1/2
DATA BRIEFING
September 2001
This is Brief Data from STMicroelectronics. Details are subject to change without notice. For complete data, please contact
your nearest Sales Office or SmartCard Products Divison, Rousset, France. Fax: (+33) 4 42 68 87 29.
SMARTCARD MCU
Ordering Information
For Package And Delivery
INTRODUCTION
The manufacturing process of Smartcards in-
volves various components and technologies in
order to issue a finished product:
micromodules,
flat packages,
wafers.
s
MICROMODULES
Dedicated package for Smartcard products, the
micromodule type depends on the size of the
product and on the application.
Table 1 lists all available micromodules.
s
FLAT PACKAGES
For applications which require surface mount tech-
nology, suitable for PC cards, or other security
modules, STMicroelectronics offers flat packages
listed In Table 2.
s
WAFERS
For issuer production need, ST offers sawn and
unsawn wafers deliveries, listed in Table 3.
Figure 1. Delivery form
Table 1. Micromodules in super 35 standard
tape
Table 2. Flat Packages
Table 3. Wafers
4
4
4
4
SO20
261a.ai
8" Wafer
Micromodule
Notch
Type
Description
D1, D2
8 contacts for memory cards
D15
6 contacts for memory cards
D3, D4
8 contacts with ring MCU cards
D5
8 contacts for dual contact contactless
MCU cards
D68
8 contacts for MCU cards
D7
6 contacts for dual contact contactless
MCU cards
C7
Full contactless for MCU cards
D8
8 contacts for MCU cards
Type
Description
O20
SO20 for MCU products
QF4
TQFP44 for MCU products
R20
SO20 on tape and reel for MCU products
Type
Description
W00
Unsawn wafers, 750 m thickness
W20
Unsawn wafers, 275 m thickness
W40
Unsawn wafers, 180 m thickness
S2x
280 m sawn wafers on UV tape
R4x
180 m sawn wafers on insolated UV tape
S4x
180 m sawn wafers on UV tape
T4x
180 m sawn wafers on blue tape
SMARTCARD MCU
2/2
Table 4. Ordering Information Scheme
Note: *where "y" indicates the sawing orientation as shown in Figure 2
Figure 2. Sawing orientation
Sawn wafers are scribed and mounted in a frame
on adhesive tape. The orientation is defined by the
position of the GND pad on the die, viewed with
active area of product visible, relative to the notch-
es of the frame (as shown in Figure 2). The orien-
tation of the die with respect to the plastic frame
notches is specified by the Customer.
One further concern, when specifying devices to
be delivered in this form, is that wafers mounted
on adhesive tape must be used within a limited pe-
riod from the mounting date:
two months, if wafers are stored at 25C, 55%
relative humidity
six months, if wafers are stored at 4C, 55% rel-
ative humidity
Example:
ST19SF08C
D45
XXX
Z
Product name
Pre-personalization name
"+" if no pre-personalization
Delivery Form
Customer ROM code name
Dxx: Module contact or dual
Cxx: Contactless modules
Oxx: SO package
Wxx: Unsawn wafer
Sxy*: Sawn wafer (std UV tape)
Rxy*: Sawn wafer (insolated UV tape) or SO on tape and reel
AI02171
1
ORIENTATION
GND
GND
GND
GND
2
3
4
VIEW: WAFER FRONT SIDE
PDF 
ZIP