RGP30A thru RGP30M
Vishay Semiconductors
formerly General Semiconductor
Document Number 88704
www.vishay.com
18-Nov-02
1
Glass Passivated Junction
Fast Switching Rectifier
Reverse Voltage 50 to 1000V
Forward Current 3.0A
Maximum Ratings & Thermal Characteristics
Ratings at 25C ambient temperature unless otherwise specified.
RGP
RGP
RGP
RGP
RGP
RGP
RGP
Parameter
Symbol
30A
30B
30D
30G
30J
30K
30M
Unit
Maximum repetitive peak reverse voltage
V
RRM
50
100
200
400
600
800
1000
V
Maximum RMS voltage
V
RMS
35
70
140
280
420
560
700
V
Maximum DC blocking voltage
V
DC
50
100
200
400
600
800
1000
V
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
= 55C
I
F(AV)
3.0
A
Peak forward surge current
8.3ms single half sine-wave superimposed
I
FSM
125
A
on rated load (JEDEC Method)
Maximum full load reverse current, full cycle
average 0.375" (9.5mm) lead length at T
A
= 55C
I
R(AV)
100
A
Typical thermal resistance
(1)
R
JA
20
C/W
Operating junction and storage temperature range
T
J
,T
STG
65 to +175
C
Electrical Characteristics
Ratings at 25C ambient temperature unless otherwise specified.
Maximum instantaneous forward voltage at 3.0A
V
F
1.3
V
Maximum DC reverse current
T
A
= 25C
5.0
at rated DC blocking voltage
T
A
= 125C
I
R
100
A
Maximum reverse recovery time
I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A
t
rr
150
250
500
ns
Typical junction capacitance at 4.0V, 1MHz
C
J
60
pF
Notes: (1) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
Patented*
DO-201AD
Features
Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
Cavity-free glass passivated junction
Capable of meeting environmental standards of
MIL-S-19500
High temperature metallurgically bonded construction
3.0 Ampere operation at T
A
=55C with no thermal runaway
Typical I
R
less < 0.2
A Fast switching for high efficiency
High temperature soldering guaranteed: 350C/10 seconds,
0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Mechanical Data
Case: JEDEC DO-201AD, molded plastic over glass body
Terminals: Plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.04 oz., 1.12 g
Packaging codes/options:
1/Bulk - 1.5K per container, 15K per box
4/1.4K per 13" reel, 5.6K per box
23/1K per Ammo. mag., 9K per box
0.210 (5.3)
0.190 (4.8)
Dia.
0.052 (1.32)
0.048 (1.22)
Dia.
1.0 (25.4)
Min.
0.375 (9.5)
0.285 (7.2)
1.0 (25.4)
Min.
*
Glass-plastic encap-
sulation technique is
covered by
Patent No. 3,996,602,
and brazed-lead
assembly by Patent
No. 3,930,306
Dimensions in
inches and
(millimeters)
RGP30A thru RGP30M
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com
Document Number 88704
2
18-Nov-02
Ambient Temperature (
C)
Fig. 1 -- Forward Current
Derating Curve
A
verage Forward Rectified Current (A)
Fig. 3 -- Typical Instantaneous
Forward Characteristics
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Reverse Leakage
Current (
A)
Fig. 4 -- Typical Reverse
Characteristics
Number of Cycles at 60 H
Z
Fig. 2 -- Maximum Non-Repetitive
Peak Forward Surge Current
Peak Forward Surge Current (A)
Reverse Voltage (V)
Junction Capacitance (pF)
Fig. 5 -- Typical Junction
Capacitance
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.01
0.1
1
10
T
J
= 25
C
Pulse Width = 300
s
1% Duty Cycle
0
25
50
75
100
125
150
175
0
1.0
2.0
3.0
4.0
Resistive or Inductive Load
0.375" (9.5mm) Lead Length
1
10
100
10
100
200
T
J
= T
J
max.
8.3ms Single Half Sine-Wave
(JEDEC Method)
0
20
40
60
80
100
0.01
0.1
1
10
20
10
100
1
10
100
T
J
= 25
C
f = 1.0MH
Z
Vsig = 50mVp-p
T
J
= 25
C
T
J
= 75
C
T
J
= 125
C
T
J
= 100
C
Ratings and
Characteristic Curves
(T
A
= 25C unless otherwise noted)
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