TORX141
2001-10-03
1
FIBER OPTIC RECEIVING MODULE
TORX141
Fiber Optic Receiving Module for Digital
Audio Interface
Conform to JEITA standard CP-1201 (for digital
audio interface including fiber optic
inter-connections).
A self-tapping hole for easy attachment to the panel
of audio equipment.
Maximum Ratings
(Ta
=
=
=
=
25C)
Characteristics Symbol
Rating
Unit
Storage temperature
T
stg
-40 to 70
C
Operating temperature
T
opr
-20 to 70
C
Supply voltage
V
CC
-0.5 to 4.5
V
High level output current
I
OH
-2 mA
Low level output current
I
OL
2
mA
Soldering temperature
T
sol
260
(Note 1)
C
Note 1: Soldering time <
= 10 seconds. (More than 1 mm apart from package)
Recommended Operating Conditions
Characteristics Symbol
Min
Typ.
Max
Unit
Supply voltage
V
CC
2.7 3.0 3.6 V
Unit: mm
TORX141
2001-10-03
2
Electrical and Optical Characteristics
(Ta
=
=
=
=
25C, V
CC
=
=
=
=
3 V)
Characteristics Symbol
Test
Condition
Min
Typ.
Max
Unit
Data rate
NRZ code
(Note 2)
0.1
15 Mb/s
Transmission distance
Using APF
(Note 3)
0.2
10 m
Pulse width distortion
(Note 4)
Dt
w
Pulse Width 67 ns
Pulse Cycle 134 ns
CL
= 10 pF
Using TOTX141
-20
20 ns
Maximum receivable power
(Note 5)
P
MAX
15 Mb/s, Using APF
-14.5
dBm
Minimum receivable power
(Note 5)
P
MIN
15 Mb/s, Using APF
-27
dBm
Current consumption
I
CC
10 15 mA
High level output voltage
V
OH
2.1 2.5
V
Low level output voltage
V
OL
0.2 0.4 V
Note 2: High level output when optical flux is received. Low level output when optical flux is not received.
The duty factor must be kept 25 to 75%.
Note 3: All Plastic Fiber (970/1000
mm).
Note 4: Between input of TOTX141 and output of TORX141.
Note 5: BER <
= 10
-9
, peak value.
Mechanical Characteristics
(Ta
=
=
=
=
25C)
Characteristics Test
Condition
Min
Typ.
Max
Unit
Mating force
Using TOCP172, Initial value
39.2
N
Unmating force
Using TOCP172, Initial value
5.9
39.2
N
Torque for self
-tap Using
self
-tapping screw (M3 8)
58.8
98 Ncm
Application Circuit
Applicable Optical Fiber with Fiber Optic Connectors
TOCP172-B
2
Fiber optic connector insertion side
1
3
Fiber optic
receiving
module
0.1
mF
47
mH
Less than 7 mm
Output
GND
(Bottom View)
V
CC
TORX141
2001-10-03
3
Board Layout Hole Pattern
(for reference)
Unit: mm
Tolerance: 0.1 mm
Recommended PCB thickness: 1.6 mm
Precautions During Use
(1) Maximum
rating
The maximum ratings are the limit values which must not be exceeded during operation of device. None of
these rating value must not be exceeded. If the maximum rating value is exceeded, the characteristics of
devices may never be restored properly. In some extreme cases, the device may be permanently damages.
(2) Soldering
Optical modules are comprised of internal semiconductor devices. However, in principle, optical modules
are optical components. During soldering, ensure that flux does not contact with the emitting surface or
the detecting surface. Also ensure that proper flux removal is conducted after soldering.
Some optical modules come with a protective cap. The protective cap is used to avoid malfunction when the
optical module is not in use. Note that it is not dust or waterproof.
As mentioned before, optical modules are optical components. Thus, in principle, soldering where there
may be flux residue and flux removal after soldering is not recommended. Toshiba recommend that
soldering be performed without the optical module mounted on the board. Then, after the board has been
cleaned, the optical module should be soldered on to the board manually.
If the optical module cannot be soldered manually, use non-halogen (chlorine-free) flux and make sure,
without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the effects of
flux. In such a cases, be sure to check the devices' reliability.
(3) Noise
resistance
It is believed that the use of optical transfer devices improve noise resistance. In theory, optical fiber is not
affected by noise at all. However, receiving modules which handle signals whose level is extremely small,
are susceptible to noise.
TOSLINK improve noise resistance to use a conductive case. However, the current signal output by the
optical receiving modules' photodiode is extremely small. Thus, in some environments, shielding the case
may not achieve sufficient noise resistance.
For systems which incorporate TOSLINK, Toshiba recommend testing using the actual device to check its
noise resistance.
Use a simple noise filter on TOSLINK fiber optic transceiving module's power line. If the ripple in the
power supply used is significant, reinforce the filter.
The optical module is to be used in an area which is susceptible to radiated noise, increase the shielding by
covering the optical module and the power line filter with a metallic cover.
(4) Vibration and shock
This module is plastic sealed and has its wire fixed by resin. This structure is relatively resistant to
vibration and shock. In actual equipment, there are sometime cases in which vibration, shock, or stress is
applied to soldered parts or connected parts, resulting in lines cut. A care must be taken in the design of
equipment which will be subject to high levels of vibration.
(5) Support
pins
The TORX141 has support pins in order to fix itself to the PCB temporary. Please make the hole for these
pins in the PCB under the condition for described in board layout hole pattern.
2
- f3.3
7.
62
2.
54
0.
05
3.81
2.
54
0.
05
3
- f0.8
TORX141
2001-10-03
4
(6) Panel
attachment
TORX141 has hole for panel attachment. Please be sure to attach it to panel with self-tapping screw.
(7) Solvent
When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to pour
solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off using
cotton tips.
(8) Protective
cap
When the TORX141 is not in use, attach the protective cap.
(9) Supply
voltage
Use the supply voltage within the recommended operating condition (V
CC
= 2.7 to 3.6 V). Make sure that
supply voltage does not exceed the maximum rating value of 4.5 V, even for an instant.
(10) Interface
The TORX141 has a TTL interface. It can be interfaced with any TTL-compatible C-MOS IC.
(11) Output
If the receiver output is at low and is connected to the power supply, or if the output is high and is
connected to GND, the internal IC may be destroyed.
(12) Soldering condition
Solder at 260C or less for no more than ten seconds.
(13) Precautions when disposing of devices and packing materials.
When disposing devices and packing materials, follow the procedures stipulated by local regulations in
order to protect the environment against contamination.
(14) Precautions during use
Toshiba is continually working to improve the quality and the reliability of their products. Nevertheless,
semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and
their vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Toshiba products,
to observe standards of safety, and to avoid situations in which the malfunction or failure of a Toshiba
product could cause loss of human life, bodily injury or damage to property.
When developing equipment, please ensure that Toshiba products are used within the specified operating
ranges set forth in the most recent product specifications. Also, please keep in mind the precautions and
conditions set forth in the Toshiba Semiconductor Reliability Handbook.
TORX141
2001-10-03
5
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability
Handbook" etc..
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer's own risk.
Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes
are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the
products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with
domestic garbage.
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
The information contained herein is subject to change without notice.
000707EAC
RESTRICTIONS ON PRODUCT USE
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