without S/H switch
9V power supply
Clock pulse
1
Output mode is changeable as follows.
GND
V
DD1
GND
Internal RS
without S/H
--
V
DD1
Internal RS
with S/H
--
RS
--
External RS
without S/H
9pin
20pin
4
ILX514
Item
V
DD1
V
DD2
Min.
8.5
4.75
Typ.
9.0
5.0
Max.
9.5
5.25
Unit
V
V
Recommended Voltage
Note) Rules for raising and lowering power supply voltage
To raise power supply voltage, first raise V
DD1
(9V) and then V
DD2
(5V).
To lower voltage, first lower V
DD2
(5V) and then V
DD1
(9V).
Item
Input capacity of
CLK pin
Input capacity of
ROG pin
Input capacity of RS/SH pin
Frequency of
CLK
Frequency of
RS
Min.
--
--
--
--
--
Typ.
10
10
10
1
1
Max.
--
--
--
5
5
Unit
pF
pF
pF
MHz
MHz
Symbol
C
CLK
C
ROG
C
RS/SH
f
CLK
f
RS
Clock Characteristics
5
ILX514
Item
Sensitivity 1
Sensitivity 2
Sensitivity nonuniformity
Saturation output voltage
Saturation exposure
Even and odd black level DC difference
Dark voltage average
Dark signal nonuniformity
Image lag
9V supply current
5V supply current
Total transfer efficiency
Output impedance
Offset level
Dynamic range
Min.
7.5
--
--
1.0
0.072
--
--
--
--
--
--
92
--
--
500
Typ.
10.8
24.6
4
1.5
0.139
1.0
0.3
0.6
0.02
16
2.1
98
600
3.0
5000
Max.
13.9
--
10
--
--
10
2
3
--
32
5.0
--
--
--
--
Unit
V/(lx s)
V/(lx s)
%
V
lx s
mV
mV
mV
%
mA
mA
%
V
--
Remarks
Note 2
Note 3
Note 4
Note 5
Note 6
Note 7
Note 8
Note 9
Note 10
--
--
--
--
Note 11
Note 12
Symbol
R1
R2
PRNU
V
SAT
SE
V
V
DRK
DSNU
IL
I
VDD1
I
VDD2
TTE
Z
O
V
OS
DR
Electro-optical Characteristics (Note 1)
(Ta = 25C, V
DD1
= 9V, V
DD2
= 5V,
CLK = 1MHz, Internal
RS mode without S/H,
Light source = 3200K, IR cut filter, CM-500S (t = 1.0mm))
Notes)
1) In accordance with the given electrooptical characteristics, the even black level is defined as the mean
value of D8, D10, D12 and D14.
The odd black level is defined as the mean value of D7 , D9, D11 and D13.
2) For the sensitivity test light is applied with a uniform intensity of illumination.
3) W lamp (2854K)
4) PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2.
PRNU =
100 [%]
Where the 3918 pixels are divided into blocks of 98, even and odd pixels, respectively (Even and odd last
blocks are 97). The maximum output of each block is set to V
MAX
, the minimum output to V
MIN
and the
average output to V
AVE
.
5) Use below the minimum value of the saturation output voltage.
6) Saturation exposure is defined as follows.
SE =
7) Indicates the DC difference in value between odd black level and even black level.
8) Optical signal accumulated time
int stands at 10ms.
(V
MAX
V
MIN
)/2
V
AVE
V
SAT
R1
6
ILX514
9) The difference between the maximum and mean values of the dark output voltage is calculated for even
and odd respectively. The larger value is defined as the dark signal nonuniformity.
Optical signal accumulated time
int stands at 10ms.
10) V
OUT
= 500mV (Typ.)
11) Vos is defined as indicated below.
12) Dynamic range is defined as follows.
DR =
When optical accumulated time is shorter, the dynamic range gets wider because dark voltage is in
proportion to optical accumulated time.
V
SAT
V
DRK
Vout
GND
V
OS
7
ILX514
Application Circuit
When noise influence into output signal is large, connect pins indicated by (A) to the analog power supply and
pins indicated by (D) to the digital power supply, and also use a decoupling capacitor of large capacitance.
1
2
3
4
5
6
7
8
9
10
11
12
22
21
20
19
18
17
16
15
14
13
(A)
GND
CLK
(A)
V
OUT
(D)
V
DD2
ROG
NC
NC
RS/SH
(D)
GND
(D)
9V
5V
ROG
10
/10V
0.01
Output signal
1k
10
/16V
0.01
2SA1175
V
DD1
(D)
V
DD1
(A)
V
DD1
(A)
GND
(D)
GND
NC
NC
(A)
GND
NC
(D)
RSSW
NC
(A)
V
DD1
NC
RS
CLK
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
This application circuit shows when
RS is used externally.
(
)
8
ILX514
Clock Timing Diagram
ROG
CLK
VOUT
5
0
5
0
1
2
3
4
4034
1
2
D2
D1
D3
D4
D5
D6
D16
D17
D18
D19
D20
D96
D97
D98
S1
S2
S3
S4
S3915
S3916
S3917
S3918
D99
D100
D106
D107
D108
D109
1-line output period (4034 pixels)
Dummy signal (98 pixels)
Effective picture
elements signal
(3918 pixels)
Dummy signal
(18 pixels)
Optical black
(80 pixels)
RS
5
0
D116
This clock timing diagram shows when
RS is used externally.
9
ILX514
Clock Pulse Waveform Conditions
CLK,
ROG pulse related
Internal
RS mode
External
RS mode
t8
CLK
t9
t2
t1
t3
ROG
t8
t9
t4
t5
t10
t10
t11
CLK
Vout
t4
t5
CLK
t8
t9
t7
t6
RS
t10
t12
t13
10
ILX514
1
Recommended condition during
CLK = 1MHz.
Unit
ns
ns
ns
ns
ns
ns
ns
ns
V
V
ns
ns
ns
ns
Item
ROG,
CLK pulse timing
ROG,
CLK pulse timing
ROG pulse high level period
CLK pulse high level period
CLK pulse low level period
RS pulse low level period
CLK,
RS pulse timing
Input clock pulse rise/fall time
Input clock pulse voltage
Signal output delay time
High level
Low level
Internal
RS
External
RS
Max.
--
--
--
--
--
--
t1 + t2
10
5.5
0.5
--
--
--
--
Typ.
200
1000
1000
500
1
500
1
100
1
550
1
5
5.0
--
110
65
40
75
Min.
100
800
800
100
100
40
100
--
4.5
0
--
--
--
--
Symbol
t1
t3
t2
t4
t5
t6
t7
t8, t9
V
CLK
, V
ROG
V
RS
t10
t11
t12
t13
11
ILX514
0
0.2
0.4
0.6
0.8
1.0
0
MTF
MTF of main scanning direction (Standard characteristics)
Normalized spatial frequency
0.2
0.4
0.6
0.8
1.0
0
Spatial frequency [cycles/mm]
14.3
28.6
42.9
57.1
71.4
Spectral sensitivity characteristics
(Standard characteristics)
400
500
600
700
800
900
1000
Wavelength [nm]
0.2
0.4
0.6
0.8
1.0
0
Relative sensitivity
1
0.5
1
0.1
Output voltage rate
Integration time output voltage characteristics
(Standard characteristics)
int Integration time [ms]
10
5
0
0.5
1
5
10
0.1
Output voltage rate
Dark signal output temperature characteristics
(Standard characteristics)
Ta Ambient temperature [C]
10
20
30
40
60
50
Example of Representative Characteristics (V
DD1
= 9V, V
DD2
= 5V, Ta = 25C)
12
ILX514
0
5
10
15
0
IV
DD1
V
DD1
supply current [mA]
Operational frequency characteristics of the V
DD1
supply current (Standard characteristics)
f
CLK
CLK clock frequency [MHz]
1
2
3
5
4
0
10
0
IV
DD2
V
DD2
supply current [mA]
Operational frequency characteristics of the V
DD2
supply current (Standard characteristics)
f
CLK
CLK clock frequency [MHz]
1
2
3
5
4
20
1
2
3
0
Vos Offset level [V]
Offset level vs. V
DD2
characteristics
(Standard characteristics)
V
DD2
[V]
4.75
5
5.25
5
4
6
Ta = 25C
0.14
Vos
V
DD2
1
2
3
0
Vos Offset level [V]
Offset level vs. V
DD1
characteristics
(Standard characteristics)
V
DD1
[V]
8.5
9
9.5
5
4
6
Ta = 25C
0.35
Vos
V
DD1
1
2
3
0
Vos Offset level [V]
Offset level vs. Temperature characteristics
(Standard characteristics)
Ta Ambient temperature [C]
20
40
60
5
4
6
Vos
Ta
0
30
50
10
0.8mV/C
13
ILX514
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
2) Regulation for raising and lowering the power supply voltage
When raising the supply voltage, first raise V
DD1
(9V) and then V
DD2
(5V).
Similarly, lower V
DD2
(5V) first and then V
DD1
(9V).
3) Notes on handling CCD Cer-DIP Packages
The following points should be observed when handling and installing cer-DIP packages.
a) Remain within the following limits when applying a static load to the ceramic portion of the package:
(1) Compressive strength: 39N/surface (Do not apply any load more than 0.7mm inside the outer perimeter
of the glass portion.)
(2) Shearing strength:
29N/surface
(3) Tensile strength:
29N/surface
(4) Torsional strength:
0.9Nm
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the glass to crack: because the upper and lower ceramic
layers are shielded by low-melting glass,
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Applying a load or impact to a limited portion of the low-melting glass with a small-tipped tool such as
tweezers.
(5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass.
Note that the preceding notes should also be observed when removing a component from a board after it
has already been soldered.
29N
29N
0.9Nm
(2)
(3)
(4)
39N
Low-melting glass
(1)
Upper ceramic layer
Lower ceramic layer
14
ILX514
4) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W
soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an image sensor, do not use a solder suction equipment.
When using an electric desoldering tool, ground the controller. For the control system, use a zero cross
type.
5) Dust and dirt protection
a) Operate in clean environments.
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the grease stained.
Be careful not to scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
6) Exposure to high temperatures or humidity will affect the characteristics.
Accordingly avoid storage or usage in such conditions.
7) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
15
ILX514
Package Outline
Unit: mm
PACKAGE STRUCTURE
V
H
8.19
0.8
22
27.426 (7
m
3918Pixels)
41.6
0.5
1
11
12
No.1 Pixel
40.2
5.0 0.5
4.0 0.5
2.54
0.51
3.65
4.45 0.5
0.25
0 to 9
10.16
10.0 0.5
9.0
0.3
1.
The height from the bottom to the sensor surface is 2.45
0.3mm.
2.
The thickness of the cover glass is 0.8mm, and the refractive index is 1.5.
22pin DIP (400mil)
(AT STAND OFF)
M
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
Cer-DIP
TIN PLATING
42 ALLOY
5.2g
PDF 
ZIP